JAJU802A January   2022  – October 2022

 

  1.   概要
  2.   リソース
  3.   特長
  4.   アプリケーション
  5.   5
  6. 1System Description
    1. 1.1 Key System Specifications
  7. 2System Overview
    1. 2.1 Block Diagram
    2. 2.2 Design Considerations
    3. 2.3 Highlighted Products
      1. 2.3.1 TMS320F2800137
      2. 2.3.2 TMS320F280025C
      3. 2.3.3 TMS320F280039C
      4. 2.3.4 UCC28740
      5. 2.3.5 UCC27517
      6. 2.3.6 TLV9062
      7. 2.3.7 TLV76733
    4. 2.4 System Design Theory
      1. 2.4.1 Interleaved PFC
        1. 2.4.1.1 Full Bridge Diode Rectifier Rating
        2. 2.4.1.2 Inductor Ratings
        3. 2.4.1.3 AC Voltage Sensing
        4. 2.4.1.4 DC Link Voltage Sensing
        5. 2.4.1.5 Bus Current Sensing
        6. 2.4.1.6 DC Link Capacitor Rating
        7. 2.4.1.7 MOSFET Ratings
        8. 2.4.1.8 Diode Ratings
      2. 2.4.2 Three-Phase PMSM Drive
        1. 2.4.2.1 Field Oriented Control of PM Synchronous Motor
        2. 2.4.2.2 Sensorless Control of PM Synchronous Motor
          1. 2.4.2.2.1 Enhanced Sliding Mode Observer with Phase Locked Loop
            1. 2.4.2.2.1.1 Mathematical Model and FOC Structure of an IPMSM
            2. 2.4.2.2.1.2 Design of ESMO for the IPMSM
            3. 2.4.2.2.1.3 Rotor Position and Speed Estimation with PLL
        3. 2.4.2.3 Field Weakening (FW) and Maximum Torque Per Ampere (MTPA) Control
        4. 2.4.2.4 Compressor Drive with Automatic Vibration Compensation
        5. 2.4.2.5 Fan Drive with Flying Start
        6. 2.4.2.6 Hardware Prerequisites for Motor Drive
          1. 2.4.2.6.1 Motor Current Feedback
            1. 2.4.2.6.1.1 Current Sensing with Three-Shunt
            2. 2.4.2.6.1.2 Current Sensing with Single-Shunt
          2. 2.4.2.6.2 Motor Voltage Feedback
  8. 3Hardware, Software, Testing Requirements, and Test Results
    1. 3.1 Getting Started Hardware
      1. 3.1.1 Hardware Board Overview
      2. 3.1.2 Test Conditions
      3. 3.1.3 Test Equipment Required for Board Validation
      4. 3.1.4 Test Setup
    2. 3.2 Getting Started Firmware
      1. 3.2.1 Download and Install Software Required for Board Test
      2. 3.2.2 Opening Project Inside CCS
      3. 3.2.3 Project Structure
    3. 3.3 Test Procedure
      1. 3.3.1 Build Level 1: CPU and Board Setup
        1. 3.3.1.1 Start CCS and Open Project
        2. 3.3.1.2 Build and Load Project
        3. 3.3.1.3 Setup Debug Environment Windows
        4. 3.3.1.4 Run the Code
      2. 3.3.2 Build Level 2: Open Loop Check with ADC Feedback
        1. 3.3.2.1 Start CCS and Open Project
        2. 3.3.2.2 Build and Load Project
        3. 3.3.2.3 Setup Debug Environment Windows
        4. 3.3.2.4 Run the Code
      3. 3.3.3 Build Level 3: Closed Current Loop Check
        1. 3.3.3.1 Start CCS and Open Project
        2. 3.3.3.2 Build and Load Project
        3. 3.3.3.3 Setup Debug Environment Windows
        4. 3.3.3.4 Run the Code
      4. 3.3.4 Build Level 4: Full PFC and Motor Drive Control
        1. 3.3.4.1  Start CCS and Open Project
        2. 3.3.4.2  Build and Load Project
        3. 3.3.4.3  Setup Debug Environment Windows
        4. 3.3.4.4  Run the Code
        5. 3.3.4.5  Run the System
        6. 3.3.4.6  Tuning Motor Drive FOC Parameters
        7. 3.3.4.7  Tuning PFC Parameters
        8. 3.3.4.8  Tuning Field Weakening and MTPA Control Parameters
        9. 3.3.4.9  Tuning Flying Start Control Parameters
        10. 3.3.4.10 Tuning Vibration Compensation Parameters
        11. 3.3.4.11 Tuning Current Sensing Parameters
    4. 3.4 Test Results
      1. 3.4.1 Performance Data and Curves
      2. 3.4.2 Functional Waveforms
      3. 3.4.3 Transient Waveforms
      4. 3.4.4 MCU CPU Load, Memory and Peripherals Usage
        1. 3.4.4.1 CPU Load for Full Implementation
        2. 3.4.4.2 Memory Usage
        3. 3.4.4.3 Peripherals Usage
    5. 3.5 Migrate Firmware to a New Hardware Board
      1. 3.5.1 Configure the PWM, CMPSS, and ADC Modules
      2. 3.5.2 Setup Hardware Board Parameters
      3. 3.5.3 Configure Faults Protection Parameters
      4. 3.5.4 Setup Motor Electrical Parameters
      5. 3.5.5 Setup PFC Control Parameters
  9. 4Design and Documentation Support
    1. 4.1 Design Files
      1. 4.1.1 Schematics
      2. 4.1.2 Bill of Materials
      3. 4.1.3 Altium Project
      4. 4.1.4 Gerber Files
      5. 4.1.5 PCB Layout Guidelines
    2. 4.2 Software Files
    3. 4.3 Documentation Support
    4. 4.4 サポート・リソース
    5. 4.5 Trademarks
  10. 5Terminology
  11. 6Revision History

2.4.1.8 Diode Ratings

  • Diode Type Selection
    • In this design, Silicon Carbide (SiC) Schottky Diode is used as boost diode.
    • As compared to standard ultra-fast silicon power diodes, silicon Schottky devices offer improved performance because of their lower forward drops and reduced forward and reverse recovery characteristics. But their low breakdown voltages have limited their use to low-voltage applications.
    • Silicon carbide overcomes these limitations with its high reverse breakdown voltage and fast recovery.
  • Diode Reverse Voltage Rating
    • Diode reverse voltage is similar to MOSFET blocking voltage. When diode is reverse biased, it will have to block DC bus voltage which can rise up to 400 V maximum. Leaving 50% room as safety factor, 600 V reverse blocking rating is selected.
  • Diode Current Rating
    • When diode conducts average and peak value of current passing through the diode can be determined by
      Equation 38. I D I O D E ( A V G ) = P O U T 2 × V O U T ( M I N ) × η D I O D E
      Equation 39. I D I O D E ( P E A K ) = I L ( M A X )
  • Power Dissipation in diode
    • There are two type of losses in diode rectifier, for example, conduction loss and reverse recovery loss. Major loss is contributed by forward voltage drop can be given by
      Equation 40. P D I O D E = I D I O D E ( A V G ) × V F