22.214.171.124 Example Stack-up
- Layer Top: Signal and Segmented Power Plane
- Processor and PMIC components placed on Top-side
- Layer 2: Gnd Plane1
- Layer 3: Signals
- Layer n: Power Plane1
- Layer n+1: Power Plane 2
- Layer n+2: Signal
- Layer n+3: Gnd Plane2
- Layer Bottom: Signal and Segmented Power Planes
Via Technology: Through-hole
- ½ oz for all signal layers.
- 1-2oz for all power plane for improved PCB heat spreading.
- Total PCB Thickness 0.080inches.