SLLSEV0E November   2017  – March 2021 TCAN1043-Q1 , TCAN1043G-Q1 , TCAN1043H-Q1 , TCAN1043HG-Q1

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Description (continued)
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 ESD Ratings IEC Specification
    4. 7.4 Recommended Operating Conditions
    5. 7.5 Thermal Information
    6. 7.6 Dissipation Ratings
    7. 7.7 Electrical Characteristics
    8. 7.8 Switching Characteristics
    9. 7.9 Typical Characteristics
  8. Parameter Measurement Information
  9. Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Internal and External Indicator Flags (nFAULT and RXD)
      2. 9.3.2 Power-Up Flag (PWRON)
      3. 9.3.3 Wake-Up Request Flag (WAKERQ)
      4. 9.3.4 Wake-Up Source Recognition Flag (WAKESR)
      5. 9.3.5 Undervoltage Fault Flags
        1. 9.3.5.1 Undervoltage on VCC Fault
        2. 9.3.5.2 Undervoltage on VIO Fault
        3. 9.3.5.3 Undervoltage on VSUP Fault
      6. 9.3.6 CAN Bus Failure Fault Flag
      7. 9.3.7 Local Faults
        1. 9.3.7.1 TXD Dominant Timeout (TXD DTO)
        2. 9.3.7.2 TXD Shorted to RXD Fault
        3. 9.3.7.3 CAN Bus Dominant Fault
        4. 9.3.7.4 Thermal Shutdown (TSD)
        5. 9.3.7.5 RXD Recessive Fault
        6. 9.3.7.6 Undervoltage Lockout (UVLO)
        7. 9.3.7.7 Unpowered Device
        8. 9.3.7.8 Floating Terminals
        9. 9.3.7.9 CAN Bus Short Circuit Current Limiting
    4. 9.4 Device Functional Modes
      1. 9.4.1 CAN Bus States
      2. 9.4.2 Normal Mode
      3. 9.4.3 Silent Mode
      4. 9.4.4 Standby Mode
      5. 9.4.5 Go-to-Sleep Mode
      6. 9.4.6 Sleep Mode with Remote Wake and Local Wake Up Requests
        1. 9.4.6.1 Remote Wake Request via Wake Up Pattern (WUP)
        2. 9.4.6.2 Local Wake Up (LWU) via WAKE Input Terminal
      7. 9.4.7 Driver and Receiver Function Tables
      8. 9.4.8 Digital Inputs and Outputs
      9. 9.4.9 INH (Inhibit) Output
  10. 10Application Information Disclaimer
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
        1. 10.2.1.1 Bus Loading, Length and Number of Nodes
      2. 10.2.2 Detailed Design Procedures
        1. 10.2.2.1 CAN Termination
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout
      1. 12.1.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Related Links
    2. 13.2 Receiving Notification of Documentation Updates
    3. 13.3 Community Resources
    4. 13.4 Trademarks
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|14
  • DMT|14
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Features

  • AEC Q100: Qualified for automotive applications
    • Temperature Grade 1: –55°C to 125°C, TA
    • Device HBM classification level: ±16 kV
    • Device CDM classification level: ±1500 V
  • Functional Safety-Capable
  • Meets the requirements of the ISO 11898-2 (2016)
  • All devices support classic CAN and 2 Mbps CAN FD (flexible data rate) and "G" options support 5 Mbps
    • Short and symmetrical propagation delays and fast loop times for enhanced timing margin
    • Higher data rates in loaded CAN networks
  • VIO Level shifting supports 2.8 V to 5.5 V
  • Operating modes
    • Normal mode
    • Standby Mode with INH output and local and remote wake up request
    • Low power sleep mode with INH output and local and remote wake up request
  • Ideal passive behavior when unpowered
    • Bus and logic terminals are high impedance (no load to operating bus or application)
    • Hot plug capable: power up/down glitch free operation on bus and RXD output
  • Meets or exceeds EMC standard requirements
    • IEC 62228-3 – 2007 compliant
    • SAE J2962-2 compliant
  • Protection features
    • IEC ESD protection of bus terminals: ±8 kV
    • Bus fault protection: ±58 V (non-H variants) and ±70 V (H variants)
    • Undervoltage protection on supply terminals
    • Driver dominant time Out (TXD DTO): data rates down to 9.2 kbps
    • Thermal shutdown protection (TSD)
  • Receiver common mode input voltage: ±30 V
  • Typical loop delay: 110 ns
  • Junction temperatures from –55°C to 150°C
  • Available in SOIC (14) package and leadless VSON (14) package (4.5 mm x 3.0 mm) with improved automated optical inspection (AOI) capability