SBOSAL2 September   1999  – January 2025 LMC7101

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics for VS = ±1.35V or 2.7V
    6. 5.6  Electrical Characteristics for VS = ±1.5V or 3V
    7. 5.7  Electrical Characteristics for VS = ±2.5V or 5V
    8. 5.8  Electrical Characteristics for VS = ±7.5V or 15V
    9. 5.9  Typical Characteristics for VS = 2.7V
    10. 5.10 Typical Characteristics for VS = 3V
    11. 5.11 Typical Characteristics for VS = 5V
    12. 5.12 Typical Characteristics for VS = 15V
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Benefits of the LMC7101 Tiny Amplifier
        1. 6.3.1.1 Size
        2. 6.3.1.2 Height
        3. 6.3.1.3 Signal Integrity
        4. 6.3.1.4 Simplified Board Layout
        5. 6.3.1.5 Low THD
        6. 6.3.1.6 Low Supply Current
        7. 6.3.1.7 Wide Voltage Range
    4. 6.4 Device Functional Modes
      1. 6.4.1 Input Common Mode
        1. 6.4.1.1 Input Common-Mode Voltage Range
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Rail-to-Rail Output
      2. 7.1.2 Capacitive Load Tolerance
      3. 7.1.3 Compensating for Input Capacitance When Using Large Value Feedback Resistors
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curve
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DBV|5
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.4.1 Layout Guidelines

Care must be taken to minimize the loop area formed by the bypass capacitor connection between supply pins and ground. A ground plane underneath the device is recommended; any bypass components to ground must have a nearby via to the ground plane. The optimum bypass capacitor placement is closest to the corresponding supply pin. Use of thicker traces from the bypass capacitors to the corresponding supply pins can lower the power-supply inductance and provide a more stable power supply.

The feedback components must be placed as close as possible to the device to minimize stray parasitics.