The LMZ31503 power module is an easy-to-use integrated power solution that combines a 3-A DC/DC converter with power MOSFETs, a shielded inductor, and passives into a low profile, QFN package. This total power solution allows as few as 3 external components and eliminates the loop compensation and magnetics design process.
The 9×15×2.8 mm QFN package is easy to solder onto a printed circuit board and allows a compact point-of-load design with up to 95% efficiency and excellent power dissipation with a thermal impedance of 13°C/W junction to ambient. The device delivers the full 3-A rated output current at 85°C ambient temperature without airflow.
The LMZ31503 offers the flexibility and the feature-set of a discrete point-of-load design and is ideal for powering performance DSPs and FPGAs. Advanced packaging technology afford a robust and reliable power solution compatible with standard QFN mounting and testing techniques.
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|Part number||Order||Iout (Max) (A)||Vin (Min) (V)||Vin (Max) (V)||Vout (Min) (V)||Vout (Max) (V)||Soft start||Features||Iq (Typ) (mA)||Regulated outputs (#)||Package size: mm2:W x L (PKG)||Switching frequency (Max) (kHz)||Switching frequency (Min) (kHz)||Switching frequency (Typ) (kHz)||Topology||Operating temperature range (C)||Duty cycle (Max) (%)||Package Group||Type|
|13.4||1||47B1QFN: 135 mm2: 9 x 15 (B1QFN | 47)||780||330||500||
|-40 to 85||100||B1QFN | 47||Module|