SNAS207B May   2004  – January 2024 LM64

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Operating Ratings
    3. 5.3 DC Electrical Characteristics
    4. 5.4 Operating Electrical Characteristics
    5. 5.5 AC Electrical Characteristics
    6. 5.6 Digital Electrical Characteristics
    7. 5.7 SMBus Logical Electrical Characteristics
    8. 5.8 SMBus Digital Switching Characteristics
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  Conversion Sequence
      2. 6.3.2  The ALERT Output
        1. 6.3.2.1 ALERT Output as a Temperature Comparator
        2. 6.3.2.2 ALERT Output as an Interrupt
        3. 6.3.2.3 ALERT Output as an SMBus ALERT
      3. 6.3.3  SMBus Interface
      4. 6.3.4  Power-On Reset (POR) Default States
      5. 6.3.5  Temperature Data Format
      6. 6.3.6  Open-Drain Outputs, Inputs, and Pull-Up Resistors
      7. 6.3.7  Diode Fault Detection
      8. 6.3.8  Communicating with the LM64
      9. 6.3.9  Digital Filter
      10. 6.3.10 Fault Queue
      11. 6.3.11 One-Shot Register
      12. 6.3.12 Serial Interface Reset
  8. Registers
    1. 7.1 LM64 Registers
      1. 7.1.1 LM64 Register Map in Hexadecimal Order
      2. 7.1.2 LM64 Register Map in Functional Order
      3. 7.1.3 LM64 Initial Register Sequence and Register Descriptions in Functional Order
        1. 7.1.3.1 LM64 Required Initial Fan Control Register Sequence
      4. 7.1.4 LM64 Register Descriptions in Functional Order
        1. 7.1.4.1 Fan Control Registers
        2. 7.1.4.2 Configuration Register
        3. 7.1.4.3 Tachometer Count And Limit Registers
        4. 7.1.4.4 Local Temperature And Local High Setpoint Registers
        5. 7.1.4.5 Remote Diode Temperature, Offset And Setpoint Registers
        6. 7.1.4.6 ALERT Status And Mask Registers
        7. 7.1.4.7 Conversion Rate And One-Shot Registers
        8. 7.1.4.8 ID Registers
    2. 7.2 General Purpose Registers
  9. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Fan Control Duty Cycle VS. Register Settings and Frequency
        1. 8.1.1.1 Computing Duty Cycles for a Given Frequency
      2. 8.1.2 Use of the Lookup Table for Non-Linear PWM Values VS Temperature
      3. 8.1.3 NON-Ideality Factor and Temperature Accuracy
        1. 8.1.3.1 Diode Non_Ideality
        2. 8.1.3.2 Compensating for Diode Non-Ideality
      4. 8.1.4 Computing RPM of the Fan from the TACH Count
    2. 8.2 Typical Application
  10. Layout
    1. 9.1 PCB Layout for Minimizing Noise
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

DC Electrical Characteristics

TEMPERATURE-TO-DIGITAL CONVERTER CHARACTERISTICS
The following specifications apply for VDD = 3.0 VDC to 3.6 VDC, and all analog source impedance RS = 50 Ω unless otherwise specified in the conditions. Boldface limits apply for TA = TMIN to TMAX; all other limits TA = +25°C.
ParameterConditionsTypical
(1)
Limits
(2)
Units
(Limits)
Temperature Error using a diode-connected MMBT3904 transistor. TD is the Remote Diode Junction Temperature.
TD = TLM64 + 16°C
TA = +30°C to +50°CTD = +120°C to +140°C±1°C (max)
TA = +0°C to +85°CTD = +25°C to +140°C±3°C (max)
Temperature Error Using the Local DiodeTA = +25°C to +125°C (3)±1±3°C (max)
Remote Diode Resolution11Bits
0.125°C
Local Diode Resolution8Bits
1°C
Conversion Time of All TemperaturesFastest Setting31.2534.4ms (max)
D− Source Voltage0.7V
Diode Source Current(VD+ − VD−) = +0.65 V; High Current160315µA (max)
110µA (min)
Low Current1320µA (max)
7µA (min)
“Typicals” are at TA = 25°C and represent most likely parametric norm. They are to be used as general reference values not for critical design calculations.
Limits are guaranteed to TI's AOQL (Average Outgoing Quality Level).
Local temperature accuracy does not include the effects of self-heating. The rise in temperature due to self-heating is the product of the internal power dissipation of the LM64 and the thermal resistance. See AN-1187 (SNOA401) for the thermal resistance to be used in the self-heating calculation.