SLASF54 January   2023 DRV2901

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Block Diagrams
    2. 7.2 Feature Description
      1. 7.2.1 Error Reporting
      2. 7.2.2 Device Reset
      3. 7.2.3 Device Protection System
        1. 7.2.3.1 Overcurrent (OC) Protection With Current Limiting and Overload Detection
        2. 7.2.3.2 Overtemperature Protection
        3. 7.2.3.3 Undervoltage Protection (UVP) and Power-On Reset (POR)
  8. 8 Applications and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
  9. 9 Power Supply Recommendations
    1. 9.1 System Power-up/power-down Sequence
      1. 9.1.1 Powering Up
      2. 9.1.2 Powering Down
    2. 9.2 System Design Recommendations
      1. 9.2.1 VDD Pin
      2. 9.2.2 VREG Pin
      3. 9.2.3 OTW Pin
  10. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.6 Typical Characteristics

GUID-F877B8EC-475A-4326-9CB2-C8C95536630A-low.gif
TJ = 25°C
Figure 6-1 Normalized RDS(on) vs Gate Drive
GUID-0B7591C8-B5E7-44F3-ADC8-BC0FB7B89A2E-low.gif
TJ = 25°C
Figure 6-3 Drain To Source Diode Forward
On Characteristics
GUID-BA117C49-EAD8-4EF4-86CB-A53962009552-low.gif
GVDD = 12 V
Figure 6-2 Normalized RDS(on) vs Junction Temperature
GUID-485D28E0-4771-453C-BBC6-71F4453E6083-low.gif
FS = 500 kHz; TC = 25°C
Figure 6-4 Output Duty Cycle vs Input Duty Cycle