SBOS410O June   2007  – October 2025 REF50 , REF50E

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics REF50xxI and REF50xxAI
    6. 6.6 Electrical Characteristics REF50xxEI
    7. 6.7 Typical Characteristics: REF50xxI, REF50xxAI
    8. 6.8 Typical Characteristics: REF50xxEI
  8. 7 Parameter Measurement Information
    1. 7.1 Solder Heat Shift
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Temperature Monitoring
      2. 8.3.2 Temperature Drift
      3. 8.3.3 Thermal Hysteresis
      4. 8.3.4 Noise Performance
      5. 8.3.5 Long-Term Stability
      6. 8.3.6 Output Adjustment Using the TRIM/NR Pin
    4. 8.4 Device Functional Modes
      1. 8.4.1 Basic Connections
      2. 8.4.2 Supply Voltage
      3. 8.4.3 Negative Reference Voltage
  10. 9 Applications and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 16-bit, 250KSPS Data Acquisition System
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curve
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
        1. 9.4.1.1 REF50xxI, REF50xxAI Layout Guidelines
        2. 9.4.1.2 REF50xxEI Layout Guidelines
      2. 9.4.2 Layout Example
      3. 9.4.3 Power Dissipation
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.4.1 Basic Connections

Figure 8-6 shows the typical connections for the REF50xx. TI recommends a supply bypass capacitor ranging from 1μF to 10μF. Confirm that a output capacitor (CL) is connected from VOUT to GND. For output stability, verify that the equivalent series resistance (ESR) value of CL less than or equal to 1.5Ω. To minimize noise, the recommended ESR of CL is from 1Ω and 1.5Ω.

REF50 REF50E Basic Connections Figure 8-6 Basic Connections