SPRSP65H April   2021  – December 2025 AM2431 , AM2432 , AM2434

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
    1. 3.1 Functional Block Diagram
  5. 4 Device Comparison
    1. 4.1 Related Products
  6. 5 Terminal Configuration and Functions
    1. 5.1 Pin Diagram
      1. 5.1.1 AM243x ALV Pin Diagram
      2. 5.1.2 AM243x ALX Pin Diagram
    2. 5.2 Pin Attributes
      1.      13
      2.      14
      3. 5.2.1 AM243x Package Comparison Table (ALV vs. ALX)
    3. 5.3 Signal Descriptions
      1.      17
      2. 5.3.1  AM243x_ALX Package - Unsupported Interfaces and Signals
      3. 5.3.2  ADC
        1.       MAIN Domain Instances
          1.        21
      4. 5.3.3  CPSW
        1.       MAIN Domain Instances
          1.        24
          2.        25
          3.        26
          4.        27
      5. 5.3.4  CPTS
        1.       MAIN Domain Instances
          1.        30
          2.        31
      6. 5.3.5  DDRSS
        1.       MAIN Domain Instances
          1.        34
      7. 5.3.6  ECAP
        1.       MAIN Domain Instances
          1.        37
          2.        38
          3.        39
      8. 5.3.7  Emulation and Debug
        1.       MAIN Domain Instances
          1.        42
        2.       MCU Domain Instances
          1.        44
      9. 5.3.8  EPWM
        1.       MAIN Domain Instances
          1.        47
          2.        48
          3.        49
          4.        50
          5.        51
          6.        52
          7.        53
          8.        54
          9.        55
          10.        56
      10. 5.3.9  EQEP
        1.       MAIN Domain Instances
          1.        59
          2.        60
          3.        61
      11. 5.3.10 FSI
        1.       MAIN Domain Instances
          1.        64
          2.        65
          3.        66
          4.        67
          5.        68
          6.        69
          7.        70
          8.        71
      12. 5.3.11 GPIO
        1.       MAIN Domain Instances
          1.        74
          2.        75
        2.       MCU Domain Instances
          1.        77
      13. 5.3.12 GPMC
        1.       MAIN Domain Instances
          1.        80
      14. 5.3.13 I2C
        1.       MAIN Domain Instances
          1.        83
          2.        84
          3.        85
          4.        86
        2.       MCU Domain Instances
          1.        88
          2.        89
      15. 5.3.14 MCAN
        1.       MAIN Domain Instances
          1.        92
          2.        93
      16. 5.3.15 SPI (MCSPI)
        1.       MAIN Domain Instances
          1.        96
          2.        97
          3.        98
          4.        99
          5.        100
        2.       MCU Domain Instances
          1.        102
          2.        103
      17. 5.3.16 MMC
        1.       MAIN Domain Instances
          1.        106
          2.        107
      18. 5.3.17 OSPI
        1.       MAIN Domain Instances
          1.        110
      19. 5.3.18 Power Supply
        1.       112
      20. 5.3.19 PRU_ICSSG
        1.       MAIN Domain Instances
          1.        115
          2.        116
      21. 5.3.20 Reserved and No Connect
        1.       118
      22. 5.3.21 SERDES
        1.       MAIN Domain Instances
          1.        121
      23. 5.3.22 System and Miscellaneous
        1. 5.3.22.1 Boot Mode Configuration
          1.        MAIN Domain Instances
            1.         125
        2. 5.3.22.2 Clocking
          1.        MCU Domain Instances
            1.         128
        3. 5.3.22.3 SYSTEM
          1.        MAIN Domain Instances
            1.         131
          2.        MCU Domain Instances
            1.         133
        4. 5.3.22.4 VMON
          1.        135
      24. 5.3.23 TIMER
        1.       MAIN Domain Instances
          1.        138
        2.       MCU Domain Instances
          1.        140
      25. 5.3.24 UART
        1.       MAIN Domain Instances
          1.        143
          2.        144
          3.        145
          4.        146
          5.        147
          6.        148
          7.        149
        2.       MCU Domain Instances
          1.        151
          2.        152
      26. 5.3.25 USB
        1.       MAIN Domain Instances
          1.        155
    4. 5.4 Pin Connectivity Requirements
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Power-On Hours (POH)
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Operating Performance Points
    6. 6.6  Power Consumption Summary
    7. 6.7  Electrical Characteristics
      1. 6.7.1  I2C Open-Drain, and Fail-Safe (I2C OD FS) Electrical Characteristics
      2. 6.7.2  Fail-Safe Reset (FS RESET) Electrical Characteristics
      3. 6.7.3  High-Frequency Oscillator (HFOSC) Electrical Characteristics
      4. 6.7.4  eMMCPHY Electrical Characteristics
      5. 6.7.5  SDIO Electrical Characteristics
      6. 6.7.6  LVCMOS Electrical Characteristics
      7. 6.7.7  ADC12B Electrical Characteristics (ALV package)
      8. 6.7.8  ADC10B Electrical Characteristics (ALX package)
      9. 6.7.9  USB2PHY Electrical Characteristics
      10. 6.7.10 SerDes PHY Electrical Characteristics
      11. 6.7.11 DDR Electrical Characteristics
    8. 6.8  VPP Specifications for One-Time Programmable (OTP) eFuses
      1. 6.8.1 Recommended Operating Conditions for OTP eFuse Programming
      2. 6.8.2 Hardware Requirements
      3. 6.8.3 Programming Sequence
      4. 6.8.4 Impact to Your Hardware Warranty
    9. 6.9  Thermal Resistance Characteristics
      1. 6.9.1 Thermal Resistance Characteristics
    10. 6.10 Temperature Sensor Characteristics
    11. 6.11 Timing and Switching Characteristics
      1. 6.11.1 Timing Parameters and Information
      2. 6.11.2 Power Supply Requirements
        1. 6.11.2.1 Power Supply Slew Rate Requirement
        2. 6.11.2.2 Power Supply Sequencing
          1. 6.11.2.2.1 Power-Up Sequencing
          2. 6.11.2.2.2 Power-Down Sequencing
      3. 6.11.3 System Timing
        1. 6.11.3.1 Reset Timing
        2. 6.11.3.2 Safety Signal Timing
        3. 6.11.3.3 Clock Timing
      4. 6.11.4 Clock Specifications
        1. 6.11.4.1 Input Clocks / Oscillators
          1. 6.11.4.1.1 MCU_OSC0 Internal Oscillator Clock Source
            1. 6.11.4.1.1.1 Load Capacitance
            2. 6.11.4.1.1.2 Shunt Capacitance
          2. 6.11.4.1.2 MCU_OSC0 LVCMOS Digital Clock Source
        2. 6.11.4.2 Output Clocks
        3. 6.11.4.3 PLLs
        4. 6.11.4.4 Recommended System Precautions for Clock and Control Signal Transitions
      5. 6.11.5 Peripherals
        1. 6.11.5.1  CPSW3G
          1. 6.11.5.1.1 CPSW3G MDIO Timing
          2. 6.11.5.1.2 CPSW3G RMII Timing
          3. 6.11.5.1.3 CPSW3G RGMII Timing
          4. 6.11.5.1.4 CPSW3G IOSETs
        2. 6.11.5.2  DDRSS
        3. 6.11.5.3  ECAP
        4. 6.11.5.4  EPWM
        5. 6.11.5.5  EQEP
        6. 6.11.5.6  FSI
        7. 6.11.5.7  GPIO
        8. 6.11.5.8  GPMC
          1. 6.11.5.8.1 GPMC and NOR Flash — Synchronous Mode
          2. 6.11.5.8.2 GPMC and NOR Flash — Asynchronous Mode
          3. 6.11.5.8.3 GPMC and NAND Flash — Asynchronous Mode
          4. 6.11.5.8.4 GPMC0 IOSETs (ALV)
        9. 6.11.5.9  I2C
        10. 6.11.5.10 MCAN
        11. 6.11.5.11 MCSPI
          1. 6.11.5.11.1 MCSPI — Controller Mode
          2. 6.11.5.11.2 MCSPI — Peripheral Mode
        12. 6.11.5.12 MMCSD
          1. 6.11.5.12.1 MMC0 - eMMC Interface
            1. 6.11.5.12.1.1 Legacy SDR Mode
            2. 6.11.5.12.1.2 High Speed SDR Mode
            3. 6.11.5.12.1.3 High Speed DDR Mode
            4. 6.11.5.12.1.4 HS200 Mode
          2. 6.11.5.12.2 MMC1 - SD/SDIO Interface
            1. 6.11.5.12.2.1 Default Speed Mode
            2. 6.11.5.12.2.2 High Speed Mode
            3. 6.11.5.12.2.3 UHS–I SDR12 Mode
            4. 6.11.5.12.2.4 UHS–I SDR25 Mode
            5. 6.11.5.12.2.5 UHS–I SDR50 Mode
            6. 6.11.5.12.2.6 UHS–I DDR50 Mode
            7. 6.11.5.12.2.7 UHS–I SDR104 Mode
        13. 6.11.5.13 CPTS
        14. 6.11.5.14 OSPI
          1. 6.11.5.14.1 OSPI0 PHY Mode
            1. 6.11.5.14.1.1 OSPI0 With PHY Data Training
            2. 6.11.5.14.1.2 OSPI0 Without Data Training
              1. 6.11.5.14.1.2.1 OSPI0 PHY SDR Timing
              2. 6.11.5.14.1.2.2 OSPI0 PHY DDR Timing
          2. 6.11.5.14.2 OSPI0 Tap Mode
            1. 6.11.5.14.2.1 OSPI0 Tap SDR Timing
            2. 6.11.5.14.2.2 OSPI0 Tap DDR Timing
        15. 6.11.5.15 PCIe
        16. 6.11.5.16 PRU_ICSSG
          1. 6.11.5.16.1 PRU_ICSSG Programmable Real-Time Unit (PRU)
            1. 6.11.5.16.1.1 PRU_ICSSG PRU Direct Output Mode Timing
            2. 6.11.5.16.1.2 PRU_ICSSG PRU Parallel Capture Mode Timing
            3. 6.11.5.16.1.3 PRU_ICSSG PRU Shift Mode Timing
            4. 6.11.5.16.1.4 PRU_ICSSG PRU Sigma Delta and Peripheral Interface
              1. 6.11.5.16.1.4.1 PRU_ICSSG PRU Sigma Delta and Peripheral Interface Timing
          2. 6.11.5.16.2 PRU_ICSSG Pulse Width Modulation (PWM)
            1. 6.11.5.16.2.1 PRU_ICSSG PWM Timing
          3. 6.11.5.16.3 PRU_ICSSG Industrial Ethernet Peripheral (IEP)
            1. 6.11.5.16.3.1 PRU_ICSSG IEP Timing
          4. 6.11.5.16.4 PRU_ICSSG Universal Asynchronous Receiver Transmitter (UART)
            1. 6.11.5.16.4.1 PRU_ICSSG UART Timing
          5. 6.11.5.16.5 PRU_ICSSG Enhanced Capture Peripheral (ECAP)
            1. 6.11.5.16.5.1 PRU_ICSSG ECAP Timing
          6. 6.11.5.16.6 PRU_ICSSG RGMII, MII_RT, and Switch
            1. 6.11.5.16.6.1 PRU_ICSSG MDIO Timing
            2. 6.11.5.16.6.2 PRU_ICSSG MII Timing
            3. 6.11.5.16.6.3 PRU_ICSSG RGMII Timing
        17. 6.11.5.17 Timers
        18. 6.11.5.18 UART
        19. 6.11.5.19 USB
      6. 6.11.6 Emulation and Debug
        1. 6.11.6.1 Trace
        2. 6.11.6.2 JTAG
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Processor Subsystems
      1. 7.2.1 Arm Cortex-R5F Subsystem (R5FSS)
      2. 7.2.2 Arm Cortex-M4F (M4FSS)
    3. 7.3 Accelerators and Coprocessors
      1. 7.3.1 Programmable Real-Time Unit Subsystem and Industrial Communication Subsystem (PRU_ICSSG)
    4. 7.4 Other Subsystems
      1. 7.4.1 PDMA Controller
      2. 7.4.2 Peripherals
        1. 7.4.2.1  ADC
        2. 7.4.2.2  DCC
        3. 7.4.2.3  Dual Date Rate (DDR) External Memory Interface (DDRSS)
        4. 7.4.2.4  ECAP
        5. 7.4.2.5  EPWM
        6. 7.4.2.6  ELM
        7. 7.4.2.7  ESM
        8. 7.4.2.8  GPIO
        9. 7.4.2.9  EQEP
        10. 7.4.2.10 General-Purpose Memory Controller (GPMC)
        11. 7.4.2.11 I2C
        12. 7.4.2.12 MCAN
        13. 7.4.2.13 MCRC Controller
        14. 7.4.2.14 MCSPI
        15. 7.4.2.15 MMCSD
        16. 7.4.2.16 OSPI
        17. 7.4.2.17 Peripheral Component Interconnect Express (PCIe)
        18. 7.4.2.18 Serializer/Deserializer (SerDes) PHY
        19. 7.4.2.19 Real Time Interrupt (RTI/WWDT)
        20. 7.4.2.20 Dual Mode Timer (DMTIMER)
        21. 7.4.2.21 UART
        22. 7.4.2.22 Universal Serial Bus Subsystem (USBSS)
  9. 8 Applications, Implementation, and Layout
    1. 8.1 Device Connection and Layout Fundamentals
      1. 8.1.1 Power Supply
        1. 8.1.1.1 Power Supply Designs
        2. 8.1.1.2 Power Distribution Network Implementation Guidance
      2. 8.1.2 External Oscillator
      3. 8.1.3 JTAG, EMU, and TRACE
      4. 8.1.4 Unused Pins
    2. 8.2 Peripheral- and Interface-Specific Design Information
      1. 8.2.1 General Routing Guidelines
      2. 8.2.2 DDR Board Design and Layout Guidelines
      3. 8.2.3 OSPI/QSPI/SPI Board Design and Layout Guidelines
        1. 8.2.3.1 No Loopback, Internal PHY Loopback, and Internal Pad Loopback
        2. 8.2.3.2 External Board Loopback
        3. 8.2.3.3 DQS (only available in Octal SPI devices)
      4. 8.2.4 USB VBUS Design Guidelines
      5. 8.2.5 System Power Supply Monitor Design Guidelines
      6. 8.2.6 High Speed Differential Signal Routing Guidance
      7. 8.2.7 Thermal Solution Guidance
    3. 8.3 Clock Routing Guidelines
      1. 8.3.1 Oscillator Routing
      2. 8.3.2 Oscillator Ground Connection
  10. 9 Device and Documentation Support
    1. 9.1 Device Nomenclature
      1. 9.1.1 Standard Package Symbolization
      2. 9.1.2 Device Naming Convention
    2. 9.2 Tools and Software
    3. 9.3 Documentation Support
      1. 9.3.1 Information About Cautions and Warnings
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Packaging Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • ALV|441
  • ALX|293
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10 Revision History

Changes from May 1, 2024 to December 19, 2025 (from Revision G (MAY 2024) to Revision H (DECEMBER 2025))

  • Global: Removed all IOSETs tables from the Signal Descriptions section as they are already included in the Timing and Switching Characteristics section Go
  • (Features): Updated the Security features to clarify what is supportedGo
  • (Package Information): Updated the table to match the new content standardGo
  • (Functional Block Diagram): Updated PRU-ICSS blocks to include all supported feаtures by the deviceGo
  • (Device Comparison): Corrected the name of the JTAG User ID register and note (2)Go
  • (Device Comparison): Updated GPMC supported memory from 1GB to 128MB and removed the ELM reference from the GPMC instanceGo
  • (Device Comparison): Removed the stand alone Note that references the Device Naming Convention section for more information on device feature codes and applied a similar reference to table notes 3, 5, 7, and 8Go
  • (Related Products): Updated content and added links to additional products to complete the designGo
  • (ALV FCBGA-N441 Pin Diagram): Changed the Pin Diagram from bottom view to top viewGo
  • (ALX FCBGA-N293 Pin Diagram): Changed the Pin Diagram from bottom view to top viewGo
  • (Pin Attributes - BALL STATE DURING RESET RX/TX/PULL): Added "High: The output buffer is enabled and drives VOH" to the TX (Output buffer) description to account for the MMC0_CMD pin reset conditionGo
  • (Pin Attributes - ALV Pins A18 and B18 / ALX Pins B16 and B15): Changed the value from "IO" to "IOD" in the "TYPE" column to indicate this signal function is only able to operate as an open-drain IOGo
  • (Pin Attributes - ALV Pins J16 and J15): Added values to the "IO OPERATION VOLTAGE", "POWER", and "BUFFER TYPE" columnsGo
  • (Pin Attributes - ALV Pins AA20, AA19, U16, U17, and T14 / ALX Pins AA17, AA16, Y17, W17, and V18): Removed the VDDA_0P85_USB0 core power rail from the "POWER" column since the USB0 IO operating voltage is unrelated to this core power railGo
  • (Pin Attributes - ALV Pin N21 / ALX pin M21): Changed the RX value for the OSPI0_LBCLKO pin from "On" to "Off" in the "BALL STATE AFTER RESET RX/TX/PULL" column to indicate the correct default state of the input buffer after resetGo
  • (Pin Attributes - ALV Pins J21, G19, K20, J20, J18, J17, H17, H19, H18, and G17): Removed value from the "DSIS" column since this information only applies to multiplexed signal functionsGo
  • (Pin Attributes - ALV Pin J21): Changed the TX value for the MMC0_CMD pin from "Off" to "High" in the "BALL STATE DURING RESET RX/TX/PULL" column to indicate the correct default state of the output buffer during resetGo
  • (Pin Attributes - ALV Pins T13, W16, W17, Y15, Y16, AA16, and AA17): Removed the VDDA_0P85_SERDES0 and VDDA_0P85_SERDES0_C core power rails from the "POWER" column since the SERDES0 IO operating voltage is unrelated to these core power railsGo
  • (Pin Attributes - ALV Pins F18, G18, J21, G19, K20, J20, J18, J17, H17, H19, H18, and G17): Removed the VDD_MMC0 and VDD_DLL_MMC0 core power rails from the "POWER" column since the MMC0 IO operating voltage is unrelated to these core power railsGo
  • (AM243x_ALX Package - Unsupported Peripheral Interfaces and Signals Table): Updated the names of several PERIPHERAL INSTANCES to match the Signal Descriptions table names and updated the list of MISCELLANEOUS SIGNALSGo
  • (ADC): Added note, highlighting GPI signal function support in the ADCGo
  • (Signal Descriptions - ADC0): Added a note to the ADC_EXT_TRIGGER0 and ADC_EXT_TRIGGER1 signals to indicate they have a debounce function Go
  • (Signal Descriptions - ADC0): Updated table notes associated with the ADC0_REFN, ADC0_REFP, and ADC0_AIN[7:0] signals Go
  • (Signal Descriptions - EPWM0): Corrected EHRPWM0_SYNCO signal descriptionGo
  • (Signal Descriptions - EPWM3): Corrected EHRPWM3_SYNCO signal descriptionGo
  • (Signal Descriptions - EPWM6): Corrected EHRPWM6_SYNCO signal descriptionGo
  • (GPIO0 Signal Descriptions): Added a note to the GPIO0_43 signal to indicate it has a debounce functionGo
  • (Signal Descriptions - Power Supply): Updated the table notes associated with the CAP_VDDSx pins to clarify the need for capacitance derating and describe additional connectivity options Go
  • (Signal Descriptions - Power Supply): Updated the description of several power rails to clarify their function and changed the signal type for VDDA_TEMP1 from "A" to "PWR"Go
  • (PRU_ICSSG): Added a note, highlighting the second layer of signal multiplexing implemented within PRU_ICSSGGo
  • (Signal Descriptions - Power Supply): Updated the description of the EXT_REFCLK1 signal functionGo
  • (Signal Descriptions - MCU System): Updated the description of the MCU_PORz signal functionGo
  • (Signal Descriptions - VMON): Changed the VMON_3P3_SOC Signal Type from "PWR" to "A"Go
  • (Pin Connectivity Requirements): Updated the connectivity requirements description for the I2C0 and MCU_I2C0 balls to allow connecting external pull-down resistors when selecting GPIO signal functionsGo
  • (Pin Connectivity Requirements): Updated the connectivity requirements description for the VMON_1P8_MCU, VMON_1P8_SOC, VMON_3P3_MCU, and VMON_3P3_SOC ballsGo
  • (Absolute Maximum Ratings): Updated the description of several power rails to clarify their functionGo
  • (Recommended Operating Conditions): Replaced the VPP parameter values with a note that points to the Recommended Operating Conditions for OTP eFuse Programming tableGo
  • (Recommended Operating Conditions): Updated the description of several power rails to clarify their functionGo
  • (Recommended Operating Conditions): Added new row next to Tj parameter, labeled "125°C Industrial" with a values -40°C to 125°C and changed the maximum temperature value for the "Extended Industrial" from 125°C to 105°CGo
  • (Recommended Operating Conditions): Removed the statement “when MMC0 is not used” from note (2), since the device does not support 0.75V operation.Go
  • (I2C Open-Drain, and Fail-Safe Electrical Characteristics) Added a table note to the Input Leakage Current parameterGo
  • (I2C Open-Drain, and Fail-Safe Electrical Characteristics) Separated the Input Leakage Current Test Conditions into two rowsGo
  • (Fail-Safe Reset Electrical Characteristics) Added a table note to the Input Leakage Current parameterGo
  • (Fail-Safe Reset Electrical Characteristics) Separated the Input Leakage Current Test Conditions into two rowsGo
  • (High-Frequency Oscillator Electrical Characteristics) Added a table note to the Input Leakage Current parameterGo
  • (High-Frequency Oscillator Electrical Characteristics) Separated the Input Leakage Current Test Conditions into two rowsGo
  • (eMMCPHY Electrical Characteristics) Added a table note to the Input Leakage Current parameterGo
  • (eMMCPHY Electrical Characteristics) Separated the Input Leakage Current Test Conditions into two rowsGo
  • (SDIO Electrical Characteristics) Added a table note to the Input Leakage Current parameterGo
  • (SDIO Electrical Characteristics) Separated the Input Leakage Current Test Conditions into two rowsGo
  • (LVCMOS Electrical Characteristics) Added a table note to the Input Leakage Current parameterGo
  • (LVCMOS Electrical Characteristics) Separated the Input Leakage Current Test Conditions into two rowsGo
  • (ADC12B Electrical Characteristics) Added a table note to the General Purpose Input Leakage Current parameterGo
  • (ADC12B Electrical Characteristics) Separated the Input Leakage Current Test Conditions into two rowsGo
  • (Recommended Operating Conditions for OTP eFuse Programming): Removed the OPP NOM (BOOT) reference from the VDD_CORE parameter description, and changed the VPP Slew Rate description to clarify it only applies to power-upGo
  • (Impact to Your Hardware Warranty): Updated/Changed the "Consequently, TI will have no …" sentence in the paragraphGo
  • (Thermal Resistance Characteristics): Added NoteGo
  • (Temperature Sensor Characteristics): Added new section to define Voltage and Temperature Module (VTM) on die temperature sensor characteristicsGo
  • (Timing and Switching Characteristics): Removed note regarding silicon characterization results. Updated note explaining that the default PADCONFIG slew rate and drive strength settings must be used to ensure the timing values given in this section are valid. Go
  • (Power-Up Sequencing): Added note to clarify power rails must decay below 300mv before initiating a new power-up sequenceGo
  • (Power-Up Sequencing): Added Power-Up Sequencing – Supply / Signal Assignments table with waveform references and notes. Removed VDDSHV5 references from Note 3 and Note 5 since this power rail is described in Note 7. Added new Note 8 to define VDDA3P3_SDIO options in different use cases and updated Note 7 to clarify power-up and power-down without dependency on other power rails. Updated Note 10 to include the VDDA_0P85_USB0, VDDA_0P85_SERDES0, VDDA_0P85_SERDES0_C, VDD_MMC0, and VDDA_DLL_MMC0 power rails. Updated power-up sequencing diagram to replace power rail names with waveform reference letters defined in the new tableGo
  • (Power-Down Sequencing): Added note to clarify power rails must decay below 300mv before initiating a new power-up sequenceGo
  • (Power-Down Sequencing): Added Power-Down Sequencing – Supply / Signal Assignments table with waveform references and notes. Removed VDDSHV5 references from Note 1 and Note 2 since this power rail is described in Note 3. Added new Note 4 to define VDDA3P3_SDIO options in different use cases and updated Note 3 to clarify power-up and power-down without dependency on other power rails. Added new Note 5 to clarify connectivity expectations. Updated Note 6 to include the VDDA_0P85_USB0, VDDA_0P85_SERDES0, VDDA_0P85_SERDES0_C, VDD_MMC0, and VDDA_DLL_MMC0 power rails. Updated the Power-Down Sequencing diagram to show it is possible for the system power to remain turned on while the device power management solution is turned off, and also show it is possible for MCU_PORz to be asserted before the supplies begin to sequence off. Updated power-down sequencing diagram to replace power rail names with waveform reference letters defined in the new tableGo
  • (BOOTMODE Timing Requirements): Updated the description for parameters RST23 and RST24Go
  • (MCU_OSC0 Switching Characteristics - Crystal Mode): Added capacitance values for the ALX packageGo
  • (MCU_OSC0 LVCMOS Digital Clock Source): Updated this section to include additional notes and the MCU_OSC0 LVCMOS Digital Clock Source Requirements tableGo
  • (PLLs): Updated the PLL names to include its number reference used in the TRMGo
  • (CPSW3G RMII Timing Conditions): Changed the maximum input slew rate for both operating voltagesGo
  • (CPSW3G RGMII Timing Conditions): Added operating voltage conditions to the Input Slew Rate parameter to allow a relaxed slew rate when operating at 1.8VGo
  • (ECAP – Timing Requirements and Switching Characteristics): Updated the clock source referenced in table note 1Go
  • (EPWM – Timing Requirements and Switching Characteristics): Updated the clock source referenced in table note 1Go
  • (EQEP – Timing Requirements): Updated the clock source referenced in table note 1Go
  • (GPIO Timing Conditions): Updated the Input slew rate parameter to include operating voltage with relaxed minimum values and corrected a typographical error on the maximum value of the I2C OD FS buffer type operating at 3.3V. The previous maximum value of 0.8V/ns should have been 0.08V/ns for it to be equivalent to the maximum value of 8E+7 defined in the Electrical Characteristics table for the I2C OD FS bufferGo
  • (GPIO Timing Requirements): Removed the operating voltage condition and updated the minimum value for the Pulse width parameter to account for the relaxed minimum Input slew rate defined in the GPIO Timing Conditions tableGo
  • (I2C Timing): Corrected a typographical error where the value of 0.8 in the description should have been 0.08, which is equivalent to the value of 8E+7 defined in the Electrical Characteristics table for the I2C OD FS bufferGo
  • (I2C Timing): Added a note that describes IOSETs associated with pin multiplexing of I2C2 signal functionsGo
  • (MCSPI Switching Characteristics - Controller Mode): Changed all instances of MSPI to MCSPI in table notes 2, 3, 4, and 5Go
  • (MMC0 DLL Delay Mapping for All Timing Modes): Changed the register names, added a new column for ENDLL, changed the OTAPDLYENA, SELDLYTXCLK, and FRQSEL values for Legacy SDR and High Speed SDR, and changed the CLKBUFSEL values for High Speed DDR and HS200 modesGo
  • (HS200 Mode): Added "MMC0 Timing RequirementsGo
  • (MMC1 DLL Delay Mapping for All Timing Modes): Changed the register name, changed the OTAPDLYENA and OTAPDLYSEL values for Default Speed and High Speed modes, and removed the CLKBUFSEL column because this register bit field doesn't provide any functionGo
  • (OSPI0 DLL Delay Mapping for PHY Data Training): Added a delay value for the "PHY_MASTER_PHASE_DETECT_SELECTOR_FLD" register bit fieldGo
  • (OSPI Switching Characteristics – PHY Data Training): Corrected the formulas associated with timing parameter O5Go
  • (OSPI0 DLL Delay Mapping for PHY SDR Timing Modes): Added a delay value for the "PHY_MASTER_PHASE_DETECT_SELECTOR_FLD" register bit fieldGo
  • (OSPI0 Switching Characteristics – PHY SDR Mode): Corrected the formulas associated with timing parameters O10 and O11Go
  • (OSPI0 DLL Delay Mapping for PHY DDR Timing Modes): Added a delay value for the "PHY_MASTER_PHASE_DETECT_SELECTOR_FLD" register bit fieldGo
  • (OSPI0 Switching Characteristics – PHY DDR Mode): Corrected the formulas associated with timing parameters O4 and O5Go
  • (PRU_ICSSG PRU Timing Requirements – Sigma Delta Mode): Updated the description for parameter PRSD4Go
  • (Power Supply Designs): Updated to reflect the latest power supply design guidelinesGo
  • (Device Naming Convention): Added title to Device Nomenclature tableGo
  • (Device Naming Convention): Updated the description for Feature code "E" to clarify support for hardware auto-forwarding feature required by some Ethernet protocolsGo
  • (Device Naming Convention): Changed the row labeled "Industrial" (-40°C to 105°C) to "Extended Industrial", and the row labeled "Extended Industrial" (-40°C to 125°C) to "125°C Industrial"Go
  • (Tools and Software): Added clarification regarding the SysConfig featuresGo