SNAS826 April   2022 LMK6C

ADVANCE INFORMATION  

1. 1 Features
2. 2 Applications
3. 3 Description
4. 4 Revision History
5. 5 Device Comparison
6. 6 Pin Configuration and Functions
7. 7 Specifications
   1. 7.1 Absolute Maximum Ratings
   2. 7.2 ESD Ratings
   3. 7.3 Recommended Operating Conditions
   4. 7.4 LMK6P/D Thermal Information
   5. 7.5 LMK6C Thermal Information
   6. 7.6 Electrical Characteristics
   7. 7.7 Timing Diagrams
8. 8 Parameter Measurement Information
   1. 8.1 Device Output Configurations
9. 9 Detailed Description
   1. 9.1 Overview
   2. 9.2 Functional Block Diagram
   3. 9.3 Feature Description
      1. 9.3.1 Bulk Acoustic Wave (BAW)
      2. 9.3.2 Device Block-Level Description
      3. 9.3.3 Function Pin(s)
      4. 9.3.4 Clock Output Interfacing and Termination
      5. 9.3.5 Temperature Stability
      6. 9.3.6 Mechanical Robustness
   4. 9.4 Device Functional Modes
10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
       1. 10.2.1 Design Requirements
11. 11Power Supply Recommendations
12. 12Layout
    1. 12.1 Layout Guidelines
       1. 12.1.1 Ensuring Thermal Reliability
       2. 12.1.2 Best Practices for Signal Integrity
       3. 12.1.3 Recommended Solder Reflow Profile
    2. 12.2 Layout Examples
13. 13Device and Documentation Support
    1. 13.1 Documentation Support
       1. 13.1.1 Related Documentation
    2. 13.2 Device Nomenclature
    3. 13.3 Receiving Notification of Documentation Updates
    4. 13.4 Support Resources
    5. 13.5 Trademarks
    6. 13.6 Electrostatic Discharge Caution
    7. 13.7 Glossary
14. 14Mechanical, Packaging, and Orderable Information
    1. 14.1 Packaging Information
    2. 14.2 Tape and Reel Information