SLVSH05A November 2023 – August 2025 LP8865U-Q1 , LP8865V-Q1 , LP8865W-Q1 , LP8865X-Q1 , LP8865Y-Q1 , LP8865Z-Q1
PRODUCTION DATA
| THERMAL METRIC(1) | Device | UNIT | ||
|---|---|---|---|---|
| HVSSOP | SON | |||
| 12 PINS | 14 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 38.3 | 39.1 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 52.2 | 39.5 | °C/W |
| RθJB | Junction-to-board thermal resistance | 13.9 | 14.7 | °C/W |
| ψJT | Junction-to-top characterization parameter | 1.9 | 0.9 | °C/W |
| ψJB | Junction-to-board characterization parameter | 13.9 | 14.7 | °C/W |