SNAS783C
June 2020 – February 2021
LMX2820
PRODUCTION DATA
1
Features
2
Applications
3
Description
4
Revision History
5
Pin Configuration and Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
Electrical Characteristics
6.6
Timing Requirements
6.7
Typical Characteristics
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
Reference Oscillator Input
7.3.2
Input Path
7.3.2.1
Input Path Doubler (OSC_2X)
7.3.2.2
Pre-R Divider (PLL_R_PRE)
7.3.2.3
Programmable Input Multiplier (MULT)
7.3.2.4
R Divider (PLL_R)
7.3.3
PLL Phase Detector and Charge Pump
7.3.4
N Divider and Fractional Circuitry
7.3.4.1
Integer N Divide Portion (PLL_N)
7.3.4.2
Fractional N Divide Portion (PLL_NUM and PLL_DEN)
7.3.4.3
Modulator Order (MASH_ORDER)
7.3.5
LD Pin Lock Detect
7.3.6
MUXOUT Pin and Readback
7.3.7
Internal VCO
7.3.7.1
VCO Calibration
7.3.7.1.1
Determining the VCO Gain and Ranges
7.3.8
Channel Divider
7.3.9
Output Frequency Doubler
7.3.10
Output Buffer
7.3.11
Power-Down Modes
7.3.12
Phase Synchronization for Multiple Devices
7.3.12.1
SYNC Categories
7.3.12.2
Phase Adjust
7.3.12.2.1
Using MASH_SEED to Create a Phase Shift
7.3.12.2.2
Static vs. Dynamic Phase Adjust
7.3.12.2.3
Fine Adjustments to Phase Adjust
7.3.13
SYSREF
7.3.14
Fast VCO Calibration
7.3.15
Double Buffering (Shadow Registers)
7.3.16
Output Mute Pin and Ping Pong Approaches
7.4
Device Functional Modes
7.4.1
External VCO Mode
7.4.2
External Feedback Input Pins
7.4.2.1
PFDIN External Feedback Mode
7.4.2.2
RFIN External Feedback Mode
8
Application and Implementation
8.1
Application Information
8.1.1
Treatment of Unused Pins
8.1.2
External Loop Filter
8.1.3
Using Instant Calibration
8.2
Typical Application
8.2.1
Design Requirements
8.2.2
Detailed Design Procedure
8.2.3
Application Curves
8.3
Initialization and Power-on Sequencing
9
Power Supply Recommendations
10
Layout
10.1
Layout Guidelines
10.2
Layout Example
11
Device and Documentation Support
11.1
Receiving Notification of Documentation Updates
11.2
Support Resources
11.3
Trademarks
11.4
Electrostatic Discharge Caution
11.5
Glossary
12
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
RTC|48
MPQF140D
Thermal pad, mechanical data (Package|Pins)
RTC|48
QFND642
Orderable Information
snas783c_oa
snas783c_pm
6.7
Typical Characteristics
f
OUT
= 6 GHz, f
PD
=200 MHz,Jitter=36 fs 12k-20 MHz
Figure 6-1
Closed-Loop Noise
Figure 6-3
Noise Floor
Figure 6-5
PLL Noise Metric Degradation vs. OSCin Slew Rate
Single-ended, OUTx_PWR=7, board losses de-embedded
Figure 6-7
Output Power vs. Temperature
Figure 6-9
Output Half Harmonic with Doubler Enabled
Figure 6-11
PFDIN Pin Input Sensitivity
Figure 6-13
RFIN Input Sensitivity
Approximation = 0.85*rb_TEMP_SENS - 415
Figure 6-15
Temperature Sensor Readback
This is showing the output is muted in well under 200 ns
Figure 6-17
Mute Pin Disable Output Time
Integration Range is 12k-20 MHz
Figure 6-2
Integrated Jitter
f
OSC
=100 MHz, f
PD
=200 MHz, f
OUT
=6 GHz, OSC_2X=1
Use of input doubler slightly degrades PLL noise metrics.
Figure 6-4
PLL Noise Metrics
Figure 6-6
IPLL Noise Metric Degradation vs. Charge Pump Gain
Figure 6-8
Output Power vs. OUTx_PWR
Figure 6-10
RF Output Return Loss
Figure 6-12
OSCin Input Sensitivity
Figure 6-14
RFIN Return Loss
f
VCO
=8.4 GHz, SYSREF_DIV_PRE=8,Step Size=7.6 ps
Figure 6-16
SysRef Delays vs Temperature
Output is unmuted in under 200 μs. DC bias level can stabilize faster if smaller AC-coupling capacitor is used.
Figure 6-18
Mute Pin Enable Output Time