SWRS272F April   2023  – November 2025 CC2340R2 , CC2340R5

PRODMIX  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Functional Block Diagram
  6. 5 Device Comparison
  7. 6 Pin Configurations and Functions
    1. 6.1 Pin Diagrams
      1. 6.1.1 Pin Diagram—RKP Package (Top View)
      2. 6.1.2 Pin Diagram—RGE Package (Top View)
      3. 6.1.3 Pin Diagram—YBG Package (Top View)
    2.     12
    3. 6.2 Signal Descriptions
      1.      14
      2.      15
      3.      16
      4.      17
      5.      18
      6.      19
      7.      20
      8.      21
      9.      22
      10.      23
      11.      24
      12.      25
      13.      26
      14.      27
      15.      28
      16.      29
      17.      30
      18.      31
    4. 6.3 Connections for Unused Pins and Modules
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  DCDC
    5. 7.5  Global LDO (GLDO)
    6. 7.6  Power Supply and Modules
    7. 7.7  Battery Monitor
    8. 7.8  Temperature Sensor
    9. 7.9  Power Consumption–Power Modes
    10. 7.10 Power Consumption–Radio Modes
    11. 7.11 Nonvolatile (Flash) Memory Characteristics
    12. 7.12 Thermal Resistance Characteristics
    13. 7.13 RF Frequency Bands
    14. 7.14 Bluetooth Low Energy–Receive (RX)
    15. 7.15 Bluetooth Low EnergyTransmit (TX)
    16. 7.16 Zigbee and Thread - IEEE 802.15.4-2006 2.4 GHz (OQPSK DSSS1:8, 250 kbps) - RX
    17. 7.17 Zigbee and Thread - IEEE 802.15.4-2006 2.4 GHz (OQPSK DSSS1:8, 250 kbps) - TX
    18. 7.18 Proprietary Radio Modes
    19. 7.19 2.4GHz RX/TX CW
    20. 7.20 Timing and Switching Characteristics
      1. 7.20.1 Reset Timing
      2. 7.20.2 Wakeup Timing
      3. 7.20.3 Clock Specifications
        1. 7.20.3.1 48MHz Crystal Oscillator (HFXT)
        2. 7.20.3.2 48MHz RC Oscillator (HFOSC)
        3. 7.20.3.3 32kHz Crystal Oscillator (LFXT)
        4. 7.20.3.4 32kHz RC Oscillator (LFOSC)
    21. 7.21 Peripheral Characteristics
      1. 7.21.1 UART
        1. 7.21.1.1 UART Characteristics
      2. 7.21.2 SPI
        1. 7.21.2.1 SPI Characteristics
        2. 7.21.2.2 SPI Controller Mode
        3. 7.21.2.3 SPI Timing Diagrams—Controller Mode
        4. 7.21.2.4 SPI Peripheral Mode
        5. 7.21.2.5 SPI Timing Diagrams—Peripheral Mode
      3. 7.21.3 I2C
        1. 7.21.3.1 I2C
        2. 7.21.3.2 I2C Timing Diagram
      4. 7.21.4 GPIO
        1. 7.21.4.1 GPIO DC Characteristics
      5. 7.21.5 ADC
        1. 7.21.5.1 Analog-to-Digital Converter (ADC) Characteristics
      6. 7.21.6 Comparators
        1. 7.21.6.1 Ultra-Low Power Comparator
    22. 7.22 Typical Characteristics
      1. 7.22.1 MCU Current
      2. 7.22.2 RX Current
      3. 7.22.3 TX Current
      4. 7.22.4 RX Performance
      5. 7.22.5 TX Performance
      6. 7.22.6 ADC Performance
  9. 8 Detailed Description
    1. 8.1  Overview
    2. 8.2  System CPU
    3. 8.3  Radio (RF Core)
      1. 8.3.1 Bluetooth Low Energy
      2. 8.3.2 802.15.4 (Thread and Zigbee)
    4. 8.4  Memory
    5. 8.5  Cryptography
    6. 8.6  Timers
    7. 8.7  Serial Peripherals and I/O
    8. 8.8  Battery and Temperature Monitor
    9. 8.9  µDMA
    10. 8.10 Debug
    11. 8.11 Power Management
    12. 8.12 Clock Systems
    13. 8.13 Network Processor
  10. 9 Application, Implementation, and Layout
    1. 9.1 Reference Designs
    2. 9.2 Junction Temperature Calculation
  11. 10Device and Documentation Support
    1. 10.1 Device Nomenclature
    2. 10.2 Tools and Software
      1. 10.2.1 SimpleLink™ Microcontroller Platform
    3. 10.3 Documentation Support
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RGE|24
  • YBG|28
  • RKP|40
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.1 Reference Designs

The following reference designs should be followed closely when implementing designs using the CC2340R devices.

Special attention must be paid to RF component placement, decoupling capacitors, and DCDC regulator components, as well as ground connections for all of these.

    LP-EM-CC2340R5 Design Files The CC2340R5 LaunchPad Design Files contain detailed schematics and layouts to build application-specific boards using the CC2340R devices in the 5mm x 5mm RKP package.
    LP-EM-CC2340R53 Design Files The CC2340R53 LaunchPad Design Files contain detailed schematics and layouts to build application-specific boards using the CC2340R devices in the 5mm x 5mm RKP package.
    LP-EM-CC2340R5-RGE-4x4-IS24 Design Files The CC2340R5 RGE 4x4 LaunchPad Design Files contain detailed schematics and layouts to build application-specific boards using the CC2340R devices in the 4mm x 4mm RGE package. The CC2340R5x and CC2340R2x devices in RGE packages are pin-to-pin compatible.
    LP-EM-CC2340R53-BG The CC2340R5 YBG WCSP LaunchPad Design Files contain detailed schematics and layouts to build application-specific boards using the CC2340R devices in the WCSP YBG package.
    Sub1 GHz and 2.4 GHz Antenna Kit for LaunchPad™ Development Kit and SensorTag The antenna kit allows real-life testing to identify the optimal antenna for your application. The antenna kit includes 16 antennas for frequencies from 169MHz to 2.4GHz, including:
    • PCB antennas
    • Helical antennas
    • Chip antennas
    • Dualband antennas for 868MHz and 915MHz combined with 2.4GHz
    The antenna kit includes a JSC cable to connect to the Wireless MCU LaunchPad Development Kits and SensorTags.