SWRS272F April   2023  – November 2025 CC2340R2 , CC2340R5

PRODMIX  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Functional Block Diagram
  6. 5 Device Comparison
  7. 6 Pin Configurations and Functions
    1. 6.1 Pin Diagrams
      1. 6.1.1 Pin Diagram—RKP Package (Top View)
      2. 6.1.2 Pin Diagram—RGE Package (Top View)
      3. 6.1.3 Pin Diagram—YBG Package (Top View)
    2.     12
    3. 6.2 Signal Descriptions
      1.      14
      2.      15
      3.      16
      4.      17
      5.      18
      6.      19
      7.      20
      8.      21
      9.      22
      10.      23
      11.      24
      12.      25
      13.      26
      14.      27
      15.      28
      16.      29
      17.      30
      18.      31
    4. 6.3 Connections for Unused Pins and Modules
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  DCDC
    5. 7.5  Global LDO (GLDO)
    6. 7.6  Power Supply and Modules
    7. 7.7  Battery Monitor
    8. 7.8  Temperature Sensor
    9. 7.9  Power Consumption–Power Modes
    10. 7.10 Power Consumption–Radio Modes
    11. 7.11 Nonvolatile (Flash) Memory Characteristics
    12. 7.12 Thermal Resistance Characteristics
    13. 7.13 RF Frequency Bands
    14. 7.14 Bluetooth Low Energy–Receive (RX)
    15. 7.15 Bluetooth Low EnergyTransmit (TX)
    16. 7.16 Zigbee and Thread - IEEE 802.15.4-2006 2.4 GHz (OQPSK DSSS1:8, 250 kbps) - RX
    17. 7.17 Zigbee and Thread - IEEE 802.15.4-2006 2.4 GHz (OQPSK DSSS1:8, 250 kbps) - TX
    18. 7.18 Proprietary Radio Modes
    19. 7.19 2.4GHz RX/TX CW
    20. 7.20 Timing and Switching Characteristics
      1. 7.20.1 Reset Timing
      2. 7.20.2 Wakeup Timing
      3. 7.20.3 Clock Specifications
        1. 7.20.3.1 48MHz Crystal Oscillator (HFXT)
        2. 7.20.3.2 48MHz RC Oscillator (HFOSC)
        3. 7.20.3.3 32kHz Crystal Oscillator (LFXT)
        4. 7.20.3.4 32kHz RC Oscillator (LFOSC)
    21. 7.21 Peripheral Characteristics
      1. 7.21.1 UART
        1. 7.21.1.1 UART Characteristics
      2. 7.21.2 SPI
        1. 7.21.2.1 SPI Characteristics
        2. 7.21.2.2 SPI Controller Mode
        3. 7.21.2.3 SPI Timing Diagrams—Controller Mode
        4. 7.21.2.4 SPI Peripheral Mode
        5. 7.21.2.5 SPI Timing Diagrams—Peripheral Mode
      3. 7.21.3 I2C
        1. 7.21.3.1 I2C
        2. 7.21.3.2 I2C Timing Diagram
      4. 7.21.4 GPIO
        1. 7.21.4.1 GPIO DC Characteristics
      5. 7.21.5 ADC
        1. 7.21.5.1 Analog-to-Digital Converter (ADC) Characteristics
      6. 7.21.6 Comparators
        1. 7.21.6.1 Ultra-Low Power Comparator
    22. 7.22 Typical Characteristics
      1. 7.22.1 MCU Current
      2. 7.22.2 RX Current
      3. 7.22.3 TX Current
      4. 7.22.4 RX Performance
      5. 7.22.5 TX Performance
      6. 7.22.6 ADC Performance
  9. 8 Detailed Description
    1. 8.1  Overview
    2. 8.2  System CPU
    3. 8.3  Radio (RF Core)
      1. 8.3.1 Bluetooth Low Energy
      2. 8.3.2 802.15.4 (Thread and Zigbee)
    4. 8.4  Memory
    5. 8.5  Cryptography
    6. 8.6  Timers
    7. 8.7  Serial Peripherals and I/O
    8. 8.8  Battery and Temperature Monitor
    9. 8.9  µDMA
    10. 8.10 Debug
    11. 8.11 Power Management
    12. 8.12 Clock Systems
    13. 8.13 Network Processor
  10. 9 Application, Implementation, and Layout
    1. 9.1 Reference Designs
    2. 9.2 Junction Temperature Calculation
  11. 10Device and Documentation Support
    1. 10.1 Device Nomenclature
    2. 10.2 Tools and Software
      1. 10.2.1 SimpleLink™ Microcontroller Platform
    3. 10.3 Documentation Support
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RGE|24
  • YBG|28
  • RKP|40
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.16 Zigbee and Thread - IEEE 802.15.4-2006 2.4 GHz (OQPSK DSSS1:8, 250 kbps) - RX

Measured on the CC2340R5 reference design with Tc = 25°C, VDDS = 3.0V, fRF= 2440MHz with DC/DC enabled unless otherwise noted. All measurements are performed at the antenna input with a combined RX and TX path. All measurements are performed conducted.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
General Parameters
Receiver sensitivity PER = 1% –98 dBm
Receiver saturation PER = 1% > 3 dBm
Adjacent channel rejection Wanted signal at –82dBm, modulated interferer at ±5MHz, PER = 1% 36 dB
Alternate channel rejection Wanted signal at –82dBm, modulated interferer at ±10MHz, PER = 1% 55 dB
Channel rejection, ±15MHz or more Wanted signal at –82dBm, undesired signal is IEEE 802.15.4 modulated channel, stepped through all channels 2405 to 2480MHz, PER = 1%
 59 dB
Blocking and desensitization,
5MHz from upper band edge		 Wanted signal at –97dBm (3dB above the sensitivity level), CW jammer, PER = 1% 57 dB
Blocking and desensitization,
10MHz from upper band edge		 Wanted signal at –97dBm (3dB above the sensitivity level), CW jammer, PER = 1% 63 dB
Blocking and desensitization,
20MHz from upper band edge		 Wanted signal at –97dBm (3dB above the sensitivity level), CW jammer, PER = 1% 63 dB
Blocking and desensitization,
50MHz from upper band edge		 Wanted signal at –97dBm (3dB above the sensitivity level), CW jammer, PER = 1% 66 dB
Blocking and desensitization,
–5MHz from lower band edge		 Wanted signal at –97dBm (3dB above the sensitivity level), CW jammer, PER = 1% 60 dB
Blocking and desensitization,
–10MHz from lower band edge		 Wanted signal at –97dBm (3dB above the sensitivity level), CW jammer, PER = 1% 60 dB
Blocking and desensitization,
–20MHz from lower band edge		 Wanted signal at –97dBm (3dB above the sensitivity level), CW jammer, PER = 1% 63 dB
Blocking and desensitization,
–50MHz from lower band edge		 Wanted signal at –97dBm (3dB above the sensitivity level), CW jammer, PER = 1% 65 dB
Spurious emissions, 30MHz to 1000MHz Measurement in a 50Ω single-ended load(1) –64 dBm
Spurious emissions, 1GHz to 12.75GHz Measurement in a 50Ω single-ended load(1) –49  dBm
Frequency error tolerance Difference between the incoming carrier frequency and the internally generated carrier frequency > 80  ppm
Symbol rate error tolerance Difference between incoming symbol rate and the internally generated symbol rate > 80 ppm
RSSI dynamic range 90 dB
RSSI accuracy ±4 dB
(1) Suitable for systems targeting compliance with EN 300 328, EN 300 440 class 2 (Europe), FCC CFR47, Part 15 (US), and ARIB STD-T-66 (Japan)