首頁 無線連線 Wi-Fi 產品
首頁
無線連線
Wi-Fi 產品

CC2564MODA

現行

具有整合式天線且具有基本速率、強化數據速率、低功耗 (LE) 模組的 Bluetooth® 4.1

立即訂購
產品規格表

CC2564MODA

現行
產品規格表 立即訂購

產品詳細資料

Type Module, Transceiver Protocols Dual-mode Bluetooth Security Networking security Features Assisted A2DP/HFP 1.6, BR / EDR / LE, Class 1 TX Power Operating temperature range (°C) -30 to 85 Rating Catalog
Type Module, Transceiver Protocols Dual-mode Bluetooth Security Networking security Features Assisted A2DP/HFP 1.6, BR / EDR / LE, Class 1 TX Power Operating temperature range (°C) -30 to 85 Rating Catalog
QFM (MOG) 35 98 mm² 14 x 7
  • Module Solution Based on TI's CC2564B Dual-Mode Bluetooth®, Available in Two Variants:
    • CC2564MODA With Integrated Antenna
    • CC2564MODN With External Antenna
  • Fully Certified Module for FCC, IC, CE, and Bluetooth 4.1
    • FCC (Z64-2564N), IC (451I-2564N) Modular Grant (see Section 6.2.1.3, Section 7.1.1, and Section 7.1.2)
    • CE Certified as Summarized in the Declaration of Conformity (see Section 7.1.3)
    • Bluetooth 4.1 Controller Subsystem Qualified (CC2564MODN: QDID 55257; CC2564MODA: QDID 64631). Compliant up to the HCI Layer
  • Highly Optimized for Design Into Small Form Factor Systems and Flexibility:
    • CC2564MODA
      • Integrated Chip Antenna
      • Module Footprint: 35 Terminals, 0.8-mm Pitch, 7 mm × 14 mm × 1.4 mm (Typical)
    • CC2564MODN
      • Single-Ended 50-Ω RF Interface
      • Module Footprint: 33 Terminals, 0.8-mm Pitch, 7 mm × 7 mm × 1.4 mm (Typical)
  • BR and EDR Features Include:
    • Up to Seven Active Devices
    • Scatternet: Up to Three Piconets Simultaneously, One as Master and Two as Slaves
    • Up to Two Synchronous Connection Oriented (SCO) Links on the Same Piconet
    • Support for All Voice Air-Coding—Continuously Variable Slope Delta (CVSD), A-Law, µ-Law, and Transparent (Uncoded)
    • Assisted Mode for HFP 1.6 Wideband Speech (WBS) Profile or A2DP Profile to Reduce Host Processing and Power
    • Support of Multiple Bluetooth Profiles With Enhanced QoS
  • Low Energy Features Include:
    • Support of up to 10 Simultaneous Connections
    • Multiple Sniff Instances Tightly Coupled to Achieve Minimum Power Consumption
    • Independent Buffering for Low Energy Allows Large Numbers of Multiple Connections Without Affecting BR or EDR Performance
    • Built-In Coexistence and Prioritization Handling for BR, EDR, and Low Energy
  • Best-in-Class Bluetooth (RF) Performance (TX Power, RX Sensitivity, Blocking)
    • Class 1.5 TX Power up to +10 dBm
    • –93 dbm Typical RX Sensitivity
    • Internal Temperature Detection and Compensation to Ensure Minimal Variation in RF Performance Over Temperature, No External Calibration Required
    • Improved Adaptive Frequency Hopping (AFH) Algorithm With Minimum Adaptation Time
    • Provides Longer Range, Including Twice the Range of Other Low-Energy-Only Solutions
  • Advanced Power Management for Extended Battery Life and Ease of Design
    • On-Chip Power Management, Including Direct Connection to Battery
    • Low Power Consumption for Active, Standby, and Scan Bluetooth Modes
    • Shutdown and Sleep Modes to Minimize Power Consumption
  • Physical Interfaces:
    • UART Interface With Support for Maximum Bluetooth Data Rates
      • UART Transport Layer (H4) With Maximum Rate of 4 Mbps
      • Three-Wire UART Transport Layer (H5) With Maximum Rate of 4 Mbps
    • Fully Programmable Digital Pulse-Code Modulation (PCM)–I2S Codec Interface
  • CC256x Bluetooth Hardware Evaluation Tool: PC-Based Application to Evaluate RF Performance of the Device and Configure Service Pack

All trademarks are the property of their respective owners. All trademarks are the property of their respective owners.
  • Module Solution Based on TI's CC2564B Dual-Mode Bluetooth®, Available in Two Variants:
    • CC2564MODA With Integrated Antenna
    • CC2564MODN With External Antenna
  • Fully Certified Module for FCC, IC, CE, and Bluetooth 4.1
    • FCC (Z64-2564N), IC (451I-2564N) Modular Grant (see Section 6.2.1.3, Section 7.1.1, and Section 7.1.2)
    • CE Certified as Summarized in the Declaration of Conformity (see Section 7.1.3)
    • Bluetooth 4.1 Controller Subsystem Qualified (CC2564MODN: QDID 55257; CC2564MODA: QDID 64631). Compliant up to the HCI Layer
  • Highly Optimized for Design Into Small Form Factor Systems and Flexibility:
    • CC2564MODA
      • Integrated Chip Antenna
      • Module Footprint: 35 Terminals, 0.8-mm Pitch, 7 mm × 14 mm × 1.4 mm (Typical)
    • CC2564MODN
      • Single-Ended 50-Ω RF Interface
      • Module Footprint: 33 Terminals, 0.8-mm Pitch, 7 mm × 7 mm × 1.4 mm (Typical)
  • BR and EDR Features Include:
    • Up to Seven Active Devices
    • Scatternet: Up to Three Piconets Simultaneously, One as Master and Two as Slaves
    • Up to Two Synchronous Connection Oriented (SCO) Links on the Same Piconet
    • Support for All Voice Air-Coding—Continuously Variable Slope Delta (CVSD), A-Law, µ-Law, and Transparent (Uncoded)
    • Assisted Mode for HFP 1.6 Wideband Speech (WBS) Profile or A2DP Profile to Reduce Host Processing and Power
    • Support of Multiple Bluetooth Profiles With Enhanced QoS
  • Low Energy Features Include:
    • Support of up to 10 Simultaneous Connections
    • Multiple Sniff Instances Tightly Coupled to Achieve Minimum Power Consumption
    • Independent Buffering for Low Energy Allows Large Numbers of Multiple Connections Without Affecting BR or EDR Performance
    • Built-In Coexistence and Prioritization Handling for BR, EDR, and Low Energy
  • Best-in-Class Bluetooth (RF) Performance (TX Power, RX Sensitivity, Blocking)
    • Class 1.5 TX Power up to +10 dBm
    • –93 dbm Typical RX Sensitivity
    • Internal Temperature Detection and Compensation to Ensure Minimal Variation in RF Performance Over Temperature, No External Calibration Required
    • Improved Adaptive Frequency Hopping (AFH) Algorithm With Minimum Adaptation Time
    • Provides Longer Range, Including Twice the Range of Other Low-Energy-Only Solutions
  • Advanced Power Management for Extended Battery Life and Ease of Design
    • On-Chip Power Management, Including Direct Connection to Battery
    • Low Power Consumption for Active, Standby, and Scan Bluetooth Modes
    • Shutdown and Sleep Modes to Minimize Power Consumption
  • Physical Interfaces:
    • UART Interface With Support for Maximum Bluetooth Data Rates
      • UART Transport Layer (H4) With Maximum Rate of 4 Mbps
      • Three-Wire UART Transport Layer (H5) With Maximum Rate of 4 Mbps
    • Fully Programmable Digital Pulse-Code Modulation (PCM)–I2S Codec Interface
  • CC256x Bluetooth Hardware Evaluation Tool: PC-Based Application to Evaluate RF Performance of the Device and Configure Service Pack

All trademarks are the property of their respective owners. All trademarks are the property of their respective owners.

The CC2564MODx module from Texas Instruments™ is a complete Bluetooth® BR/EDR, and low energy HCI solution that reduces design effort, cost, and time to market. The CC2564MODx module includes TI's seventh-generation core and provides a versatile, product-proven solution that is Bluetooth 4.1-compliant. The module is also certified for FCC, IC, and CE, requiring no prior RF experience to develop with this device; and the device includes a royalty-free software stack compatible with several host MCUs and MPUs. The CC2564MODx module provides best-in-class RF performance with transmit power and receive sensitivity that provides twice the range and higher throughput than other Bluetooth-low-energy-only solutions.

Furthermore, TI’s power-management hardware and software algorithms provide significant power savings in all commonly used Bluetooth BR/EDR and low energy modes of operation.

The TI dual-mode Bluetooth stack software is certified and provided royalty free for TI's MSP430™ and MSP432™ ARM® Cortex®-M3 and ARM® Cortex®-M4 MCUs, and Linux® based MPUs. Other processors can be supported through TI's third party. The iPod® (MFi) protocol is supported by add-on software packages. Multiple profiles and sample applications, including the following, are supported:

  • Serial port profile (SPP)
  • Advanced audio distribution profile (A2DP)
  • Audio/video remote control profile (AVRCP)
  • Hands-free profile (HFP)
  • Human interface device (HID)
  • Generic attribute profile (GATT)
  • Several Bluetooth low energy profiles and services

For more information, see TI Dual-Mode Bluetooth Stack.

In addition to software, the BOOST-CC2564MODA and CC2564MODxEM evaluation boards are available for each variant. For more information on TI’s wireless platform solutions for Bluetooth, see TI's wireless-connectivity/dual-mode-bluetooth page.

The CC2564MODx module from Texas Instruments™ is a complete Bluetooth® BR/EDR, and low energy HCI solution that reduces design effort, cost, and time to market. The CC2564MODx module includes TI's seventh-generation core and provides a versatile, product-proven solution that is Bluetooth 4.1-compliant. The module is also certified for FCC, IC, and CE, requiring no prior RF experience to develop with this device; and the device includes a royalty-free software stack compatible with several host MCUs and MPUs. The CC2564MODx module provides best-in-class RF performance with transmit power and receive sensitivity that provides twice the range and higher throughput than other Bluetooth-low-energy-only solutions.

Furthermore, TI’s power-management hardware and software algorithms provide significant power savings in all commonly used Bluetooth BR/EDR and low energy modes of operation.

The TI dual-mode Bluetooth stack software is certified and provided royalty free for TI's MSP430™ and MSP432™ ARM® Cortex®-M3 and ARM® Cortex®-M4 MCUs, and Linux® based MPUs. Other processors can be supported through TI's third party. The iPod® (MFi) protocol is supported by add-on software packages. Multiple profiles and sample applications, including the following, are supported:

  • Serial port profile (SPP)
  • Advanced audio distribution profile (A2DP)
  • Audio/video remote control profile (AVRCP)
  • Hands-free profile (HFP)
  • Human interface device (HID)
  • Generic attribute profile (GATT)
  • Several Bluetooth low energy profiles and services

For more information, see TI Dual-Mode Bluetooth Stack.

In addition to software, the BOOST-CC2564MODA and CC2564MODxEM evaluation boards are available for each variant. For more information on TI’s wireless platform solutions for Bluetooth, see TI's wireless-connectivity/dual-mode-bluetooth page.
open-in-new 尋找其它 Wi-Fi 產品
下載 觀看有字幕稿的影片 影片

技術文件

star =TI 所選的此產品重要文件
找不到結果。請清除您的搜尋條件，然後再試一次。
檢視所有 22
類型 標題 日期
* Data sheet CC2564MODx Bluetooth® Host Controller Interface (HCI) Module datasheet (Rev. E) 2016年 1月 16日
* Radiation & reliability report CC2564MODA Reliability Data – Reliability Estimate 2019年 6月 25日
Selection guide CC256x Getting Started Selection Guide (Rev. C) PDF | HTML 2022年 5月 13日
Selection guide 無線連線技術選擇指南 (Rev. B) 2022年 3月 7日
Certificate CC2564MODA EC Declaration of Conformity (DoC) (Rev. A) 2021年 3月 3日
User guide Bluetopia Stack Build Guide for Linux PDF | HTML 2021年 1月 15日
User guide CC2564x Demo Applications User's Guide PDF | HTML 2020年 12月 17日
Cybersecurity advisory Bluetooth Basic Rate/Enhanced Data Rate – Bluetooth Impersonation AttackS (BIAS) PDF | HTML 2020年 5月 18日
Cybersecurity advisory Bluetooth Low Energy, Basic Rate/Enhanced Data Rate – Method Confusion Pairing V PDF | HTML 2020年 5月 18日
Application note Capturing Bluetooth Host Controller Interface (HCI) Logs 2019年 1月 7日
White paper Wireless Connectivity For The Internet of Things, One Size Does Not Fit All (Rev. A) 2017年 10月 16日
White paper Which TI Bluetooth® solution should I choose? 2017年 5月 5日
White paper White Paper: Why Classic Bluetooth® (BR/EDR)? 2017年 5月 4日
More literature Streamline the challenges of RF design with certified wireless modules 2017年 1月 25日
Technical article Maximize your IoT design with new dual-mode Bluetooth® + MSP432™ MCU bundle PDF | HTML 2016年 12月 22日
Technical article Driving industrial markets with TI’s dual-mode Bluetooth® module PDF | HTML 2016年 5月 5日
Technical article The dual-mode Bluetooth® module you’ve been waiting for is here PDF | HTML 2016年 2月 17日
More literature Dual-mode Bluetooth CC256x solutions (Rev. C) 2016年 2月 3日
User guide TI Dual-mode Bluetooth Stack on STM32F4 MCUs User Guide PDF | HTML 2015年 7月 8日
User guide Dual-Mode Bluetooth CC2564 Module With Integrated Antenna Evaluation Board 2015年 7月 7日
User guide CC2564MODA Evaluation Board Quick Start Guide 2015年 7月 1日
White paper Three Flavors of Bluetooth: Which One to Choose? 2014年 3月 25日

設計與開發

如需其他條款或必要資源，請按一下下方的任何標題以檢視詳細頁面 (如有)。

開發板

BOOST-CC2564MODA — TMP107 溫度感測器菊輪鍊 BoosterPack™ 插入式模組

The BOOST-CC2564MODA BoosterPack™ plug-in module is intended for evaluation and design purposes of the dual-mode Bluetooth® CC2564 module with integrated antenna (CC2564MODA).  The CC2564MODA module is based on TI's dual-mode Bluetooth® CC2564B Controller, which reduces design (...)

使用指南: PDF
TI.com 無法提供
開發板

CC2564MODAEM — 具有整合式天線的雙模式 Bluetooth® CC2564 模組評估板

The CC2564MODAEM evaluation board contains the Bluetooth BR/EDR/LE HCI solution. Based on TI's CC2564B dual-mode Bluetooth single-chip device, the bCC2564MODA is intended for evaluation and design purposes, reducing design effort and enabling fast time to market.


For a complete evaluation solution, (...)

使用指南: PDF | HTML
TI.com 無法提供
開發板

CC2564MODNEM — 雙模式 Bluetooth® CC2564 模組評估板

The CC2564MODNEM evaluation board contains the CC2564MODN device and is intended for evaluation and design purposes.

For a complete evaluation solution, the CC2564MODNEM board plugs directly into our hardware development kits: MSP-EXP430F5529, MSP-EXP430F5438, DK-TM4C129X and kits for our other (...)

使用指南: PDF
TI.com 無法提供
開發板

CC256XQFNEM — 雙模式藍牙® CC2564 評估板

CC256XQFNEM 評估板包含 CC2564B 裝置，主要用於 CC256x 裝置的評估和設計。

如需完整的評估解決方案，CC256XQFNEM 電路板可直接插入 TI 硬體開發套件：MSP-EXP430F5529、MSP-EXP430F5438、DK-TM4C129X 及其它 MCU。此外，還爲 MSP430 (CC256XMSPBTBLESW)、TM4C12x MCU (CC256XM4BTBLESW) 和其他 MCU (CC256XSTBTBLESW) 提供經認證且免版稅的 TI Bluetooth 堆疊。

CC256XQFNEM 硬體設計檔案 (電路圖、佈線圖與 BOM) (...)

使用指南: PDF
TI.com 無法提供
介面轉接器

CC256XSTBTBLESW — STM32F4 MCU 的 TI 雙模式 Bluetooth® 堆疊

TI's Dual-mode Bluetooth stack on STM32F4 MCUs software for Bluetooth + Bluetooth Low Energy enables the STM32 ARM Cortex M4 and is comprised of Single Mode and Dual Mode offerings implementing the Bluetooth 4.0 specification. The Bluetooth stack is fully qualified for CC256XSTBTBLESW (QDID 69887 (...)

使用指南: PDF | HTML
檢視選項
軟體開發套件 (SDK)

TIBLUETOOTHSTACK-SDK — TI 雙模式 Bluetooth® 堆疊

TI’s dual-mode Bluetooth stack enables Bluetooth + Bluetooth Low Energy and is comprised of Single Mode and Dual Mode offerings implementing the Bluetooth 4.0/4.1/4.2 specification. The Bluetooth stack is fully Bluetooth Special Interest Group (SIG) qualified, certified and royalty-free, (...)

使用指南: PDF | HTML
檢視選項
驅動程式或資料庫

CC256XB-BT-SP — 適用於 CC256xB 的 Bluetooth Service Pack

The package contains Init Scripts (for BT4.0 and BT4.1) and Add-Ons (for Audio/Voice Processing and for BLE support).

CC256x -BT-SP

The CC256x Bluetooth Service Packs (SP) are mandatory initialization scripts that contain bug fixes and platform specific configurations. They must be loaded into the (...)

使用指南: PDF
下載
驅動程式或資料庫

CC256XM4BTBLESW — TM4C MCU 的 TI 雙模式 Bluetooth® 堆疊

TI’s Dual-mode Bluetooth stack on TM4C MCUs software for Bluetooth + Bluetooth Low Energy enables the TM4C12x MCU and is comprised of Single Mode and Dual Mode offerings implementing the Bluetooth 4.0 specification. The Bluetooth stack is fully qualified (QDID 37180 and QDID 42849), provides (...)
使用指南: PDF
下載
驅動程式或資料庫

CC256XMS432BTBLESW — MSP432 MCU 的 TI 雙模式藍牙架構

TI’s Dual-mode Bluetooth stack on MSP432 MCUs software for Bluetooth + Bluetooth Low Energy enables the MSP432 MCU and is comprised of Single Mode and Dual-mode offerings implementing the Bluetooth 4.0 specification. The Bluetooth stack is fully qualified (QDID 69887 and QDID 69886), provides (...)
使用指南: PDF
下載
驅動程式或資料庫

CC256XMSPBTBLESW — MSP430™ MCU 的 TI 雙模式藍牙® 架構

TI’s Dual-mode Bluetooth stack on MSP430™ MCUs software for Bluetooth + Bluetooth Low Energy enables the MSP430 MCU and is comprised of Single Mode and Dual Mode offerings implementing the Bluetooth 4.0 specification. The Bluetooth stack is fully qualified (QDID 37180 and QDID 42849), (...)
使用指南: PDF
下載
驅動程式或資料庫

TI-BT-STACK-LINUX-ADDON — 適用於 AM335x EVM、AM437x EVM 以及具有 WL18xx 和 CC256x 之 BeagleBone 的 TI Bluetooth Linux 外掛程式

This package contains the install package, pre-compiled object and source of the TI Bluetooth Stack and Platform Manager to easily upgrade the default LINUX EZSDK Binary on a AM437x EVM, AM335x EVM or BeagleBone. The software was built with Linaro GCC 4.7 and can be added to Linux SDKs that use (...)
下載
IDE、配置、編譯器或偵錯程式

CCSTUDIO — Code Composer Studio™ integrated development environment (IDE)

Code Composer Studio is an integrated development environment (IDE) for TI's microcontrollers and processors. It comprises a suite of tools used to develop and debug embedded applications.  Code Composer Studio is available for download across Windows®, Linux® and macOS® (...)

支援產品和硬體

支援產品和硬體

此設計資源支援此類別中多數產品。

檢查產品詳細資料頁面以確認支援。
啟動 下載選項
認證

CC256X-CERTIFICATION — 雙模式藍牙的無線電認證

Are you looking for CC256x module certification support? CC256x-CERTIFCATION provides the relevant information and support for successful certification of your product. Within this page you will find the latest certification reports of our Modules as well as our evaluation boards.
檢視選項
認證

CC256X-REPORTS — Reports: CC256x Regulatory Certification Reports

Are you looking for CC256x module certification support? CC256x-CERTIFCATION provides the relevant information and support for successful certification of your product. Within this page you will find the latest certification reports of our Modules as well as our evaluation boards.
支援產品和硬體

支援產品和硬體

產品
Wi-Fi 產品
CC2564 — 具強化資料率 (EDR)、低功耗 LE 和 ANT 的 Bluetooth® 4.0 CC2564C — 具有基本速率 (BR)、強化數據速率 (EDR)、低功耗 (LE) 的 Bluetooth® 5.1 CC2564MODA — 具有整合式天線且具有基本速率、強化數據速率、低功耗 (LE) 模組的 Bluetooth® 4.1 CC2564MODN — 具基本速率 (BR)、強化資料率 (EDR)、低功耗 (LE) 模組的 Bluetooth® 4.1
硬體開發
BOOST-CC2564MODA — TMP107 溫度感測器菊輪鍊 BoosterPack™ 插入式模組 CC2564MODAEM — 具有整合式天線的雙模式 Bluetooth® CC2564 模組評估板 CC2564MODNEM — 雙模式 Bluetooth® CC2564 模組評估板 CC256XCQFN-EM — CC2564C 雙模式藍牙® 控制器評估模組 CC256XQFNEM — 雙模式藍牙® CC2564 評估板
下載選項
設計工具

DUALMODE-BT-DESIGN-REVIEWS — CC256x 裝置的硬體設計審核

To get started with the dual-mode Bluetooth® hardware design review process:
  • Step 1: Before requesting a review, it is important that to review the technical documentation and design & development resources available on the corresponding product page (see CC256x product page links below).
  • Step 2: (...)
使用指南: PDF
要求
Gerber 檔案

CC2564MODAEM Design Files

SWRC317.ZIP (1326 KB)
下載
參考設計

TIDA-00554 — 具有 Bluetooth 連線且適用於可攜式化學分析的 DLP 超行動 NIR 光譜儀

The ultra-mobile near-infrared (NIR) spectrometer reference design utilizes Texas Instruments' DLP technology in conjunction with a single-element InGaAs detector to deliver high performance measurements in a portable form factor that is more affordable than architectures using an expensive InGaAs (...)
Design guide: PDF
電路圖: PDF
參考設計

BT-MSPAUDSINK-RD — Bluetooth 與 MSP430 音訊接收器參考設計

TI's Bluetooth + MSP430 Audio sink reference design can be used by customers to create a variety of applications for low end, low power audio solutions. Some application possibilities - toys, low end bluetooth speakers, audio streaming accessories. This reference design is a cost effective audio (...)
使用指南: PDF
電路圖: PDF
參考設計

CC256XEM-RD — CC256x Bluetooth® 參考設計

This CC256x Bluetooth® evaluation module reference design is an RF reference design with antenna which can be easily connected to many Microcontroller Units (MCUs), such as TI's MSP430 or Tiva C series MCUs. The reference design can be copied into your board, allowing for a cost-effective design (...)
使用指南: PDF
電路圖: PDF
參考設計

BT-MSPAUDSOURCE-RD — 藍牙和 MSP MCU 音訊來源參考設計

The Bluetooth and low-power MSP microcontroller Audio Source reference design can be used by customers to create a variety of applications for low-end, low-power audio source solutions for applications including toys, projectors, smart remotes and any audio streaming accessories. This reference (...)
使用指南: PDF
電路圖: PDF
封裝 引腳 下載
QFM (MOG) 35 檢視選項
適用 TI 的評估品項標準條款與條件。

訂購與品質

內含資訊：
  • RoHS
  • REACH
  • 產品標記
  • 鉛塗層/球物料
  • MSL 等級/回焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 資格摘要
  • 進行中可靠性監測
內含資訊：
  • 晶圓廠位置
  • 組裝地點

建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。

支援與培訓

內含 TI 工程師技術支援的 TI E2E™ 論壇

以英文檢視所有論壇主題

內容係由 TI 和社群貢獻者依「現狀」提供，且不構成 TI 規範。檢視使用條款。

若有關於品質、封裝或訂購 TI 產品的問題，請參閱 TI 支援。​​​​​​​​​​​​​​

影片