SLASFO8 July   2025 AFE53004W

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics, Voltage Output
    6. 5.6  Electrical Characteristics, Current Output
    7. 5.7  Electrical Characteristics, Comparator Mode
    8. 5.8  Electrical Characteristics, ADC Input
    9. 5.9  Electrical Characteristics, General
    10. 5.10 Timing Requirements, I2C Standard Mode
    11. 5.11 Timing Requirements, I2C Fast Mode
    12. 5.12 Timing Requirements, I2C Fast Mode Plus
    13. 5.13 Timing Requirements, SPI Write Operation
    14. 5.14 Timing Requirements, SPI Read and Daisy Chain Operation (FSDO = 0)
    15. 5.15 Timing Requirements, SPI Read and Daisy Chain Operation (FSDO = 1)
    16. 5.16 Timing Requirements, GPIO
    17. 5.17 Timing Diagrams
    18. 5.18 Typical Characteristics: Voltage Output
    19. 5.19 Typical Characteristics: Current Output
    20. 5.20 Typical Characteristics: ADC
    21. 5.21 Typical Characteristics: Comparator
    22. 5.22 Typical Characteristics: General
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Smart Analog-Front-End Converter (AFE) Architecture
      2. 6.3.2 Digital Input/Output
      3. 6.3.3 Nonvolatile Memory (NVM)
    4. 6.4 Device Functional Modes
      1. 6.4.1  Voltage-Output Mode
        1. 6.4.1.1 Voltage Reference and DAC Transfer Function
          1. 6.4.1.1.1 Internal Reference
          2. 6.4.1.1.2 External Reference
          3. 6.4.1.1.3 Power-Supply as Reference
      2. 6.4.2  Current-Output Mode
      3. 6.4.3  Analog-to-Digital Converter (ADC) Mode
      4. 6.4.4  Comparator Mode
        1. 6.4.4.1 Programmable Hysteresis Comparator
        2. 6.4.4.2 Programmable Window Comparator
      5. 6.4.5  Programmable Slew-Rate Control
      6. 6.4.6  Fault-Dump Mode
      7. 6.4.7  High-Impedance Output and PROTECT Input
      8. 6.4.8  PMBus Compatibility Mode
      9. 6.4.9  Function Generation
        1. 6.4.9.1 Triangular Waveform Generation
        2. 6.4.9.2 Sawtooth Waveform Generation
        3. 6.4.9.3 Sine Waveform Generation
      10. 6.4.10 Device Reset and Fault Management
        1. 6.4.10.1 Power-On Reset (POR)
        2. 6.4.10.2 External Reset
        3. 6.4.10.3 Register-Map Lock
        4. 6.4.10.4 NVM Cyclic Redundancy Check (CRC)
          1. 6.4.10.4.1 NVM-CRC-FAIL-USER Bit
          2. 6.4.10.4.2 NVM-CRC-FAIL-INT Bit
      11. 6.4.11 Power-Down Mode
    5. 6.5 Programming
      1. 6.5.1 SPI Programming Mode
      2. 6.5.2 I2C Programming Mode
        1. 6.5.2.1 F/S Mode Protocol
        2. 6.5.2.2 I2C Update Sequence
          1. 6.5.2.2.1 Address Byte
          2. 6.5.2.2.2 Command Byte
        3. 6.5.2.3 I2C Read Sequence
      3. 6.5.3 General-Purpose Input/Output (GPIO) Modes
  8. 7 Register Map
    1. 7.1  NOP Register (address = 00h) [reset = 0000h]
    2. 7.2  DAC-X-MARGIN-HIGH Register (address = 01h, 07h, 0Dh, 13h) [reset = 0000h]
    3. 7.3  DAC-X-MARGIN-LOW Register (address = 02h, 08h, 0Eh, 14h) [reset = 0000h]
    4. 7.4  DAC-X-VOUT-CMP-CONFIG Register (address = 03h, 09h, 0Fh, 15h) [reset = 0000h]
    5. 7.5  DAC-X-IOUT-MISC-CONFIG Register (address = 04h, 0Ah, 10h, 16h) [reset = 0000h]
    6. 7.6  DAC-X-CMP-MODE-CONFIG Register (address = 05h, 0Bh, 11h, 17h) [reset = 0000h]
    7. 7.7  DAC-X-FUNC-CONFIG Register (address = 06h, 0Ch, 12h, 18h) [reset = 0000h]
    8. 7.8  DAC-X-DATA Register (address = 19h, 1Ah, 1Bh, 1Ch) [reset = 0000h]
    9. 7.9  ADC-CONFIG-TRIG Register (address = 1Dh) [reset = 0000h]
    10. 7.10 ADC-DATA Register (address = 1Eh) [reset = 0000h]
    11. 7.11 COMMON-CONFIG Register (address = 1Fh) [reset = 0FFFh]
    12. 7.12 COMMON-TRIGGER Register (address = 20h) [reset = 0000h]
    13. 7.13 COMMON-DAC-TRIG Register (address = 21h) [reset = 0000h]
    14. 7.14 GENERAL-STATUS Register (address = 22h) [reset = 00h, DEVICE-ID, VERSION-ID]
    15. 7.15 CMP-STATUS Register (address = 23h) [reset = 0000h]
    16. 7.16 GPIO-CONFIG Register (address = 24h) [reset = 0000h]
    17. 7.17 DEVICE-MODE-CONFIG Register (address = 25h) [reset = 0000h]
    18. 7.18 INTERFACE-CONFIG Register (address = 26h) [reset = 0000h]
    19. 7.19 SRAM-CONFIG Register (address = 2Bh) [reset = 0000h]
    20. 7.20 SRAM-DATA Register (address = 2Ch) [reset = 0000h]
    21. 7.21 DAC-X-DATA-8BIT Register (address = 40h, 41h, 42h, 43h) [reset = 0000h]
    22. 7.22 BRDCAST-DATA Register (address = 50h) [reset = 0000h]
    23. 7.23 PMBUS-PAGE Register [reset = 0300h]
    24. 7.24 PMBUS-OP-CMD-X Register [reset = 0000h]
    25. 7.25 PMBUS-CML Register [reset = 0000h]
    26. 7.26 PMBUS-VERSION Register [reset = 2200h]
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • YBH|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.1 Application Information

The AFEx3004W are quad-channel buffered, force-sense output, voltage-output and current-output smart DACs that include an NVM and internal reference, and are available in a tiny 1.76mm × 1.76mm DSBGA package. The external reference must not exceed VDD, either during transient or steady-state conditions. For the best Hi-Z output performance, use a pullup resistor on the VREF pin to VDD. In case the VDD pin remains floating during the off condition, place a 100kΩ resistor to AGND for proper detection of the VDD pin off condition. All the digital outputs are open drain; use external pullup resistors on these pins. The interface protocol is detected at power-on, and the device locks to the protocol as long as VDD is on. In I2C mode, when allocating the I2C addresses in the system, also consider the broadcast address. I2C timeout can be enabled for robustness. SPI mode is three-wire by default. Configure the GPIO pin as SDO in the NVM for SPI readback capability. The SPI clock speed in readback mode is slower than in write mode. Power-down mode sets the DAC outputs in Hi-Z by default. Change the configuration appropriately for different power-down settings. The DAC channels can also power-up with a programmed DAC code in the NVM.