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CC2564

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具強化資料率 (EDR)、低功耗 LE 和 ANT 的 Bluetooth® 4.0

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CC2564

現行
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產品詳細資料

Type Transceiver Protocols Dual-mode Bluetooth Security Networking security Features Assisted A2DP/HFP 1.6, BR / EDR / LE, Class 1 TX Power Operating temperature range (°C) -40 to 85 Rating Catalog
Type Transceiver Protocols Dual-mode Bluetooth Security Networking security Features Assisted A2DP/HFP 1.6, BR / EDR / LE, Class 1 TX Power Operating temperature range (°C) -40 to 85 Rating Catalog
VQFNP-MR (RVM) 76 64 mm² 8 x 8
  • TI’s Single-Chip Bluetooth Solution With Bluetooth
    Basic Rate (BR), Enhanced Data Rate (EDR), and
    Low Energy (LE) Support; Available in Two
    Variants:
    • Dual-Mode Bluetooth CC2564 Controller
    • Bluetooth CC2560 Controller
  • CC2564 Bluetooth 4.1 Controller Subsystem
    Qualified (QDID 58852); Compliant up to the HCI
    Layer
  • Highly Optimized for Low-Cost Designs:
    • Single-Ended 50-Ω RF Interface
    • Package Footprint: 76 Terminals, 0.6-mm Pitch,
      8-mm x 8-mm mrQFN
  • BR/EDR Features Include:
    • Up to 7 Active Devices
    • Scatternet: Up to 3 Piconets Simultaneously, 1
      as Master and 2 as Slaves
    • Up to 2 SCO Links on the Same Piconet
    • Support for All Voice Air-Coding – Continuously
      Variable Slope Delta (CVSD), A-Law, µ-Law,
      and Transparent (Uncoded)
    • CC2560B/CC2564B Devices Provide an
      Assisted Mode for HFP 1.6 Wideband Speech
      (WBS) Profile or A2DP Profile to Reduce Host
      Processing and Power
    • Support of Multiple Bluetooth Profiles With
      Enhanced QoS
  • LE Features Include:
    • Support of Up to 10 (CC2564B) Connections
    • Multiple Sniff Instances Tightly Coupled to
      Achieve Minimum Power Consumption
    • Independent Buffering for LE Allows Large
      Numbers of Multiple Connections Without
      Affecting BR/EDR Performance.
    • Built-In Coexistence and Prioritization Handling
      for BR/EDR and LE
  • Best-in-Class Bluetooth (RF) Performance
    (TX Power, RX Sensitivity, Blocking)
    • Class 1 TX Power Up to +10 dBm
    • –95 dbm Typical RX Sensitivity
    • Internal Temperature Detection and
      Compensation to Ensure Minimal Variation in
      RF Performance Over Temperature, No
      External Calibration Required
    • Improved Adaptive Frequency Hopping (AFH)
      Algorithm With Minimum Adaptation Time
    • Provides Longer Range, Including 2x Range
      Over Other LE-Only Solutions
  • Advanced Power Management for Extended
    Battery Life and Ease of Design
    • On-Chip Power Management, Including Direct
      Connection to Battery
    • Low Power Consumption for Active, Standby,
      and Scan Bluetooth Modes
    • Shutdown and Sleep Modes to Minimize Power
      Consumption
  • Physical Interfaces:
    • UART Interface With Support for Maximum
      Bluetooth Data Rates
      • UART Transport Layer (H4) With Maximum
        Rate of 4 Mbps
      • Three-Wire UART Transport Layer (H5) With
        Maximum Rate of 4 Mbps (CC2560B and
        CC2564B Only)
    • Fully Programmable Digital PCM-I2S Codec
      Interface
  • Flexibility for Easy Stack Integration and Validation
    Into Various Microcontrollers, Such as MSP430™
    and ARM® Cortex®-M3 and Cortex®-M4 MCUs
  • CC256x Bluetooth Hardware Evaluation Tool: PC-
    Based Application to Evaluate RF Performance of
    the Device and Configure Service Pack
  • Device Pin-to-Pin Compatible With Previous
    Devices or Modules
  • TI’s Single-Chip Bluetooth Solution With Bluetooth
    Basic Rate (BR), Enhanced Data Rate (EDR), and
    Low Energy (LE) Support; Available in Two
    Variants:
    • Dual-Mode Bluetooth CC2564 Controller
    • Bluetooth CC2560 Controller
  • CC2564 Bluetooth 4.1 Controller Subsystem
    Qualified (QDID 58852); Compliant up to the HCI
    Layer
  • Highly Optimized for Low-Cost Designs:
    • Single-Ended 50-Ω RF Interface
    • Package Footprint: 76 Terminals, 0.6-mm Pitch,
      8-mm x 8-mm mrQFN
  • BR/EDR Features Include:
    • Up to 7 Active Devices
    • Scatternet: Up to 3 Piconets Simultaneously, 1
      as Master and 2 as Slaves
    • Up to 2 SCO Links on the Same Piconet
    • Support for All Voice Air-Coding – Continuously
      Variable Slope Delta (CVSD), A-Law, µ-Law,
      and Transparent (Uncoded)
    • CC2560B/CC2564B Devices Provide an
      Assisted Mode for HFP 1.6 Wideband Speech
      (WBS) Profile or A2DP Profile to Reduce Host
      Processing and Power
    • Support of Multiple Bluetooth Profiles With
      Enhanced QoS
  • LE Features Include:
    • Support of Up to 10 (CC2564B) Connections
    • Multiple Sniff Instances Tightly Coupled to
      Achieve Minimum Power Consumption
    • Independent Buffering for LE Allows Large
      Numbers of Multiple Connections Without
      Affecting BR/EDR Performance.
    • Built-In Coexistence and Prioritization Handling
      for BR/EDR and LE
  • Best-in-Class Bluetooth (RF) Performance
    (TX Power, RX Sensitivity, Blocking)
    • Class 1 TX Power Up to +10 dBm
    • –95 dbm Typical RX Sensitivity
    • Internal Temperature Detection and
      Compensation to Ensure Minimal Variation in
      RF Performance Over Temperature, No
      External Calibration Required
    • Improved Adaptive Frequency Hopping (AFH)
      Algorithm With Minimum Adaptation Time
    • Provides Longer Range, Including 2x Range
      Over Other LE-Only Solutions
  • Advanced Power Management for Extended
    Battery Life and Ease of Design
    • On-Chip Power Management, Including Direct
      Connection to Battery
    • Low Power Consumption for Active, Standby,
      and Scan Bluetooth Modes
    • Shutdown and Sleep Modes to Minimize Power
      Consumption
  • Physical Interfaces:
    • UART Interface With Support for Maximum
      Bluetooth Data Rates
      • UART Transport Layer (H4) With Maximum
        Rate of 4 Mbps
      • Three-Wire UART Transport Layer (H5) With
        Maximum Rate of 4 Mbps (CC2560B and
        CC2564B Only)
    • Fully Programmable Digital PCM-I2S Codec
      Interface
  • Flexibility for Easy Stack Integration and Validation
    Into Various Microcontrollers, Such as MSP430™
    and ARM® Cortex®-M3 and Cortex®-M4 MCUs
  • CC256x Bluetooth Hardware Evaluation Tool: PC-
    Based Application to Evaluate RF Performance of
    the Device and Configure Service Pack
  • Device Pin-to-Pin Compatible With Previous
    Devices or Modules

The TI CC256x device is a complete Bluetooth BR/EDR/LE HCI solution that reduces design effort and enables fast time to market. Based on TI’s seventh-generation Bluetooth core, the CC256x device provides a product-proven solution that is Bluetooth 4.1 compliant. When coupled with a microcontroller unit (MCU), this HCI device offers best-in-class RF performance with a range of about 2X compared to other Bluetooth LE-only solutions. Furthermore, TI’s power-management hardware and software algorithms provide significant power savings in all commonly used Bluetooth BR/EDR/LE modes of operation.

The TI Dual-Mode Bluetooth Stack software is certified and provided royalty free for TI’s MSP430 and ARM Cortex-M3 and Cortex-M4 MCUs. Other MPUs can be supported through TI’s third party. iPod® (MFi) protocol is supported by add-on software packages. For more information, see TI Dual-Mode Bluetooth Stack. Some of the profiles supported include the following:

  • Serial port profile (SPP)
  • Advanced audio distribution profile (A2DP)
  • Audio/video remote control profile (AVRCP)
  • Handsfree profile (HFP)
  • Human interface device (HID)
  • Generic attribute profile (GATT)
  • Several Bluetooth LE profiles and services

In addition to software, this solution consists of multiple reference designs with a low BOM cost, including a new Bluetooth audio sink reference design for customers to create a variety of applications for low-end, low-power audio solutions.

The TI CC256x device is a complete Bluetooth BR/EDR/LE HCI solution that reduces design effort and enables fast time to market. Based on TI’s seventh-generation Bluetooth core, the CC256x device provides a product-proven solution that is Bluetooth 4.1 compliant. When coupled with a microcontroller unit (MCU), this HCI device offers best-in-class RF performance with a range of about 2X compared to other Bluetooth LE-only solutions. Furthermore, TI’s power-management hardware and software algorithms provide significant power savings in all commonly used Bluetooth BR/EDR/LE modes of operation.

The TI Dual-Mode Bluetooth Stack software is certified and provided royalty free for TI’s MSP430 and ARM Cortex-M3 and Cortex-M4 MCUs. Other MPUs can be supported through TI’s third party. iPod® (MFi) protocol is supported by add-on software packages. For more information, see TI Dual-Mode Bluetooth Stack. Some of the profiles supported include the following:

  • Serial port profile (SPP)
  • Advanced audio distribution profile (A2DP)
  • Audio/video remote control profile (AVRCP)
  • Handsfree profile (HFP)
  • Human interface device (HID)
  • Generic attribute profile (GATT)
  • Several Bluetooth LE profiles and services

In addition to software, this solution consists of multiple reference designs with a low BOM cost, including a new Bluetooth audio sink reference design for customers to create a variety of applications for low-end, low-power audio solutions.
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類型 標題 日期
* Data sheet CC256x Dual-Mode Bluetooth Controller datasheet (Rev. E) PDF | HTML 2014年 3月 12日
Application note CE Regulations for SRDs Operating in License-Free 2.4GHz/5GHz Bands-WiFi Devices (Rev. A) PDF | HTML 2022年 10月 20日
Selection guide CC256x Getting Started Selection Guide (Rev. C) PDF | HTML 2022年 5月 13日
Application note DN035 -- Antenna Quick Guide (Rev. B) 2022年 2月 9日
Cybersecurity advisory Bluetooth Basic Rate/Enhanced Data Rate – Bluetooth Impersonation AttackS (BIAS) PDF | HTML 2020年 5月 18日
Cybersecurity advisory Bluetooth Low Energy, Basic Rate/Enhanced Data Rate – Method Confusion Pairing V PDF | HTML 2020年 5月 18日
Application note Capturing Bluetooth Host Controller Interface (HCI) Logs 2019年 1月 7日
Application note CC2564 HFP/HID/SPP Integration Demonstration 2018年 11月 20日
White paper Wireless Connectivity For The Internet of Things, One Size Does Not Fit All (Rev. A) 2017年 10月 16日
White paper Which TI Bluetooth® solution should I choose? 2017年 5月 5日
White paper White Paper: Why Classic Bluetooth® (BR/EDR)? 2017年 5月 4日
Technical article Introducing TI’s dual-mode Bluetooth® 4.2 CC2564C solution PDF | HTML 2016年 12月 13日
Application note CC256XQFN PCB Guidelines (Rev. B) 2016年 10月 28日
User guide CC256x Hardware Design Checklist (Rev. A) 2016年 10月 28日
Technical article Driving industrial markets with TI’s dual-mode Bluetooth® module PDF | HTML 2016年 5月 5日
Technical article The dual-mode Bluetooth® module you’ve been waiting for is here PDF | HTML 2016年 2月 17日
More literature Dual-mode Bluetooth CC256x solutions (Rev. C) 2016年 2月 3日
Technical article A training solution for serious athletes? WHOOP, there it is! PDF | HTML 2016年 1月 4日
User guide Dual-Mode Bluetooth CC2564 Evaluation Board User Guide 2015年 12月 28日
Technical article TI DLP® NIRscan™ Nano Evaluation Module has answers to your handheld near-infrared PDF | HTML 2015年 10月 2日
User guide Dual-Mode Bluetooth CC2564 Evaluation Board Quick Start Guide 2015年 10月 1日
Technical article IML is taking Bluetooth to new heights without leaving the ground PDF | HTML 2015年 9月 24日
Technical article Three reasons why our dual-mode Bluetooth stack is your new go-to software solutio PDF | HTML 2015年 8月 17日
Technical article Understanding wireless connectivity in industrial IoT applications PDF | HTML 2015年 8月 4日
E-book Understanding Wireless Connectivity in the Industrial IoT 2015年 7月 22日
User guide Dual-Mode Bluetooth CC2564 Module With Integrated Antenna Evaluation Board 2015年 7月 7日
User guide CC2564MODA Evaluation Board Quick Start Guide 2015年 7月 1日
User guide CC256x QFN EM User Guide Wiki 2015年 6月 16日
White paper Three Flavors of Bluetooth: Which One to Choose? 2014年 3月 25日
More literature TI: The IoT technology leader 2013年 11月 1日
More literature The Evolution of the Internet of Things 2013年 9月 9日
Application note AN058 -- Antenna Selection Guide (Rev. B) 2010年 10月 6日

設計與開發

如需其他條款或必要資源，請按一下下方的任何標題以檢視詳細頁面 (如有)。

開發板

BOOST-CC2564MODA — TMP107 溫度感測器菊輪鍊 BoosterPack™ 插入式模組

The BOOST-CC2564MODA BoosterPack™ plug-in module is intended for evaluation and design purposes of the dual-mode Bluetooth® CC2564 module with integrated antenna (CC2564MODA).  The CC2564MODA module is based on TI's dual-mode Bluetooth® CC2564B Controller, which reduces design (...)

使用指南: PDF
TI.com 無法提供
開發板

CC2564MODAEM — 具有整合式天線的雙模式 Bluetooth® CC2564 模組評估板

The CC2564MODAEM evaluation board contains the Bluetooth BR/EDR/LE HCI solution. Based on TI's CC2564B dual-mode Bluetooth single-chip device, the bCC2564MODA is intended for evaluation and design purposes, reducing design effort and enabling fast time to market.


For a complete evaluation solution, (...)

使用指南: PDF | HTML
TI.com 無法提供
開發板

CC2564MODNEM — 雙模式 Bluetooth® CC2564 模組評估板

The CC2564MODNEM evaluation board contains the CC2564MODN device and is intended for evaluation and design purposes.

For a complete evaluation solution, the CC2564MODNEM board plugs directly into our hardware development kits: MSP-EXP430F5529, MSP-EXP430F5438, DK-TM4C129X and kits for our other (...)

使用指南: PDF
TI.com 無法提供
開發板

CC256XQFNEM — 雙模式藍牙® CC2564 評估板

CC256XQFNEM 評估板包含 CC2564B 裝置，主要用於 CC256x 裝置的評估和設計。

如需完整的評估解決方案，CC256XQFNEM 電路板可直接插入 TI 硬體開發套件：MSP-EXP430F5529、MSP-EXP430F5438、DK-TM4C129X 及其它 MCU。此外，還爲 MSP430 (CC256XMSPBTBLESW)、TM4C12x MCU (CC256XM4BTBLESW) 和其他 MCU (CC256XSTBTBLESW) 提供經認證且免版稅的 TI Bluetooth 堆疊。

CC256XQFNEM 硬體設計檔案 (電路圖、佈線圖與 BOM) (...)

使用指南: PDF
TI.com 無法提供
開發板

EK-TM4C129EXL — 適用於物聯網應用的 ARM® Cortex®-M4F 架構 MCU TM4C129E Crypto Connected LaunchPad™

Powered by hardware encryption accelerator-enabled MCUs, the  Crypto Connected LaunchPad enables you to develop high performance, data protected, connected IoT applications from secure cloud connection, building/factory automation and smart grid to industrial controls.

The TM4C129E Crypto Connected (...)

使用指南: PDF
TI.com 無法提供
介面轉接器

CC256XSTBTBLESW — STM32F4 MCU 的 TI 雙模式 Bluetooth® 堆疊

TI's Dual-mode Bluetooth stack on STM32F4 MCUs software for Bluetooth + Bluetooth Low Energy enables the STM32 ARM Cortex M4 and is comprised of Single Mode and Dual Mode offerings implementing the Bluetooth 4.0 specification. The Bluetooth stack is fully qualified for CC256XSTBTBLESW (QDID 69887 (...)

使用指南: PDF | HTML
檢視選項
軟體開發套件 (SDK)

TIBLUETOOTHSTACK-SDK — TI 雙模式 Bluetooth® 堆疊

TI’s dual-mode Bluetooth stack enables Bluetooth + Bluetooth Low Energy and is comprised of Single Mode and Dual Mode offerings implementing the Bluetooth 4.0/4.1/4.2 specification. The Bluetooth stack is fully Bluetooth Special Interest Group (SIG) qualified, certified and royalty-free, (...)

使用指南: PDF | HTML
檢視選項
驅動程式或資料庫

CC256XM4BTBLESW — TM4C MCU 的 TI 雙模式 Bluetooth® 堆疊

TI’s Dual-mode Bluetooth stack on TM4C MCUs software for Bluetooth + Bluetooth Low Energy enables the TM4C12x MCU and is comprised of Single Mode and Dual Mode offerings implementing the Bluetooth 4.0 specification. The Bluetooth stack is fully qualified (QDID 37180 and QDID 42849), provides (...)
使用指南: PDF
下載
驅動程式或資料庫

CC256XMS432BTBLESW — MSP432 MCU 的 TI 雙模式藍牙架構

TI’s Dual-mode Bluetooth stack on MSP432 MCUs software for Bluetooth + Bluetooth Low Energy enables the MSP432 MCU and is comprised of Single Mode and Dual-mode offerings implementing the Bluetooth 4.0 specification. The Bluetooth stack is fully qualified (QDID 69887 and QDID 69886), provides (...)
使用指南: PDF
下載
驅動程式或資料庫

CC256XMSPBTBLESW — MSP430™ MCU 的 TI 雙模式藍牙® 架構

TI’s Dual-mode Bluetooth stack on MSP430™ MCUs software for Bluetooth + Bluetooth Low Energy enables the MSP430 MCU and is comprised of Single Mode and Dual Mode offerings implementing the Bluetooth 4.0 specification. The Bluetooth stack is fully qualified (QDID 37180 and QDID 42849), (...)
使用指南: PDF
下載
IDE、配置、編譯器或偵錯程式

CCSTUDIO — Code Composer Studio™ integrated development environment (IDE)

Code Composer Studio is an integrated development environment (IDE) for TI's microcontrollers and processors. It comprises a suite of tools used to develop and debug embedded applications.  Code Composer Studio is available for download across Windows®, Linux® and macOS® (...)

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計算工具

SWRC256 — CC256x 藍牙硬體評估工具

The CC256x Bluetooth Hardware Evaluation Tool is a Texas Instruments (TI) tool which can be downloaded as a complete package from the TI web site. It is a very intuitive, user-friendly tool to evaluate TI's Bluetooth chips. More specifically, it is used to configure the BT chip's properties (...)
檢視選項
認證

CC256X-CERTIFICATION — 雙模式藍牙的無線電認證

Are you looking for CC256x module certification support? CC256x-CERTIFCATION provides the relevant information and support for successful certification of your product. Within this page you will find the latest certification reports of our Modules as well as our evaluation boards.
檢視選項
認證

CC256X-REPORTS — Reports: CC256x Regulatory Certification Reports

Are you looking for CC256x module certification support? CC256x-CERTIFCATION provides the relevant information and support for successful certification of your product. Within this page you will find the latest certification reports of our Modules as well as our evaluation boards.
支援產品和硬體

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產品
Wi-Fi 產品
CC2564 — 具強化資料率 (EDR)、低功耗 LE 和 ANT 的 Bluetooth® 4.0 CC2564C — 具有基本速率 (BR)、強化數據速率 (EDR)、低功耗 (LE) 的 Bluetooth® 5.1 CC2564MODA — 具有整合式天線且具有基本速率、強化數據速率、低功耗 (LE) 模組的 Bluetooth® 4.1 CC2564MODN — 具基本速率 (BR)、強化資料率 (EDR)、低功耗 (LE) 模組的 Bluetooth® 4.1
硬體開發
開發板
BOOST-CC2564MODA — TMP107 溫度感測器菊輪鍊 BoosterPack™ 插入式模組 CC2564MODAEM — 具有整合式天線的雙模式 Bluetooth® CC2564 模組評估板 CC2564MODNEM — 雙模式 Bluetooth® CC2564 模組評估板 CC256XCQFN-EM — CC2564C 雙模式藍牙® 控制器評估模組 CC256XQFNEM — 雙模式藍牙® CC2564 評估板
下載選項
設計工具

3P-WIRELESS-MODULES — 第三方無線模組搜尋工具

The third party wireless module search tool helps developers to identify products that meet their end equipment specifications and procure production ready wireless modules. The third party module vendors included in the search tool are independent third party companies with expertise in designing (...)
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設計工具

DUALMODE-BT-DESIGN-REVIEWS — CC256x 裝置的硬體設計審核

To get started with the dual-mode Bluetooth® hardware design review process:
  • Step 1: Before requesting a review, it is important that to review the technical documentation and design & development resources available on the corresponding product page (see CC256x product page links below).
  • Step 2: (...)
使用指南: PDF
要求
配置圖

CC256x Bluetooth Reference Design Design Files

TIDC065.ZIP (2429 KB)
下載
參考設計

BT-MSPAUDSINK-RD — Bluetooth 與 MSP430 音訊接收器參考設計

TI's Bluetooth + MSP430 Audio sink reference design can be used by customers to create a variety of applications for low end, low power audio solutions. Some application possibilities - toys, low end bluetooth speakers, audio streaming accessories. This reference design is a cost effective audio (...)
使用指南: PDF
電路圖: PDF
參考設計

CC256XEM-RD — CC256x Bluetooth® 參考設計

This CC256x Bluetooth® evaluation module reference design is an RF reference design with antenna which can be easily connected to many Microcontroller Units (MCUs), such as TI's MSP430 or Tiva C series MCUs. The reference design can be copied into your board, allowing for a cost-effective design (...)
使用指南: PDF
電路圖: PDF
參考設計

TIDA-00598 — 適用於 CC256X 藍牙控制器的低雜訊和小體積電源管理參考設計

The TIDA-00598 features a low noise and size optimized power management solution which regulates 5V to 3.3V and 1.8V required to operate the CC256X Bluetooth controller.  These regulated voltage rails can also be used to power other components in the system as microcontroller, level shifters (...)
Design guide: PDF
電路圖: PDF
參考設計

BT-MSPAUDSOURCE-RD — 藍牙和 MSP MCU 音訊來源參考設計

The Bluetooth and low-power MSP microcontroller Audio Source reference design can be used by customers to create a variety of applications for low-end, low-power audio source solutions for applications including toys, projectors, smart remotes and any audio streaming accessories. This reference (...)
使用指南: PDF
電路圖: PDF
封裝 引腳 下載
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