SPRSP62C December   2022  – November 2025 TDA4AL-Q1 , TDA4VE-Q1 , TDA4VL-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
    1. 3.1 Functional Block Diagram
  5. 4 Device Comparison
  6. 5 Terminal Configuration and Functions
    1. 5.1 Pin Diagrams
    2. 5.2 Pin Attributes
      1.      10
      2.      11
    3. 5.3 Signal Descriptions
      1.      13
      2. 5.3.1  ADC
        1. 5.3.1.1 MCU Domain
          1.        16
          2.        17
          3.        18
      3. 5.3.2  DDRSS
        1. 5.3.2.1 MAIN Domain
          1.        21
          2.        22
      4. 5.3.3  GPIO
        1. 5.3.3.1 MAIN Domain
          1.        25
        2. 5.3.3.2 WKUP Domain
          1.        27
      5. 5.3.4  I2C
        1. 5.3.4.1 MAIN Domain
          1.        30
          2.        31
          3.        32
          4.        33
          5.        34
          6.        35
          7.        36
        2. 5.3.4.2 MCU Domain
          1.        38
          2.        39
        3. 5.3.4.3 WKUP Domain
          1.        41
      6. 5.3.5  I3C
        1. 5.3.5.1 MCU Domain
          1.        44
      7. 5.3.6  MCAN
        1. 5.3.6.1 MAIN Domain
          1.        47
          2.        48
          3.        49
          4.        50
          5.        51
          6.        52
          7.        53
          8.        54
          9.        55
          10.        56
          11.        57
          12.        58
          13.        59
          14.        60
          15.        61
          16.        62
          17.        63
          18.        64
        2. 5.3.6.2 MCU Domain
          1.        66
          2.        67
      8. 5.3.7  MCSPI
        1. 5.3.7.1 MAIN Domain
          1.        70
          2.        71
          3.        72
          4.        73
          5.        74
          6.        75
          7.        76
        2. 5.3.7.2 MCU Domain
          1.        78
          2.        79
      9. 5.3.8  UART
        1. 5.3.8.1 MAIN Domain
          1.        82
          2.        83
          3.        84
          4.        85
          5.        86
          6.        87
          7.        88
          8.        89
          9.        90
          10.        91
        2. 5.3.8.2 MCU Domain
          1.        93
        3. 5.3.8.3 WKUP Domain
          1.        95
      10. 5.3.9  MDIO
        1. 5.3.9.1 MAIN Domain
          1.        98
        2. 5.3.9.2 MCU Domain
          1.        100
      11. 5.3.10 CPSW2G
        1. 5.3.10.1 MAIN Domain
          1.        103
        2. 5.3.10.2 MCU Domain
          1.        105
      12. 5.3.11 ECAP
        1. 5.3.11.1 MAIN Domain
          1.        108
          2.        109
          3.        110
      13. 5.3.12 EQEP
        1. 5.3.12.1 MAIN Domain
          1.        113
          2.        114
          3.        115
      14. 5.3.13 EPWM
        1. 5.3.13.1 MAIN Domain
          1.        118
          2.        119
          3.        120
          4.        121
          5.        122
          6.        123
          7.        124
      15. 5.3.14 USB
        1. 5.3.14.1 MAIN Domain
          1.        127
      16. 5.3.15 Display Port
        1. 5.3.15.1 MAIN Domain
          1.        130
      17. 5.3.16 Hyperlink
        1. 5.3.16.1 MAIN Domain
          1.        133
          2.        134
          3.        135
      18. 5.3.17 PCIE
        1. 5.3.17.1 MAIN Domain
          1.        138
      19. 5.3.18 SERDES
        1. 5.3.18.1 MAIN Domain
          1.        141
      20. 5.3.19 DSI
        1. 5.3.19.1 MAIN Domain
          1.        144
          2.        145
      21. 5.3.20 CSI
        1. 5.3.20.1 MAIN Domain
          1.        148
          2.        149
      22. 5.3.21 MCASP
        1. 5.3.21.1 MAIN Domain
          1.        152
          2.        153
          3.        154
          4.        155
          5.        156
      23. 5.3.22 DMTIMER
        1. 5.3.22.1 MAIN Domain
          1.        159
        2. 5.3.22.2 MCU Domain
          1.        161
      24. 5.3.23 CPTS
        1. 5.3.23.1 MAIN Domain
          1.        164
        2. 5.3.23.2 MCU Domain
          1.        166
      25. 5.3.24 DSS
        1. 5.3.24.1 MAIN Domain
          1.        169
      26. 5.3.25 GPMC
        1. 5.3.25.1 MAIN Domain
          1.        172
      27. 5.3.26 MMC
        1. 5.3.26.1 MAIN Domain
          1.        175
          2.        176
      28. 5.3.27 OSPI
        1. 5.3.27.1 MCU Domain
          1.        179
          2.        180
      29. 5.3.28 Hyperbus
        1. 5.3.28.1 MCU Domain
          1.        183
      30. 5.3.29 Emulation and Debug
        1. 5.3.29.1 MAIN Domain
          1.        186
          2.        187
      31. 5.3.30 System and Miscellaneous
        1. 5.3.30.1 Boot Mode configuration
          1.        190
        2. 5.3.30.2 Clock
          1.        192
          2.        193
        3. 5.3.30.3 System
          1.        195
          2.        196
        4. 5.3.30.4 EFUSE
          1.        198
        5. 5.3.30.5 VMON
          1.        200
      32. 5.3.31 Power
        1.       202
    4. 5.4 Connection for Unused Pins
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Power-On-Hour (POH) Limits
    5. 6.5  Operating Performance Points
    6. 6.6  Electrical Characteristics
      1. 6.6.1  I2C, Open-Drain, Fail-Safe (I2C OD FS) Electrical Characteristics
      2. 6.6.2  Fail-Safe Reset (FS Reset) Electrical Characteristics
      3. 6.6.3  HFOSC/LFOSC Electrical Characteristics
      4. 6.6.4  eMMCPHY Electrical Characteristics
      5. 6.6.5  SDIO Electrical Characteristics
      6. 6.6.6  CSI2/DSI D-PHY Electrical Characteristics
      7. 6.6.7  ADC12B Electrical Characteristics
      8. 6.6.8  LVCMOS Electrical Characteristics
      9. 6.6.9  USB2PHY Electrical Characteristics
      10. 6.6.10 SerDes 2-L-PHY/4-L-PHY Electrical Characteristics
      11. 6.6.11 UFS M-PHY Electrical Characteristics
      12. 6.6.12 eDP/DP AUX-PHY Electrical Characteristics
      13. 6.6.13 DDR0 Electrical Characteristics
    7. 6.7  VPP Specifications for One-Time Programmable (OTP) eFuses
      1. 6.7.1 Recommended Operating Conditions for OTP eFuse Programming
      2. 6.7.2 Hardware Requirements
      3. 6.7.3 Programming Sequence
      4. 6.7.4 Impact to Your Hardware Warranty
    8. 6.8  Thermal Resistance Characteristics
      1. 6.8.1 Thermal Resistance Characteristics for ALZ Package
    9. 6.9  Temperature Sensor Characteristics
    10. 6.10 Timing and Switching Characteristics
      1. 6.10.1 Timing Parameters and Information
      2. 6.10.2 Power Supply Sequencing
        1. 6.10.2.1 Power Supply Slew Rate Requirement
        2. 6.10.2.2 Combined MCU and Main Domains Power- Up Sequencing
        3. 6.10.2.3 Combined MCU and Main Domains Power- Down Sequencing - Option 1
        4. 6.10.2.4 Isolated MCU and Main Domains Power- Up Sequencing
        5. 6.10.2.5 Isolated MCU and Main Domains Power- Down Sequencing - Option 1
        6. 6.10.2.6 Independent MCU and Main Domains, Entry and Exit of MCU Only Sequencing
        7. 6.10.2.7 Independent MCU and Main Domains, Entry and Exit of DDR Retention State
        8. 6.10.2.8 Independent MCU and Main Domains, Entry and Exit of GPIO Retention Sequencing
      3. 6.10.3 System Timing
        1. 6.10.3.1 Reset Timing
        2. 6.10.3.2 Safety Signal Timing
        3. 6.10.3.3 Clock Timing
      4. 6.10.4 Clock Specifications
        1. 6.10.4.1 Input and Output Clocks / Oscillators
          1. 6.10.4.1.1 WKUP_OSC0 Internal Oscillator Clock Source
            1. 6.10.4.1.1.1 Load Capacitance
            2. 6.10.4.1.1.2 Shunt Capacitance
          2. 6.10.4.1.2 WKUP_OSC0 LVCMOS Digital Clock Source
          3. 6.10.4.1.3 Auxiliary OSC1 Internal Oscillator Clock Source
            1. 6.10.4.1.3.1 Load Capacitance
            2. 6.10.4.1.3.2 Shunt Capacitance
          4. 6.10.4.1.4 Auxiliary OSC1 LVCMOS Digital Clock Source
          5. 6.10.4.1.5 Auxiliary OSC1 Not Used
        2. 6.10.4.2 Output Clocks
        3. 6.10.4.3 PLLs
        4. 6.10.4.4 Module and Peripheral Clocks Frequencies
      5. 6.10.5 Peripherals
        1. 6.10.5.1  ATL
          1. 6.10.5.1.1 ATL_PCLK Timing Requirements
          2. 6.10.5.1.2 ATL_AWS[x] Timing Requirements
          3. 6.10.5.1.3 ATL_BWS[x] Timing Requirements
          4. 6.10.5.1.4 ATCLK[x] Switching Characteristics
        2. 6.10.5.2  CPSW2G
          1. 6.10.5.2.1 CPSW2G MDIO Interface Timings
          2. 6.10.5.2.2 CPSW2G RMII Timings
            1. 6.10.5.2.2.1 CPSW2G RMII[x]_REF_CLK Timing Requirements – RMII Mode
            2. 6.10.5.2.2.2 CPSW2G RMII[x]_RXD[1:0], RMII[x]_CRS_DV, and RMII[x]_RX_ER Timing Requirements – RMII Mode
            3. 6.10.5.2.2.3 CPSW2G RMII[x]_TXD[1:0], and RMII[x]_TX_EN Switching Characteristics – RMII Mode
          3. 6.10.5.2.3 CPSW2G RGMII Timings
            1. 6.10.5.2.3.1 RGMII[x]_RXC Timing Requirements – RGMII Mode
            2. 6.10.5.2.3.2 CPSW2G Timing Requirements for RGMII[x]_RD[3:0], and RGMII[x]_RCTL – RGMII Mode
            3. 6.10.5.2.3.3 CPSW2G RGMII[x]_TXC Switching Characteristics – RGMII Mode
            4. 6.10.5.2.3.4 RGMII[x]_TD[3:0], and RGMII[x]_TX_CTL Switching Characteristics – RGMII Mode
        3. 6.10.5.3  CSI-2
        4. 6.10.5.4  DDRSS
        5. 6.10.5.5  DSS
        6. 6.10.5.6  eCAP
          1. 6.10.5.6.1 Timing Requirements for eCAP
          2. 6.10.5.6.2 Switching Characteristics for eCAP
        7. 6.10.5.7  EPWM
          1. 6.10.5.7.1 Timing Requirements for eHRPWM
          2. 6.10.5.7.2 Switching Characteristics for eHRPWM
        8. 6.10.5.8  eQEP
          1. 6.10.5.8.1 Timing Requirements for eQEP
          2. 6.10.5.8.2 Switching Characteristics for eQEP
        9. 6.10.5.9  GPIO
          1. 6.10.5.9.1 GPIO Timing Requirements
          2. 6.10.5.9.2 GPIO Switching Characteristics
        10. 6.10.5.10 GPMC
          1. 6.10.5.10.1 GPMC and NOR Flash — Synchronous Mode
            1. 6.10.5.10.1.1 GPMC and NOR Flash Timing Requirements — Synchronous Mode
            2. 6.10.5.10.1.2 GPMC and NOR Flash Switching Characteristics – Synchronous Mode
          2. 6.10.5.10.2 GPMC and NOR Flash — Asynchronous Mode
            1. 6.10.5.10.2.1 GPMC and NOR Flash Timing Requirements – Asynchronous Mode
            2. 6.10.5.10.2.2 GPMC and NOR Flash Switching Characteristics – Asynchronous Mode
          3. 6.10.5.10.3 GPMC and NAND Flash — Asynchronous Mode
            1. 6.10.5.10.3.1 GPMC and NAND Flash Timing Requirements – Asynchronous Mode
            2. 6.10.5.10.3.2 GPMC and NAND Flash Switching Characteristics – Asynchronous Mode
          4. 6.10.5.10.4 GPMC0 IOSET
        11. 6.10.5.11 HyperBus
          1. 6.10.5.11.1 Timing Requirements for HyperBus
          2. 6.10.5.11.2 HyperBus 166 MHz Switching Characteristics
          3. 6.10.5.11.3 HyperBus 100 MHz Switching Characteristics
        12. 6.10.5.12 I2C
        13. 6.10.5.13 I3C
        14. 6.10.5.14 MCAN
        15. 6.10.5.15 MCASP
        16. 6.10.5.16 MCSPI
          1. 6.10.5.16.1 MCSPI — Controller Mode
          2. 6.10.5.16.2 MCSPI — Peripheral Mode
        17. 6.10.5.17 MMCSD
          1. 6.10.5.17.1 MMC0 - eMMC Interface
            1. 6.10.5.17.1.1 Legacy SDR Mode
            2. 6.10.5.17.1.2 High Speed SDR Mode
            3. 6.10.5.17.1.3 High Speed DDR Mode
            4. 6.10.5.17.1.4 HS200 Mode
            5. 6.10.5.17.1.5 HS400 Mode
          2. 6.10.5.17.2 MMC1 - SD/SDIO Interface
            1. 6.10.5.17.2.1 Default Speed Mode
            2. 6.10.5.17.2.2 High Speed Mode
            3. 6.10.5.17.2.3 UHS–I SDR12 Mode
            4. 6.10.5.17.2.4 UHS–I SDR25 Mode
            5. 6.10.5.17.2.5 UHS–I SDR50 Mode
            6. 6.10.5.17.2.6 UHS–I DDR50 Mode
            7. 6.10.5.17.2.7 UHS–I SDR104 Mode
        18. 6.10.5.18 CPTS
          1. 6.10.5.18.1 CPTS Timing Requirements
          2. 6.10.5.18.2 CPTS Switching Characteristics
        19. 6.10.5.19 OSPI
          1. 6.10.5.19.1 OSPI0/1 PHY Mode
            1. 6.10.5.19.1.1 OSPI0/1 With PHY Data Training
            2. 6.10.5.19.1.2 OSPI Without Data Training
              1. 6.10.5.19.1.2.1 OSPI Timing Requirements – SDR Mode
              2. 6.10.5.19.1.2.2 OSPI Switching Characteristics – SDR Mode
              3. 6.10.5.19.1.2.3 OSPI Timing Requirements – DDR Mode
              4. 6.10.5.19.1.2.4 OSPI Switching Characteristics – PHY DDR Mode
          2. 6.10.5.19.2 OSPI0/1 Tap Mode
            1. 6.10.5.19.2.1 OSPI0 Tap SDR Timing
            2. 6.10.5.19.2.2 OSPI0 Tap DDR Timing
        20. 6.10.5.20 PCIE
        21. 6.10.5.21 Timers
          1. 6.10.5.21.1 Timing Requirements for Timers
          2. 6.10.5.21.2 Switching Characteristics for Timers
        22. 6.10.5.22 UART
          1. 6.10.5.22.1 Timing Requirements for UART
          2. 6.10.5.22.2 UART Switching Characteristics
        23. 6.10.5.23 USB
      6. 6.10.6 Emulation and Debug
        1. 6.10.6.1 Trace
        2. 6.10.6.2 JTAG
          1. 6.10.6.2.1 JTAG Electrical Data and Timing
            1. 6.10.6.2.1.1 JTAG Timing Requirements
            2. 6.10.6.2.1.2 JTAG Switching Characteristics
  8. 7 Applications, Implementation, and Layout
    1. 7.1 Device Connection and Layout Fundamentals
      1. 7.1.1 Power Supply Decoupling and Bulk Capacitors
        1. 7.1.1.1 Power Distribution Network Implementation Guidance
      2. 7.1.2 External Oscillator
      3. 7.1.3 JTAG and EMU
      4. 7.1.4 Reset
      5. 7.1.5 Unused Pins
      6. 7.1.6 Hardware Design Guide for JacintoTM 7 Devices
    2. 7.2 Peripheral- and Interface-Specific Design Information
      1. 7.2.1 LPDDR4 Board Design and Layout Guidelines
      2. 7.2.2 OSPI and QSPI Board Design and Layout Guidelines
        1. 7.2.2.1 No Loopback and Internal Pad Loopback
        2. 7.2.2.2 External Board Loopback
        3. 7.2.2.3 DQS (only available in Octal Flash devices)
      3. 7.2.3 USB VBUS Design Guidelines
      4. 7.2.4 System Power Supply Monitor Design Guidelines using VMON/POK
      5. 7.2.5 High Speed Differential Signal Routing Guidance
      6. 7.2.6 Thermal Solution Guidance
  9. 8 Device and Documentation Support
    1. 8.1 Device Nomenclature
      1. 8.1.1 Standard Package Symbolization
      2. 8.1.2 Device Naming Convention
    2. 8.2 Tools and Software
    3. 8.3 Documentation Support
    4. 8.4 Trademarks
    5. 8.5 Support Resources
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information
    1. 10.1 Packaging Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • ALZ|770
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Device Comparison

Table 4-1 shows the features of the SoC.

Note: To understand what device features are currently supported by TI Software Development Kits (SDKs), see the TDA4VE Software Build Sheet (PROCESSOR-SDK-J721S2).
Table 4-1 Device Comparison
FEATURES(8) REFERENCE NAME TDA4VE88 TDA4AL88 TDA4VL21
FEATURES
WKUP_CTRL_MMR_CFG0_JTAG_USER_ID[31:16]
DEVICE_ID register bit field value(7)(8)		 0x23A0 0x23A8 0x23B0
PROCESSORS AND ACCELERATORS
Speed Grades T, N T, N H
Arm Cortex-A72 Microprocessor Subsystem Arm A72 Dual Core
Arm Cortex-R5F Arm R5F Hexa Core Quad Core
Lockstep Optional(1)
Security Management Subsystem SMS Yes
Security Accelerators SA Yes
C7x Floating Point, Vector DSP C7x DSP Dual Core
Deep Learning Accelerator MMA Yes
Graphics Accelerator IMG BXS-4-64 GPU Yes No Yes
Depth and Motion Processing Accelerators DMPAC Yes
Vision Processing Accelerators VPAC Yes
Video Encoder/Decoder VENC/VDEC Enc/Dec Enc only Enc/Dec
SAFETY AND SECURITY
Safety Targeted Safety Optional(1)
Device Security Security Optional(2)
AEC-Q100 Qualified Q1 Optional(3)
PROGRAM AND DATA STORAGE
On-Chip Shared Memory (RAM) in MAIN Domain OCSRAM 2x512KB SRAM 1x512KB SRAM
On-Chip Shared Memory (RAM) in MCU Domain MCU_MSRAM 1MB SRAM
Multicore Shared Memory Controller MSMC 4MB (On-Chip SRAM with ECC)
LPDDR4 DDR Subsystem DDRSS0(4) Up to 8GB (32-bit data) with inline ECC
DDRSS1(4) Up to 8GB (32-bit data) with inline ECC No(10)
SECDED 7-Bit
General-Purpose Memory Controller GPMC Up to 1GB with ECC
PERIPHERALS
Display Subsystem DSS Yes
DSI 4L TX 2 1(12)
eDP 4L 1 0 1
DPI 1
Modular Controller Area Network Interface with Full CAN-FD Support MCAN 20
General-Purpose I/O GPIO 155
Inter-Integrated Circuit Interface I2C 10
Improved Inter-Integrated Circuit Interface I3C 1
Analog-to-Digital Converter ADC 2
Capture Subsystem with Camera Serial Interface (CSI2) CSI2.0 4L RX 2
CSI2.0 4L TX 2
Multichannel Serial Peripheral Interface MCSPI 11
Multichannel Audio Serial Port MCASP0 16 Serializers
MCASP1 5 Serializers
MCASP2 5 Serializers
MCASP3 3 Serializers
MCASP4 5 Serializers
MultiMedia Card/ Secure Digital Interface MMCSD0 eMMC (8-bits)
MMCSD1 SD/SDIO (4-bits)
Universal Flash Storage UFS 2L No
Flash Subsystem (FSS) OSPI0 8-bits(6)
OSPI1(9) 4-bits
HyperBus Yes(6)
4x PCI Express Port with Integrated PHY PCIE0 Up to Four Lanes(5)
Hyperlink HYP No(11)
Gigabit Ethernet Interface MCU 1x RGMII or RMII
Main 1x RGMII or RMII
General-Purpose Timers TIMER 30
Enhanced High Resolution Pulse-Width Modulator Module eHRPWM 6
Enhanced Capture Module eCAP 3
Enhanced Quadrature Encoder Pulse Module eQEP 3
Universal Asynchronous Receiver and Transmitter UART 12
Universal Serial Bus (USB3.1) SuperSpeed Dual-Role-Device (DRD) Ports with SS PHY USB0 Yes(5)
(1) Safety features including R5F Lockstep and SIL/ASIL ratings are only applicable to select part number variants as indicated by the Device Type (Y) identifier in the Table 10-1, Nomenclature Description table.
(2) Device security features including Secure Boot and Customer Programmable Keys are applicable to select part number variants as indicated by the Device Type (Y) identifier in the Table 10-1, Nomenclature Description table
(3) AEC-Q100 qualification is applicable to select part number variants as indicated by the Automotive Designator (Q1) identifier in the Table 10-1, Nomenclature Description table
(4) DDRSS0 and DDRSS1 must always be used in incremental order. For instance, when using a single LPDDR component, it must be connected to the DDR0_* interface
(5) USB3.0 and PCIE share a total of four SerDes lanes.
(6) Two simultaneous flash interfaces configured as OSPI0 and OSPI1, or HyperBus and OSPI1.
(7) For more details about the WKUP_CTRL_MMR_CFG0_JTAG_USER_ID register and DEVICE_ID bit field, see the device TRM.
(8) J721S2 is the base part number for the superset device. Software should constrain the features used to match the intended production device. (WKUP_CTRL_MMR_CFG0_JTAG_USER_ID[31:16] "DEVICE_ID" register bit field value: 0x231F.)
(9) OSPI1 module only pins out 4 pins and is referred to as QSPI in some contexts.
(10) Part number variants with DDRSS1 as "No" should not use the DDR1_* pins. The DDR1_* pins should be connected as recommended in the section titled "Connections for Unused Pins"
(11) Hyperlink is not supported on this SoC. System designs should not use the signals HYP_*, HYP0_*, HYP1_*.
(12) Part number variants with DSI 4L TX as "1" can only use the DSI0 interface for DSI functionality. DSI1* balls can still be used for CSI1 functionality.