CC3300

Processor External MCU, External MPU Type MCU or MPU attach Protocols Wi-Fi 2.4 GHz Throughput (max) (MBits) 50 Security FW authentication and anti-rollback protection, Networking security (WPA3), Secured host interface Features 802.11ax, AP, COEX, Multirole, STA Operating temperature range (°C) -40 to 105 Rating Catalog

Key Features

• Wi-Fi 6 (802.11ax)

• Bluetooth low energy 5.4 in CC33x1 devices

• Companion IC to any processor or MCU host capable of running a TCP/IP stack

• Integrated 2.4 GHz PA for complete wireless solution with up to +20.5 dBm output power.

• Operating temperature: -40°C to +105°C

• Application throughput up to 50 Mbps

Extended Features

• Wi-Fi 6
  • 2.4 GHz, 20 MHz, single spatial stream
  • MAC, baseband, and RF transceiver with support for IEEE 802.11 b/g/n/ax
  • Target wake time (TWT), OFDMA, MU-MIMO (Downlink), Basic Service Set Coloring, and trigger frame for improved efficiency
  • Hardware-based encryption and decryption supporting WPA2 and WPA3
  • Excellent interoperability
  • Support for 4 bit SDIO or SPI host interfaces

• Bluetooth Low Energy 5.4
  • LE Coded PHYs (Long Range), LE 2M PHY (High Speed) and Advertising Extension
  • Host controller interface (HCI) transport with option for UART or shared SDIO

• Enhanced Security
  • Secured host interface
  • Firmware authentication
  • Anti-rollback protection

• Multirole support (for example, concurrent STA and AP) to connect with Wi-Fi devices on different RF channels (Wi-Fi networks)
• Optional antenna diversity or selection

• 3-wire or 1-wire PTA for external coexistence with additional 2.4-GHz radios (for example, Thread or Zigbee)

• Power Management
  • VMAIN, VIO, Vpp: 1.8 V
  • VPA: 3.3 V
• Clock Sources
  • 40-MHz XTAL fast clock
  • Internal slow clock or external 32.768-kHz slow clock
• Small Package Size
  • Easy to design with 40-pin, 5-mm x 5-mm quad flat noleaded (QFN) package, 0.4-mm pitch