SLUUCU7 November   2023 BQ25960H

 

  1.   1
  2.   Description
  3.   Get Started
  4.   Features
  5.   Applications
  6.   6
  7. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  8. 2Hardware
    1. 2.1 Equipment
    2. 2.2 Equipment Setup
    3. 2.3 I/O Descriptions
  9. 3Software
    1. 3.1 Software Setup
  10. 4Implementation Results
    1. 4.1 Test Procedure
      1. 4.1.1 Initial Settings
      2. 4.1.2 Communication Verification
      3. 4.1.3 Switched Cap Mode Charge Verification
      4. 4.1.4 Bypass Mode Charge Verification
      5. 4.1.5 Dual BQ25960H Operation
      6. 4.1.6 BQ25611D Charge Verification
  11. 5Hardware Design Files
    1. 5.1 Schematic
    2. 5.2 PCB Layout Guidelines
      1. 5.2.1 Board Layout
    3. 5.3 Bill of Materials
  12. 6Additional Information
    1.     Trademarks

5.2.1 Board Layout

Figure 6-4 through Figure 6-11 illustrate the PCB layout.


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Figure 5-4 BMS082 Top Overlay

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Figure 5-5 BMS082 Bottom Overlay

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Figure 5-6 BMS082 Top Layer

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Figure 5-7 BMS082 Signal Layer 1

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Figure 5-8 BMS082 Signal Layer 2

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Figure 5-9 BMS082 Signal Layer 3

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Figure 5-10 BMS082 Signal Layer 4

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Figure 5-11 BMS082 Bottom Layer