SNOSDE8A July   2023  – September 2023 LM74912-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Charge Pump
      2. 8.3.2 Dual Gate Control (DGATE, HGATE)
        1. 8.3.2.1 Reverse Battery Protection (A, C, DGATE)
        2. 8.3.2.2 Load Disconnect Switch Control (HGATE, OUT)
      3. 8.3.3 Short Circuit Protection (CS+, CS-, ISCP)
      4. 8.3.4 Overvoltage Protection and Battery Voltage Sensing (SW, OV, UVLO)
      5. 8.3.5 Low IQ SLEEP Mode (SLEEP, SLEEP_OV)
    4. 8.4 Device Functional Modes
  10. 9 Applications and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical 12-V Reverse Battery Protection Application
      1. 9.2.1 Design Requirements for 12-V Battery Protection
      2. 9.2.2 Automotive Reverse Battery Protection
        1. 9.2.2.1 Input Transient Protection: ISO 7637-2 Pulse 1
        2. 9.2.2.2 AC Super Imposed Input Rectification: ISO 16750-2 and LV124 E-06
        3. 9.2.2.3 Input Micro-Short Protection: LV124 E-10
      3. 9.2.3 Detailed Design Procedure
        1. 9.2.3.1 Design Considerations
        2. 9.2.3.2 Charge Pump Capacitance VCAP
        3. 9.2.3.3 Input , Supply and Output Capacitance
        4. 9.2.3.4 Hold-Up Capacitance
        5. 9.2.3.5 Overvoltage Protection and Battery Monitor
        6. 9.2.3.6 Selecting Short Circuit Current Threshold
          1. 9.2.3.6.1 Selection of Scaling Resistor RSET and RISCP for Short Circuit Protection
      4. 9.2.4 MOSFET Selection: Blocking MOSFET Q1
      5. 9.2.5 MOSFET Selection: Hot-Swap MOSFET Q2
      6. 9.2.6 TVS Selection
      7. 9.2.7 Application Curves
    3. 9.3 Best Design Practices
    4. 9.4 Power Supply Recommendations
      1. 9.4.1 Transient Protection
      2. 9.4.2 TVS Selection for 12-V Battery Systems
      3. 9.4.3 TVS Selection for 24-V Battery Systems
    5. 9.5 Layout
      1. 9.5.1 Layout Guidelines
      2. 9.5.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Receiving Notification of Documentation Updates
    2. 10.2 Support Resources
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.4.1 Transient Protection

When the external MOSFETs turn OFF during the conditions such as overcurrent, overvoltage undervoltage cut-off, reverse current blocking causing an interruption of the current flow, the input line inductance generates a positive voltage spike on the input and output inductance generates a negative voltage spike on the output. The peak amplitude of voltage spikes (transients) depends on the value of inductance in series to the input or output of the device. These transients can exceed the Section 6.1 of the device if steps are not taken to address the issue.

Typical methods for addressing transients include:

  • Minimizing lead length and inductance into and out of the device.
  • Using large PCB GND plane.
  • Use of a Schottky diode across the output and GND to absorb negative spikes.
  • A low value ceramic capacitor (C(IN) to approximately 0.1 μF) to absorb the energy and dampen the transients.

The approximate value of input capacitance can be estimated with Equation 12.

Equation 12. GUID-EFFF5A85-A7E5-4D6A-A2E6-2ECAEAECB0E5-low.gif

where

  • V(IN) is the nominal supply voltage
  • I(LOAD) is the load current
  • L(IN) equals the effective inductance seen looking into the source
  • C(IN) is the capacitance present at the input

Some applications may require additional transient voltage suppressor (TVS) to prevent transients from exceeding the Section 6.1 of the device. These transients can occur during EMC testing such as automotive ISO7637 pulses.

The circuit implementation with optional protection components (a ceramic capacitor, TVS, and Schottky diode) is shown in Figure 9-14

GUID-20230704-SS0I-PPZ6-N1FZ-DMMFKSPDQWQR-low.svg
* Optional components needed for suppression of transients
Figure 9-14 Circuit Implementation With Optional Protection Components for LM74912-Q1