SNAS826E April   2022  – April 2024 LMK6C , LMK6D , LMK6H , LMK6P

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Ordering Information
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Environmental Compliance
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Thermal Information
    6. 6.6 Thermal Information
    7. 6.7 Electrical Characteristics
    8. 6.8 Timing Diagrams
    9. 6.9 Typical Characteristics
  8. 7 Parameter Measurement Information
    1. 7.1 Device Output Configurations
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Bulk Acoustic Wave (BAW)
      2. 8.3.2 Device Block-Level Description
      3. 8.3.3 Function Pins
      4. 8.3.4 Clock Output Interfacing and Termination
      5. 8.3.5 Temperature Stability
      6. 8.3.6 Mechanical Robustness
    4. 8.4 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
        1. 9.4.1.1 Providing Thermal Reliability
        2. 9.4.1.2 Recommended Solder Reflow Profile
      2. 9.4.2 Layout
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

3 Description

Texas Instruments' Bulk-Acoustic Wave (BAW) is a micro-resonator technology that enables integration of high-precision BAW resonator directly into packages with ultra-low jitter clock circuitry. BAW is fully designed and manufactured at TI factories like other silicon-based fabrication processes.

The LMK6x device is an ultra-low jitter, fixed-frequency oscillator which incorporates the BAW as the resonator source. The device is factory-programmed per specific operation mode, including frequency, voltage, output type, and function pin. With a high-performance fractional frequency divider, the LMK6x is capable of producing any frequency within the specified range providing a single device family for all frequency needs.

The high-performance clocking, mechanical stability, flexibility, and small package options for this device are designed for reference and core clocks in high-speed SERDES used in telecommunications, data and enterprise network, and industrial applications.

Package Information
PART NUMBEROUTPUT TYPEPACKAGE(1)PACKAGE SIZE(2)
LMK6CLVCMOSVSON (DLE-4)3.2mm × 2.5mm
LMK6CVSON (DLF-4)2.5mm × 2mm
LMK6D
LMK6H
LMK6P		LVDS, HCSL,
LVPECL		VSON (DLE-6)3.2mm × 2.5mm
LMK6D
LMK6H
LMK6P		VSON (DLF-6)2.5mm × 2mm
(1) For all available packages, see Section 12.
(2) The package size (length × width) is a nominal value and includes pins, where applicable.
GUID-20220322-SS0I-SFGJ-5NFV-60QMZGLJBLZH-low.svgLMK6C Simplified Block Diagram