SBOS410O June   2007  – October 2025 REF50 , REF50E

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics REF50xxI and REF50xxAI
    6. 6.6 Electrical Characteristics REF50xxEI
    7. 6.7 Typical Characteristics: REF50xxI, REF50xxAI
    8. 6.8 Typical Characteristics: REF50xxEI
  8. 7 Parameter Measurement Information
    1. 7.1 Solder Heat Shift
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Temperature Monitoring
      2. 8.3.2 Temperature Drift
      3. 8.3.3 Thermal Hysteresis
      4. 8.3.4 Noise Performance
      5. 8.3.5 Long-Term Stability
      6. 8.3.6 Output Adjustment Using the TRIM/NR Pin
    4. 8.4 Device Functional Modes
      1. 8.4.1 Basic Connections
      2. 8.4.2 Supply Voltage
      3. 8.4.3 Negative Reference Voltage
  10. 9 Applications and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 16-bit, 250KSPS Data Acquisition System
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curve
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
        1. 9.4.1.1 REF50xxI, REF50xxAI Layout Guidelines
        2. 9.4.1.2 REF50xxEI Layout Guidelines
      2. 9.4.2 Layout Example
      3. 9.4.3 Power Dissipation
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Device Comparison Table

Table 4-1 Device VOUT Comparison
PRODUCT Voltage
SOIC (8) VSSOP (8)
N/A REF5020ID REF5020AID REF5020IDGK REF5020AIDGK 2.048V
REF5025EID REF5025ID REF5025AID REF5025IDGK REF5025AIDGK 2.5V
REF5030EID REF5030ID REF5030AID REF5030IDGK REF5030AIDGK 3V
REF5040EID REF5040ID REF5040AID REF5040IDGK REF5040AIDGK 4.096V
REF5045EID REF5045ID REF5045AID REF5045IDGK REF5045AIDGK 4.5V
REF5050EID REF5050ID REF5050AID REF5050IDGK REF5050AIDGK 5.0V
N/A REF5010ID REF5010AID REF5010IDGK REF5010AIDGK 10.0V
Table 4-2 Device Performance Comparison
Device Grade Temperature Coefficient Initial Accuracy Noise VIN Max Quiescent Current Max
REF50xxEI Enhanced 2.5ppm/ºC ±0.025% 0.5μVPP/V 42V 480μA
REF50xxI High 3ppm/ºC ±0.05% 3μVPP/V 18V 1.2mA
REF50xxAI Standard 8ppm/ºC ±0.1% 3μVPP/V 18V 1.2mA