SNAS826 April   2022 LMK6C

ADVANCE INFORMATION  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 LMK6P/D Thermal Information
    5. 7.5 LMK6C Thermal Information
    6. 7.6 Electrical Characteristics
    7. 7.7 Timing Diagrams
  8. 8 Parameter Measurement Information
    1. 8.1 Device Output Configurations
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Bulk Acoustic Wave (BAW)
      2. 9.3.2 Device Block-Level Description
      3. 9.3.3 Function Pin(s)
      4. 9.3.4 Clock Output Interfacing and Termination
      5. 9.3.5 Temperature Stability
      6. 9.3.6 Mechanical Robustness
    4. 9.4 Device Functional Modes
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
      1. 12.1.1 Ensuring Thermal Reliability
      2. 12.1.2 Best Practices for Signal Integrity
      3. 12.1.3 Recommended Solder Reflow Profile
    2. 12.2 Layout Examples
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Device Nomenclature
    3. 13.3 Receiving Notification of Documentation Updates
    4. 13.4 Support Resources
    5. 13.5 Trademarks
    6. 13.6 Electrostatic Discharge Caution
    7. 13.7 Glossary
  14. 14Mechanical, Packaging, and Orderable Information
    1. 14.1 Packaging Information
    2. 14.2 Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
  • DLF|4
Thermal pad, mechanical data (Package|Pins)
Orderable Information

3 Description

Texas Instruments' Bulk-Acoustic Wave (BAW) is a micro-resonator technology that enables the integration of high-precision and ultra-low jitter clocks directly into packages that contain other circuits. BAW is fully designed and manufactured at TI factories like other silicon-based fabrication processes.

The LMK6x device is a low jitter, fixed-frequency oscillator which incorporates the BAW as the resonator source. With a high-performance fractional frequency divider, the LMK6x is capable of producing any frequency within the specified range providing a single device family for all frequency needs. The device is factory-programmed per specific operation mode, including frequency, voltage, output type, and function pin. Contact a TI representative for additional frequencies or other options.

The high-performance clocking, mechanical stability, flexibility and small package options for this device are designed for reference and core clocks in high-speed SERDES used in Telecommunications, Data and Enterprise Network and Industrial applications.

Device Information
PART NUMBEROUTPUT TYPEPACKAGE(1)BODY SIZE (NOM)
LMK6C (DLE)LVCMOSVSON (4)3.20 mm × 2.50 mm
LMK6C (DLF)VSON (4)2.50 mm × 2.00 mm
LMK6P (DLE)(2)LVPECLVSON (6)3.20 mm × 2.50 mm
LMK6P (DLF)(2)VSON (6)2.50 mm × 2.00 mm
LMK6D (DLE)(2)LVDSVSON (6)3.20 mm × 2.50 mm
LMK6D (DLF)(2)VSON (6)2.50 mm × 2.00 mm
(1) For all available packages, see the orderable addendum at the end of the data sheet.
(2) Product preview.
LMK6x Simplified Block Diagram