SNAS826D
April 2022 – February 2023
LMK6C
,
LMK6D
,
LMK6H
,
LMK6P
PRODUCTION DATA
1
Features
2
Applications
3
Description
4
Revision History
5
Device Ordering Information
6
Pin Configuration and Functions
7
Specifications
7.1
Absolute Maximum Ratings
7.2
ESD Ratings
7.3
Environmental Compliance
7.4
Recommended Operating Conditions
7.5
Thermal Information
7.6
Thermal Information
7.7
Electrical Characteristics
7.8
Timing Diagrams
7.9
Typical Characteristics
8
Parameter Measurement Information
8.1
Device Output Configurations
9
Detailed Description
9.1
Overview
9.2
Functional Block Diagram
9.3
Feature Description
9.3.1
Bulk Acoustic Wave (BAW)
9.3.2
Device Block-Level Description
9.3.3
Function Pin(s)
9.3.4
Clock Output Interfacing and Termination
9.3.5
Temperature Stability
9.3.6
Mechanical Robustness
9.4
Device Functional Modes
10
Application and Implementation
10.1
Application Information
10.2
Typical Application
10.2.1
Design Requirements
10.2.2
Detailed Design Procedure
10.2.3
Application Curves
10.3
Power Supply Recommendations
10.4
Layout
10.4.1
Layout Guidelines
10.4.1.1
Ensuring Thermal Reliability
10.4.1.2
Recommended Solder Reflow Profile
10.4.2
Layout
11
Device and Documentation Support
11.1
Documentation Support
11.1.1
Related Documentation
11.2
Receiving Notification of Documentation Updates
11.3
Support Resources
11.4
Trademarks
11.5
Electrostatic Discharge Caution
11.6
Glossary
12
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
DLE|4
MPQF589A
DLF|4
Thermal pad, mechanical data (Package|Pins)
DLE|4
QFND772
Orderable Information
snas826d_oa
snas826d_pm
9
Detailed Description