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CC2564C

現行

具有基本速率 (BR)、強化數據速率 (EDR)、低功耗 (LE) 的 Bluetooth® 5.1

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CC2564C

現行
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產品詳細資料

Type Transceiver Protocols Dual-mode Bluetooth Security Networking security Features Assisted A2DP/HFP 1.6, BR / EDR / LE, Class 1 TX Power, LE Link Layer Topology, LE Secure Connections Operating temperature range (°C) -40 to 85 Rating Catalog
Type Transceiver Protocols Dual-mode Bluetooth Security Networking security Features Assisted A2DP/HFP 1.6, BR / EDR / LE, Class 1 TX Power, LE Link Layer Topology, LE Secure Connections Operating temperature range (°C) -40 to 85 Rating Catalog
VQFNP-MR (RVM) 76 64 mm² 8 x 8
  • TI’s Single-Chip Bluetooth® Solution With Bluetooth Basic Rate (BR), Enhanced Data Rate (EDR), and Low Energy (LE) Support
  • Bluetooth 5.1 Delaration ID D049226
  • Highly Optimized for Size-Constrained and Low-Cost Designs:
    • Single-Ended 50-Ω RF Interface
    • VQFNP-MR Package Family, RVM Footprint: 76 Terminals, 0.6-mm Pitch, 8-mm × 8-mm
  • BR and EDR Features Include:
    • Up to Seven Active Devices
    • Scatternet: Up to Three Piconets Simultaneously, One as Master and Two as Slaves
    • Up to Two Synchronous Connection Oriented (SCO) Links on the Same Piconet
    • Support for All Voice Air-Coding—Continuously Variable Slope Delta (CVSD), A-Law, µ-Law, Modified Subband Coding (mSBC), and Transparent (Uncoded)
    • Provide an Assisted Mode for HFP 1.6 Wideband Speech (WBS) Profile or A2DP Profile to Reduce Host Processing and Power
    • Support of Multiple Bluetooth Profiles With Enhanced QoS
  • Low Energy Features Include:
    • Multiple Sniff Instances Tightly Coupled to Achieve Minimum Power Consumption
    • Independent Buffering for Low Energy Allows Large Numbers of Multiple Connections Without Affecting BR or EDR Performance
    • Built-In Coexistence and Prioritization Handling for BR, EDR, and Low Energy
    • Capabilities of Link Layer Topology Scatternet—Can Act Concurrently as Peripheral and Central
    • Network Support for up to 10 Devices
    • Time Line Optimization Algorithms to Achieve Maximum Channel Utliization
  • Best-in-Class Bluetooth (RF) Performance (TX Power, RX Sensitivity, Blocking)
    • Class 1 TX Power up to +12 dBm
    • Internal Temperature Detection and Compensation to Ensure Minimal Variation in RF Performance Over Temperature, No External Calibration Required
    • Improved Adaptive Frequency Hopping (AFH) Algorithm With Minimum Adaptation Time
    • Longer Range, Including Twice the Range of Other Low-Energy-Only Solutions
  • Advanced Power Management for Extended Battery Life and Ease of Design
    • On-Chip Power Management, Including Direct Connection to Battery
    • Low Power Consumption for Active, Standby, and Scan Bluetooth Modes
    • Shutdown and Sleep Modes to Minimize Power Consumption
  • Physical Interfaces:
    • UART Interface With Support for Maximum Bluetooth Data Rates
      • UART Transport Layer (H4) With Maximum Rate of 4 Mbps
      • Three-Wire UART Transport Layer (H5) With Maximum Rate of 4 Mbps
    • Fully Programmable Digital Pulse-Code Modulation (PCM)–I2S Codec Interface
  • Flexibility for Easy Stack Integration and Validation Into MCUs and MPUs
  • HCI Tester Tool to Evaluate RF Performance of the Device and Configure Service Pack
  • TI’s Single-Chip Bluetooth® Solution With Bluetooth Basic Rate (BR), Enhanced Data Rate (EDR), and Low Energy (LE) Support
  • Bluetooth 5.1 Delaration ID D049226
  • Highly Optimized for Size-Constrained and Low-Cost Designs:
    • Single-Ended 50-Ω RF Interface
    • VQFNP-MR Package Family, RVM Footprint: 76 Terminals, 0.6-mm Pitch, 8-mm × 8-mm
  • BR and EDR Features Include:
    • Up to Seven Active Devices
    • Scatternet: Up to Three Piconets Simultaneously, One as Master and Two as Slaves
    • Up to Two Synchronous Connection Oriented (SCO) Links on the Same Piconet
    • Support for All Voice Air-Coding—Continuously Variable Slope Delta (CVSD), A-Law, µ-Law, Modified Subband Coding (mSBC), and Transparent (Uncoded)
    • Provide an Assisted Mode for HFP 1.6 Wideband Speech (WBS) Profile or A2DP Profile to Reduce Host Processing and Power
    • Support of Multiple Bluetooth Profiles With Enhanced QoS
  • Low Energy Features Include:
    • Multiple Sniff Instances Tightly Coupled to Achieve Minimum Power Consumption
    • Independent Buffering for Low Energy Allows Large Numbers of Multiple Connections Without Affecting BR or EDR Performance
    • Built-In Coexistence and Prioritization Handling for BR, EDR, and Low Energy
    • Capabilities of Link Layer Topology Scatternet—Can Act Concurrently as Peripheral and Central
    • Network Support for up to 10 Devices
    • Time Line Optimization Algorithms to Achieve Maximum Channel Utliization
  • Best-in-Class Bluetooth (RF) Performance (TX Power, RX Sensitivity, Blocking)
    • Class 1 TX Power up to +12 dBm
    • Internal Temperature Detection and Compensation to Ensure Minimal Variation in RF Performance Over Temperature, No External Calibration Required
    • Improved Adaptive Frequency Hopping (AFH) Algorithm With Minimum Adaptation Time
    • Longer Range, Including Twice the Range of Other Low-Energy-Only Solutions
  • Advanced Power Management for Extended Battery Life and Ease of Design
    • On-Chip Power Management, Including Direct Connection to Battery
    • Low Power Consumption for Active, Standby, and Scan Bluetooth Modes
    • Shutdown and Sleep Modes to Minimize Power Consumption
  • Physical Interfaces:
    • UART Interface With Support for Maximum Bluetooth Data Rates
      • UART Transport Layer (H4) With Maximum Rate of 4 Mbps
      • Three-Wire UART Transport Layer (H5) With Maximum Rate of 4 Mbps
    • Fully Programmable Digital Pulse-Code Modulation (PCM)–I2S Codec Interface
  • Flexibility for Easy Stack Integration and Validation Into MCUs and MPUs
  • HCI Tester Tool to Evaluate RF Performance of the Device and Configure Service Pack

The CC2564C device from Texas Instruments™ is a complete Bluetooth® BR/EDR, and low energy HCI level solution, providing high performance and robust Bluetooth solution. Based on TI’s seventh-generation Bluetooth core, the CC2564C device provides a product-proven solution that is Bluetooth 5.1-compliant, adding LE security and enhancing support for complex topologies (dual mode and link layer topologies). This HCI device offers best-in-class RF performance with about twice the throughput of other Bluetooth low-energy solutions, and includes a royalty-free software stack compatible with several host MCUs and MPUs, for a complete Bluetooth solution. Furthermore, TI’s power-management hardware and software algorithms provide significant power savings in all commonly used Bluetooth BR, EDR, and low energy modes of operation.

The TI dual-mode Bluetooth stack software is certified and provided royalty free for MCUs and MPUs. The iPod® (MFi) protocol is supported by add-on software packages. For more information, see TI Dual-Mode Bluetooth Stack. Multiple profiles and sample applications, including the following, are supported:

Serial port profile (SPP)

Advanced audio distribution profile (A2DP)

Audio/video remote control profile (AVRCP)

Hands-free profile (HFP)

Human interface device (HID)

Generic attribute profile (GATT)

Several Bluetooth low energy profiles and services

 

The CC2564C device from Texas Instruments™ is a complete Bluetooth® BR/EDR, and low energy HCI level solution, providing high performance and robust Bluetooth solution. Based on TI’s seventh-generation Bluetooth core, the CC2564C device provides a product-proven solution that is Bluetooth 5.1-compliant, adding LE security and enhancing support for complex topologies (dual mode and link layer topologies). This HCI device offers best-in-class RF performance with about twice the throughput of other Bluetooth low-energy solutions, and includes a royalty-free software stack compatible with several host MCUs and MPUs, for a complete Bluetooth solution. Furthermore, TI’s power-management hardware and software algorithms provide significant power savings in all commonly used Bluetooth BR, EDR, and low energy modes of operation.

The TI dual-mode Bluetooth stack software is certified and provided royalty free for MCUs and MPUs. The iPod® (MFi) protocol is supported by add-on software packages. For more information, see TI Dual-Mode Bluetooth Stack. Multiple profiles and sample applications, including the following, are supported:

Serial port profile (SPP)

Advanced audio distribution profile (A2DP)

Audio/video remote control profile (AVRCP)

Hands-free profile (HFP)

Human interface device (HID)

Generic attribute profile (GATT)

Several Bluetooth low energy profiles and services

 
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類型 標題 日期
* Data sheet CC2564C Dual-Mode Bluetooth® Controller datasheet (Rev. B) 2020年 12月 2日
Cybersecurity advisory CC2564C: BT (BR/EDR) SIG Errata 11838 - LMP Encryption Key Minimum Size Change PDF | HTML 2023年 12月 20日
Application note QFN and SON PCB Attachment (Rev. C) PDF | HTML 2023年 12月 6日
Cybersecurity advisory CC2564C: CC256x and WL18xx Bluetooth Low Energy - LE scan vulnerability PDF | HTML 2023年 11月 12日
User guide CC256x TI Bluetooth Stack SPPLEDemo App PDF | HTML 2023年 8月 8日
User guide CC256x TI’s Bluetooth Stack Basic HFGAGDemo APP PDF | HTML 2023年 8月 8日
User guide TI Bluetooth Stack HIDDemo App PDF | HTML 2023年 8月 4日
Selection guide CC256x Getting Started Selection Guide (Rev. C) PDF | HTML 2022年 5月 13日
Selection guide 無線連線技術選擇指南 (Rev. B) 2022年 3月 7日
User guide CC2564C TI Dual-mode Bluetooth Stack on MSP432 MCUs (Rev. B) PDF | HTML 2021年 12月 20日
More literature Dual-Mode Bluetooth® CC256xCQFNEM Evaluation Board (Rev. C) PDF | HTML 2021年 12月 20日
User guide CC2564C TI Dual-mode Bluetooth Stack on STM32F4 MCUs (Rev. B) PDF | HTML 2021年 12月 2日
User guide CC2564B to CC2564C Migration Guide (Rev. B) PDF | HTML 2021年 12月 1日
Application brief TI Bluetooth CC2564C Solution (Rev. B) PDF | HTML 2021年 12月 1日
User guide Bluetopia Stack Build Guide for Linux PDF | HTML 2021年 1月 15日
User guide CC2564x Demo Applications User's Guide PDF | HTML 2020年 12月 17日
Cybersecurity advisory Bluetooth Low Energy – Invalid Connection Request (SweynTooth) (Rev. A) PDF | HTML 2020年 7月 17日
Cybersecurity advisory Bluetooth Basic Rate/Enhanced Data Rate – Bluetooth Impersonation AttackS (BIAS) PDF | HTML 2020年 5月 18日
Cybersecurity advisory Bluetooth Low Energy, Basic Rate/Enhanced Data Rate – Method Confusion Pairing V PDF | HTML 2020年 5月 18日
Application note Capturing Bluetooth Host Controller Interface (HCI) Logs 2019年 1月 7日
White paper Which TI Bluetooth® solution should I choose? 2017年 5月 5日
White paper White Paper: Why Classic Bluetooth® (BR/EDR)? 2017年 5月 4日
Technical article Introducing TI’s dual-mode Bluetooth® 4.2 CC2564C solution PDF | HTML 2016年 12月 13日
Application note Application Notes for CC2564C Bluetooth® 4.1 and 4.2 2016年 11月 1日

設計與開發

如需其他條款或必要資源，請按一下下方的任何標題以檢視詳細頁面 (如有)。

開發板

CC256XCQFN-EM — CC2564C 雙模式藍牙® 控制器評估模組

The TI CC256xC Bluetooth® device is a complete basic rate (BR), enhanced data rate (EDR), and LE host controller interface (HCI) solution that reduces design effort and enables fast time to market. Based on TI's seventh-generation core, the module is a product-proven solution supporting (...)
使用指南: PDF | HTML
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驅動程式或資料庫

CC2564CMSP432BTBLESW — MSP432 MCU 的 CC2564C TI 雙模式藍牙® 架構

TI’s CC2564C Dual-mode Bluetooth® stack on MSP432 MCUs software for Bluetooth + Bluetooth Low Energy enables the MSP432 MCU and is comprised of Single Mode and Dual-mode offerings implementing the Bluetooth 5.1 specification. The Bluetooth stack is fully qualified (QDID172096 and QDID172097), (...)
使用指南: PDF | HTML
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驅動程式或資料庫

CC2564CSTBTBLESW — STM32F4 MCU 的 CC2564C TI 雙模式藍牙® 架構

TI’s CC2564C Dual-mode Bluetooth® stack on STM32F4 MCUs software for Bluetooth + Bluetooth Low Energy enables the STM32 ARM Cortex M4 MCU and is comprised of Single Mode and Dual-mode offerings implementing the Bluetooth 5.1 specification. The Bluetooth stack is fully qualified (QDID172096 and (...)
使用指南: PDF | HTML
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驅動程式或資料庫

CC256XC-BT-SP — 適用於 CC256xC 的藍牙® Service Pack

The CC256xC Bluetooth Service Pack (SP) contains the mandatory initialization scripts (BTS files) that have platform specific configurations and bug fixes.

In addition, the Bluetooth Service Pack also contains companion files for the CC2564C device that are useful for testing and debugging. The (...)

使用指南: PDF | HTML
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驅動程式或資料庫

TI-BT-4-2-STACK-LINUX-ADDON — 支援 WL183x 和 CC2564C 且適用於 Linux 平台的 TI 藍牙 4.2 架構附加元件

This package contains the install package, pre-compiled object of the TI Bluetooth Stack and Platform Manager, and pre-compiled object with source of sample applications to easily upgrade the default LINUX EZSDK Binary on an AM335x EVM. The software was built with Linaro GCC 4.7 and can be added to (...)
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IDE、配置、編譯器或偵錯程式

CCSTUDIO — Code Composer Studio™ integrated development environment (IDE)

Code Composer Studio is an integrated development environment (IDE) for TI's microcontrollers and processors. It comprises a suite of tools used to develop and debug embedded applications.  Code Composer Studio is available for download across Windows®, Linux® and macOS® (...)

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認證

CC256X-CERTIFICATION — 雙模式藍牙的無線電認證

Are you looking for CC256x module certification support? CC256x-CERTIFCATION provides the relevant information and support for successful certification of your product. Within this page you will find the latest certification reports of our Modules as well as our evaluation boards.
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認證

CC256X-REPORTS — Reports: CC256x Regulatory Certification Reports

Are you looking for CC256x module certification support? CC256x-CERTIFCATION provides the relevant information and support for successful certification of your product. Within this page you will find the latest certification reports of our Modules as well as our evaluation boards.
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支援產品和硬體

產品
Wi-Fi 產品
CC2564 — 具強化資料率 (EDR)、低功耗 LE 和 ANT 的 Bluetooth® 4.0 CC2564C — 具有基本速率 (BR)、強化數據速率 (EDR)、低功耗 (LE) 的 Bluetooth® 5.1 CC2564MODA — 具有整合式天線且具有基本速率、強化數據速率、低功耗 (LE) 模組的 Bluetooth® 4.1 CC2564MODN — 具基本速率 (BR)、強化資料率 (EDR)、低功耗 (LE) 模組的 Bluetooth® 4.1
硬體開發
BOOST-CC2564MODA — TMP107 溫度感測器菊輪鍊 BoosterPack™ 插入式模組 CC2564MODAEM — 具有整合式天線的雙模式 Bluetooth® CC2564 模組評估板 CC2564MODNEM — 雙模式 Bluetooth® CC2564 模組評估板 CC256XCQFN-EM — CC2564C 雙模式藍牙® 控制器評估模組 CC256XQFNEM — 雙模式藍牙® CC2564 評估板
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設計工具

DUALMODE-BT-DESIGN-REVIEWS — CC256x 裝置的硬體設計審核

To get started with the dual-mode Bluetooth® hardware design review process:
  • Step 1: Before requesting a review, it is important that to review the technical documentation and design & development resources available on the corresponding product page (see CC256x product page links below).
  • Step 2: (...)
使用指南: PDF
要求
Gerber 檔案

CC256XCQFN-EM Design Files

SWRC329.ZIP (1375 KB)
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VQFNP-MR (RVM) 76 檢視選項
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