SBOSAG7 April   2025 TMCS1143

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Power Ratings
    6. 6.6 Insulation Specifications
    7. 6.7 Safety Limiting Values
    8. 6.8 Electrical Characteristics
  8. 7 Typical Characteristics
    1. 7.1 Insulation Characteristics Curves
  9. 8 Parameter Measurement Information
    1. 8.1 Accuracy Parameters
      1. 8.1.1 Sensitivity Error
      2. 8.1.2 Offset Error and Offset Error Drift
      3. 8.1.3 Nonlinearity Error
      4. 8.1.4 Power Supply Rejection Ratio
      5. 8.1.5 Common-Mode Rejection Ratio
      6. 8.1.6 External Magnetic Field Errors
    2. 8.2 Transient Response Parameters
      1. 8.2.1 CMTI, Common-Mode Transient Immunity
    3. 8.3 Safe Operating Area
      1. 8.3.1 Continuous DC or Sinusoidal AC Current
      2. 8.3.2 Repetitive Pulsed Current SOA
      3. 8.3.3 Single Event Current Capability
  10. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Current Input
      2. 9.3.2 Ambient Field Rejection
      3. 9.3.3 High-Precision Signal Chain
        1. 9.3.3.1 Temperature Stability
        2. 9.3.3.2 Lifetime and Environmental Stability
      4. 9.3.4 Internal Reference Voltage
      5. 9.3.5 Current-Sensing Measurable Ranges
      6. 9.3.6 Overcurrent Detection
        1. 9.3.6.1 Setting The User Configurable Overcurrent Threshold
          1. 9.3.6.1.1 Setting Overcurrent Threshold Using Power Supply Voltage
          2. 9.3.6.1.2 Setting Overcurrent Threshold Using Internal Reference Voltage
          3. 9.3.6.1.3 Setting Overcurrent Threshold Example
        2. 9.3.6.2 Overcurrent Output Response
      7. 9.3.7 Sensor Diagnostics
        1. 9.3.7.1 Thermal Alert
        2. 9.3.7.2 Sensor Alert
    4. 9.4 Device Functional Modes
      1. 9.4.1 Power-Down Behavior
  11. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Total Error Calculation Examples
        1. 10.1.1.1 Room-Temperature Error Calculations
        2. 10.1.1.2 Full-Temperature Range Error Calculations
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curve
    3. 10.3 Power Supply Recommendations
    4. 10.4 Layout
      1. 10.4.1 Layout Guidelines
      2. 10.4.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Device Nomenclature
    2. 11.2 Device Support
      1. 11.2.1 Development Support
    3. 11.3 Documentation Support
      1. 11.3.1 Related Documentation
    4. 11.4 Receiving Notification of Documentation Updates
    5. 11.5 Support Resources
    6. 11.6 Trademarks
    7. 11.7 Electrostatic Discharge Caution
    8. 11.8 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Mechanical Data
    2.     PACKAGING INFORMATION
    3. 13.2 Tape and Reel Information

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DVF|10
Thermal pad, mechanical data (Package|Pins)

PACKAGING INFORMATION

Orderable Device Status(1) Package Type Package Drawing Pins Package Qty Eco Plan(2) Lead finish/Ball material(6) MSL Peak Temp(3) Op Temp (°C) Device Marking(4)(5)
TMCS1143A3AQDVFR ACTIVE SOIC DVF 10 1000 RoHS & Green SN Level-3-260C-168 HR -40 to 125 1143A3A
TMCS1143A5AQDVFR ACTIVE SOIC DVF 10 1000 RoHS & Green SN Level-3-260C-168 HR -40 to 125 1143A5A
TMCS1143A8AQDVFR ACTIVE SOIC DVF 10 1000 RoHS & Green SN Level-3-260C-168 HR -40 to 125 1143A8A
TMCS1143AAAQDVFR ACTIVE SOIC DVF 10 1000 RoHS & Green SN Level-3-260C-168 HR -40 to 125 1143AAA
TMCS1143ACAQDVFR ACTIVE SOIC DVF 10 1000 RoHS & Green SN Level-3-260C-168 HR -40 to 125 1143ACA
TMCS1143B2AQDVFR ACTIVE SOIC DVF 10 1000 RoHS & Green SN Level-3-260C-168 HR -40 to 125 1143B2A
TMCS1143B3AQDVFR ACTIVE SOIC DVF 10 1000 RoHS & Green SN Level-3-260C-168 HR -40 to 125 1143B3A
TMCS1143B5AQDVFR ACTIVE SOIC DVF 10 1000 RoHS & Green SN Level-3-260C-168 HR -40 to 125 1143B5A
TMCS1143B8AQDVFR ACTIVE SOIC DVF 10 1000 RoHS & Green SN Level-3-260C-168 HR -40 to 125 1143B8A
TMCS1143BAAQDVFR ACTIVE SOIC DVF 10 1000 RoHS & Green SN Level-3-260C-168 HR -40 to 125 1143BAA
TMCS1143C5AQDVFR ACTIVE SOIC DVF 10 1000 RoHS & Green SN Level-3-260C-168 HR -40 to 125 1143C5A
TMCS1143C8AQDVFR ACTIVE SOIC DVF 10 1000 RoHS & Green SN Level-3-260C-168 HR -40 to 125 1143C8A
TMCS1143CAAQDVFR ACTIVE SOIC DVF 10 1000 RoHS & Green SN Level-3-260C-168 HR -40 to 125 1143CAA
TMCS1143CCAQDVFR ACTIVE SOIC DVF 10 1000 RoHS & Green SN Level-3-260C-168 HR -40 to 125 1143CCA
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer: The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.