SNAS207B May   2004  – January 2024 LM64

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Operating Ratings
    3. 5.3 DC Electrical Characteristics
    4. 5.4 Operating Electrical Characteristics
    5. 5.5 AC Electrical Characteristics
    6. 5.6 Digital Electrical Characteristics
    7. 5.7 SMBus Logical Electrical Characteristics
    8. 5.8 SMBus Digital Switching Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  Conversion Sequence
      2. 6.3.2  The ALERT Output
        1. 6.3.2.1 ALERT Output as a Temperature Comparator
        2. 6.3.2.2 ALERT Output as an Interrupt
        3. 6.3.2.3 ALERT Output as an SMBus ALERT
      3. 6.3.3  SMBus Interface
      4. 6.3.4  Power-On Reset (POR) Default States
      5. 6.3.5  Temperature Data Format
      6. 6.3.6  Open-Drain Outputs, Inputs, and Pull-Up Resistors
      7. 6.3.7  Diode Fault Detection
      8. 6.3.8  Communicating with the LM64
      9. 6.3.9  Digital Filter
      10. 6.3.10 Fault Queue
      11. 6.3.11 One-Shot Register
      12. 6.3.12 Serial Interface Reset
  8. 7 Registers
    1. 7.1 LM64 Registers
      1. 7.1.1 LM64 Register Map in Hexadecimal Order
      2. 7.1.2 LM64 Register Map in Functional Order
      3. 7.1.3 LM64 Initial Register Sequence and Register Descriptions in Functional Order
        1. 7.1.3.1 LM64 Required Initial Fan Control Register Sequence
      4. 7.1.4 LM64 Register Descriptions in Functional Order
        1. 7.1.4.1 Fan Control Registers
        2. 7.1.4.2 Configuration Register
        3. 7.1.4.3 Tachometer Count And Limit Registers
        4. 7.1.4.4 Local Temperature And Local High Setpoint Registers
        5. 7.1.4.5 Remote Diode Temperature, Offset And Setpoint Registers
        6. 7.1.4.6 ALERT Status And Mask Registers
        7. 7.1.4.7 Conversion Rate And One-Shot Registers
        8. 7.1.4.8 ID Registers
    2. 7.2 General Purpose Registers
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Fan Control Duty Cycle VS. Register Settings and Frequency
        1. 8.1.1.1 Computing Duty Cycles for a Given Frequency
      2. 8.1.2 Use of the Lookup Table for Non-Linear PWM Values VS Temperature
      3. 8.1.3 NON-Ideality Factor and Temperature Accuracy
        1. 8.1.3.1 Diode Non_Ideality
        2. 8.1.3.2 Compensating for Diode Non-Ideality
      4. 8.1.4 Computing RPM of the Fan from the TACH Count
    2. 8.2 Typical Application
  10. 9 Layout
    1. 9.1 PCB Layout for Minimizing Noise
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.1.3 NON-Ideality Factor and Temperature Accuracy

The LM64 can be applied to remote diode sensing in the same way as other integrated-circuit temperature sensors. It can be soldered to a printed-circuit board, and because the path of best thermal conductivity is between the die and the pins, its temperature will effectively be that of the printed-circuit board lands and traces soldered to its pins. This presumes that the ambient air temperature is nearly the same as the surface temperature of the printed-circuit board. If the air temperature is much higher or lower than the surface temperature, the actual temperature of the LM64 die will be an intermediate temperature between the surface and air temperatures. Again, the primary thermal conduction path is through the leads, so the circuit board surface temperature will contribute to the die temperature much more than the air temperature.

To measure the temperature external to the die use a remote diode. This diode can be located on the die of the target IC, such as a CPU processor chip, allowing measurement of the IC’s temperature, independent of the LM64’s temperature. The LM64 has been optimized for use with a MMBT3904 diode-connected transistor.

A discrete diode can also be used to sense the temperature of external objects or ambient air. Remember that a discrete diode’s temperature will be affected, and often dominated by, the temperature of its leads.

Most silicon diodes do not lend themselves well to this application. It is recommended that a diode-connected MMBT3904 transistor be used. The base of the transistor is connected to the collector and becomes the anode. The emitter is the cathode.