(1) The DMD is designed to conduct absorbed and dissipated heat to the back of
the package where it can be removed by an appropriate heat sink. The heat sink
and cooling system must be capable of maintaining the package within the
temperature range specified in the Recommended Operating Conditions. The total heat load on the
DMD is largely driven by the incident light absorbed by the active area;
although other contributions include light energy absorbed by the window
aperture and electrical power dissipation of the array. Optical systems should
be designed to minimize the light energy falling outside the window clear
aperture since any additional thermal load in this area can significantly
degrade the reliability of the device.