SWRS272F April   2023  – November 2025 CC2340R2 , CC2340R5

PRODMIX  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Functional Block Diagram
  6. 5 Device Comparison
  7. 6 Pin Configurations and Functions
    1. 6.1 Pin Diagrams
      1. 6.1.1 Pin Diagram—RKP Package (Top View)
      2. 6.1.2 Pin Diagram—RGE Package (Top View)
      3. 6.1.3 Pin Diagram—YBG Package (Top View)
    2.     12
    3. 6.2 Signal Descriptions
      1.      14
      2.      15
      3.      16
      4.      17
      5.      18
      6.      19
      7.      20
      8.      21
      9.      22
      10.      23
      11.      24
      12.      25
      13.      26
      14.      27
      15.      28
      16.      29
      17.      30
      18.      31
    4. 6.3 Connections for Unused Pins and Modules
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  DCDC
    5. 7.5  Global LDO (GLDO)
    6. 7.6  Power Supply and Modules
    7. 7.7  Battery Monitor
    8. 7.8  Temperature Sensor
    9. 7.9  Power Consumption–Power Modes
    10. 7.10 Power Consumption–Radio Modes
    11. 7.11 Nonvolatile (Flash) Memory Characteristics
    12. 7.12 Thermal Resistance Characteristics
    13. 7.13 RF Frequency Bands
    14. 7.14 Bluetooth Low Energy–Receive (RX)
    15. 7.15 Bluetooth Low EnergyTransmit (TX)
    16. 7.16 Zigbee and Thread - IEEE 802.15.4-2006 2.4 GHz (OQPSK DSSS1:8, 250 kbps) - RX
    17. 7.17 Zigbee and Thread - IEEE 802.15.4-2006 2.4 GHz (OQPSK DSSS1:8, 250 kbps) - TX
    18. 7.18 Proprietary Radio Modes
    19. 7.19 2.4GHz RX/TX CW
    20. 7.20 Timing and Switching Characteristics
      1. 7.20.1 Reset Timing
      2. 7.20.2 Wakeup Timing
      3. 7.20.3 Clock Specifications
        1. 7.20.3.1 48MHz Crystal Oscillator (HFXT)
        2. 7.20.3.2 48MHz RC Oscillator (HFOSC)
        3. 7.20.3.3 32kHz Crystal Oscillator (LFXT)
        4. 7.20.3.4 32kHz RC Oscillator (LFOSC)
    21. 7.21 Peripheral Characteristics
      1. 7.21.1 UART
        1. 7.21.1.1 UART Characteristics
      2. 7.21.2 SPI
        1. 7.21.2.1 SPI Characteristics
        2. 7.21.2.2 SPI Controller Mode
        3. 7.21.2.3 SPI Timing Diagrams—Controller Mode
        4. 7.21.2.4 SPI Peripheral Mode
        5. 7.21.2.5 SPI Timing Diagrams—Peripheral Mode
      3. 7.21.3 I2C
        1. 7.21.3.1 I2C
        2. 7.21.3.2 I2C Timing Diagram
      4. 7.21.4 GPIO
        1. 7.21.4.1 GPIO DC Characteristics
      5. 7.21.5 ADC
        1. 7.21.5.1 Analog-to-Digital Converter (ADC) Characteristics
      6. 7.21.6 Comparators
        1. 7.21.6.1 Ultra-Low Power Comparator
    22. 7.22 Typical Characteristics
      1. 7.22.1 MCU Current
      2. 7.22.2 RX Current
      3. 7.22.3 TX Current
      4. 7.22.4 RX Performance
      5. 7.22.5 TX Performance
      6. 7.22.6 ADC Performance
  9. 8 Detailed Description
    1. 8.1  Overview
    2. 8.2  System CPU
    3. 8.3  Radio (RF Core)
      1. 8.3.1 Bluetooth Low Energy
      2. 8.3.2 802.15.4 (Thread and Zigbee)
    4. 8.4  Memory
    5. 8.5  Cryptography
    6. 8.6  Timers
    7. 8.7  Serial Peripherals and I/O
    8. 8.8  Battery and Temperature Monitor
    9. 8.9  µDMA
    10. 8.10 Debug
    11. 8.11 Power Management
    12. 8.12 Clock Systems
    13. 8.13 Network Processor
  10. 9 Application, Implementation, and Layout
    1. 9.1 Reference Designs
    2. 9.2 Junction Temperature Calculation
  11. 10Device and Documentation Support
    1. 10.1 Device Nomenclature
    2. 10.2 Tools and Software
      1. 10.2.1 SimpleLink™ Microcontroller Platform
    3. 10.3 Documentation Support
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RGE|24
  • YBG|28
  • RKP|40
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.3.1 Bluetooth Low Energy

The RF Core offers full support for Bluetooth Low Energy, including the high-speed 2Mbps physical layer and the 500kbps and 125kbps long-range PHYs (Coded PHY) through the TI-provided Bluetooth stack or through a high-level Bluetooth API.

The new high-speed mode allows data transfers up to 2Mbps. In addition to faster speeds, this mode offers significant improvements in energy efficiency and wireless coexistence with reduced radio communication time.

Bluetooth LE also enables unparalleled flexibility for adjustment of speed and range based on application needs, which capitalizes on the high-speed or long-range modes, respectively. Data transfers are now possible at 2Mbps, enabling the development of applications using voice, audio, imaging, and data logging that were not previously an option using Bluetooth low energy. With high-speed mode, existing applications deliver faster responses, richer engagement, and longer battery life. Bluetooth LE enables fast, reliable firmware updates.