SPRS950F December 2015 – May 2019 DRA744 , DRA745 , DRA746 , DRA750 , DRA756
Refer to the PDF data sheet for device specific package drawings
The region of the PCB used for DDR3 circuitry must be isolated from other signals. The DDR3 keepout region is defined for this purpose and is shown in Figure 8-61. The size of this region varies with the placement and DDR routing. Additional clearances required for the keepout region are shown in Table 8-47. Non-DDR3 signals should not be routed on the DDR signal layers within the DDR3 keepout region. Non-DDR3 signals may be routed in the region, provided they are routed on layers separated from the DDR signal layers by a ground layer. No breaks should be allowed in the reference ground layers in this region. In addition, the 1.5-V DDR3 power plane should cover the entire keepout region. Also note that the two signals from the DDR3 controller should be separated from each other by the specification in Table 8-47, (see KOD37).