SLVSC40H June   2013  – May 2020 DRV8711

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Device Images
      1.      Simplified Schematic
  4. Revision History
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 SPI Timing Requirements
    7. 6.7 Indexer Timing Requirements
    8. 6.8 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  PWM Motor Drivers
      2. 7.3.2  Direct PWM Input Mode
      3. 7.3.3  Microstepping Indexer
      4. 7.3.4  Current Regulation
      5. 7.3.5  Decay Modes
      6. 7.3.6  Blanking Time
      7. 7.3.7  Predrivers
      8. 7.3.8  Configuring Predrivers
      9. 7.3.9  External FET Selection
      10. 7.3.10 Stall Detection
        1. 7.3.10.1 Internal Stall Detection
        2. 7.3.10.2 External Stall Detection
      11. 7.3.11 Protection Circuits
        1. 7.3.11.1 Overcurrent Protection (OCP)
        2. 7.3.11.2 Predriver Fault
        3. 7.3.11.3 Thermal Shutdown (TSD)
        4. 7.3.11.4 Undervoltage Lockout (UVLO)
    4. 7.4 Device Functional Modes
      1. 7.4.1 RESET and SLEEPn Operation
      2. 7.4.2 Microstepping Drive Current
    5. 7.5 Programming
      1. 7.5.1 Serial Data Format
    6. 7.6 Register Maps
      1. 7.6.1 Control Registers
      2. 7.6.2 CTRL Register (Address = 0x00)
      3. 7.6.3 TORQUE Register (Address = 0x01)
      4. 7.6.4 OFF Register (Address = 0x02)
      5. 7.6.5 BLANK Register (Address = 0x03)
      6. 7.6.6 DECAY Register (Address = 0x04)
      7. 7.6.7 STALL Register (Address = 0x05)
      8. 7.6.8 DRIVE Register (Address = 0x06)
      9. 7.6.9 STATUS Register (Address = 0x07)
  8. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Sense Resistor
      2. 8.1.2 Optional Series Gate Resistor
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Set Step Rate
        2. 8.2.2.2 Calculate Current Regulation
        3. 8.2.2.3 Support External FETs
        4. 8.2.2.4 Pick Decay Mode
        5. 8.2.2.5 Config Stall Detection
        6. 8.2.2.6 Application Curves
  9. Power Supply Recommendations
    1. 9.1 Bulk Capacitance
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Blanking Time

After the current is enabled in an H-bridge, the voltage on the ISEN pin is ignored for a period of time before enabling the current sense circuitry. This blanking time is adjustable from 1 µS to 5.12 µs, in 20 ns increments, by setting the TBLANK bits in the BLANK register. Note that the blanking time also sets the minimum on time of the PWM.

The same blanking time is applied to the fast decay period in auto decay mode. The PWM will ignore any transitions on Itrip after entering fast decay mode, until the blanking time has expired.

To provide better current control at very low current steps, an adaptive blanking time mode can be enabled by setting the ABT bit in the BLANK register. If ABT is set, at current levels below 30% of full scale current (as determined by the step table), the blanking time (so also the minimum on time) is cut in half, to 50% of the value programmed by the TBLANK bits.

For higher degrees of micro-stepping, TI recommends enabling ABT bit for better current regulation.