SBOSAG7 April   2025 TMCS1143

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Power Ratings
    6. 6.6 Insulation Specifications
    7. 6.7 Safety Limiting Values
    8. 6.8 Electrical Characteristics
  8. 7 Typical Characteristics
    1. 7.1 Insulation Characteristics Curves
  9. 8 Parameter Measurement Information
    1. 8.1 Accuracy Parameters
      1. 8.1.1 Sensitivity Error
      2. 8.1.2 Offset Error and Offset Error Drift
      3. 8.1.3 Nonlinearity Error
      4. 8.1.4 Power Supply Rejection Ratio
      5. 8.1.5 Common-Mode Rejection Ratio
      6. 8.1.6 External Magnetic Field Errors
    2. 8.2 Transient Response Parameters
      1. 8.2.1 CMTI, Common-Mode Transient Immunity
    3. 8.3 Safe Operating Area
      1. 8.3.1 Continuous DC or Sinusoidal AC Current
      2. 8.3.2 Repetitive Pulsed Current SOA
      3. 8.3.3 Single Event Current Capability
  10. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Current Input
      2. 9.3.2 Ambient Field Rejection
      3. 9.3.3 High-Precision Signal Chain
        1. 9.3.3.1 Temperature Stability
        2. 9.3.3.2 Lifetime and Environmental Stability
      4. 9.3.4 Internal Reference Voltage
      5. 9.3.5 Current-Sensing Measurable Ranges
      6. 9.3.6 Overcurrent Detection
        1. 9.3.6.1 Setting The User Configurable Overcurrent Threshold
          1. 9.3.6.1.1 Setting Overcurrent Threshold Using Power Supply Voltage
          2. 9.3.6.1.2 Setting Overcurrent Threshold Using Internal Reference Voltage
          3. 9.3.6.1.3 Setting Overcurrent Threshold Example
        2. 9.3.6.2 Overcurrent Output Response
      7. 9.3.7 Sensor Diagnostics
        1. 9.3.7.1 Thermal Alert
        2. 9.3.7.2 Sensor Alert
    4. 9.4 Device Functional Modes
      1. 9.4.1 Power-Down Behavior
  11. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Total Error Calculation Examples
        1. 10.1.1.1 Room-Temperature Error Calculations
        2. 10.1.1.2 Full-Temperature Range Error Calculations
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curve
    3. 10.3 Power Supply Recommendations
    4. 10.4 Layout
      1. 10.4.1 Layout Guidelines
      2. 10.4.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Device Nomenclature
    2. 11.2 Device Support
      1. 11.2.1 Development Support
    3. 11.3 Documentation Support
      1. 11.3.1 Related Documentation
    4. 11.4 Receiving Notification of Documentation Updates
    5. 11.5 Support Resources
    6. 11.6 Trademarks
    7. 11.7 Electrostatic Discharge Caution
    8. 11.8 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Mechanical Data
    2.     PACKAGING INFORMATION
    3. 13.2 Tape and Reel Information

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DVF|10
Thermal pad, mechanical data (Package|Pins)

6.4 Thermal Information

THERMAL METRIC(1) TMCS1143(2) UNIT
DVF (SOIC-W-10)
10 PINS
RθJA Junction-to-ambient thermal resistance 39.7 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 36.9 °C/W
RθJB Junction-to-board thermal resistance 6.3 °C/W
ΨJT Junction-to-top characterization parameter 9.0 °C/W
ΨJB Junction-to-board characterization parameter 4.8 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.
(2) Applies when device mounted on the TMCS1143xEVM. For more details, see the Safe Operating Area section.