SLASF54A January   2023  – July 2025 DRV2901

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Block Diagrams
    2. 6.2 Feature Description
      1. 6.2.1 Error Reporting
      2. 6.2.2 Device Reset
      3. 6.2.3 Device Protection System
        1. 6.2.3.1 Overcurrent (OC) Protection With Current Limiting and Overload Detection
        2. 6.2.3.2 Overtemperature Protection
        3. 6.2.3.3 Undervoltage Protection (UVP) and Power-On Reset (POR)
  8. 7 Applications and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
    3. 7.3 Power Supply Recommendations
      1. 7.3.1 System Power-up/power-down Sequence
        1. 7.3.1.1 Powering Up
        2. 7.3.1.2 Powering Down
      2. 7.3.2 System Design Recommendations
        1. 7.3.2.1 VDD Pin
        2. 7.3.2.2 VREG Pin
        3. 7.3.2.3 OTW Pin
        4. 7.3.2.4 Bootstrap Capacitors
    4. 7.4 Layout
  9. 8 Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.2 ESD Ratings

VALUEUNIT
V(ESD)Electrostatic dischargeHuman-body model (HBM), per AEC Q100-002(1)±2000V
Charged-device model (CDM), per AEC Q100-011±500
(1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.