SPRS956H March 2016 – November 2019 DRA722 , DRA724 , DRA725 , DRA726
Refer to the PDF data sheet for device specific package drawings
For reliability and operability concerns, the maximum junction temperature of the device has to be at or below the TJ value identified in Table 5-4, Recommended Operating Conditions.
A BCI compact thermal model for this device is available and recommended for use when modeling thermal performance in a system.
Therefore, it is recommended to perform thermal simulations at the system level with the worst case device power consumption.