SLUSCS3J October   2017  – December 2022 BQ2980 , BQ2982

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
      1. 8.1.1 Device Configurability
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Overvoltage (OV) Status
      2. 8.3.2 Undervoltage (UV) Status
      3. 8.3.3 Overcurrent in Charge (OCC) Status
      4. 8.3.4 Overcurrent in Discharge (OCD) and Short Circuit in Discharge (SCD) Status
      5. 8.3.5 Overtemperature (OT) Status
      6. 8.3.6 Charge and Discharge Driver
      7. 8.3.7 CTR for FET Override and Device Shutdown
      8. 8.3.8 CTR for PTC Connection
      9. 8.3.9 ZVCHG (0-V Charging)
    4. 8.4 Device Functional Modes
      1. 8.4.1 Power Modes
        1. 8.4.1.1 Power-On-Reset (POR)
        2. 8.4.1.2 NORMAL Mode
        3. 8.4.1.3 FAULT Mode
        4. 8.4.1.4 SHUTDOWN Mode
  9. Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Test Circuits for Device Evaluation
      2. 9.1.2 Test Circuit Diagrams
      3. 9.1.3 Using CTR as FET Driver On/Off Control
    2. 9.2 Typical Applications
      1. 9.2.1 BQ298x Configuration 1: System-Controlled Reset/Shutdown Function
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Selection of Power FET
        4. 9.2.1.4 Application Curves
      2. 9.2.2 BQ298x Configuration 2: CTR Function Disabled
      3. 9.2.3 BQ298x Configuration 3: PTC Thermistor Protection
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Third-Party Products Disclaimer
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Device Configurability

Table 8-1 provides guidance on possible configurations of the BQ2980 and BQ2982 devices.

Note:

Texas Instruments preprograms devices: Devices are not intended to be further customized by the customer.

Table 8-1 Device Configuration Range
FAULTRANGESTEP SIZEUNITDELAY SELECTIONCHG, DSG STATUSRECOVERY DESCRIPTION
(Non-Configurable)
OVOvervoltage3750 – 520050mV0.25, 1, 1.25, 4.5 sCHG OFF(200-mV hysteresis AND charger removal) OR
(below OV threshold AND discharge load is detected)
UVUndervoltage2200 – 300050mV20, 96, 125, 144 msOption 1:
UV_SHUT enable
The device goes into SHUTDOWN.
(200-mV hysteresis AND discharge load is removed before device shuts down) OR
(above UV threshold AND charger connection)
Option 2:
UV_SHUT disable
DSG off, power consumption drops to IFETOFF, and the device does not shut down.
(200-mV hysteresis) OR
(above UV threshold AND charger connection)
OCCOvercurrent in Charge–64 – –42mV8, 16, 20, 48 msCHG OFFDetect a charger removal
(VBAT – VPACK) > 100-mV typical
OCDOvercurrent in Discharge4 – 642mV DSG OFFDetect a discharge load removal
(VBAT – VPACK) < 400-mV typical
SCDShort circuit in discharge10, 20, 30, 40, 60, 120, 200mVFixed 250 µs
OTOvertemperature (through internal temperature sensor)75, 85°CFixed 4.5 sCHG and DSG OFFFixed 15°C hysteresis
OT
(PTC)
Internal pull-up resistor for OT with PTC
(through external PTC on CTR pin)
1.5, 5, 8CHG and DSG OFFVoltage on CTR pin drops below CTR VIL level