SLVSJQ6 September   2025 TMF0064

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Functional Tests
    8. 5.8 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 64768-Bit FRAM
      2. 6.3.2 FRAM Status Memory
      3. 6.3.3 Address Registers and Transfer Status
      4. 6.3.4 Writing Data to the FRAM
      5. 6.3.5 TMF0064 Device ID
      6. 6.3.6 Bus Termination
    4. 6.4 Device Functional Modes
      1. 6.4.1 Test Procedures for Functional Tests
        1. 6.4.1.1 Multiple Target Configurations
    5. 6.5 Programming
      1. 6.5.1 Serial Communication
      2. 6.5.2 Initialization
      3. 6.5.3 ROM Commands
        1. 6.5.3.1 READ ROM Command [33h]
        2. 6.5.3.2 MATCH ROM Command [55h]
        3. 6.5.3.3 SKIP ROM Command [CCh]
        4. 6.5.3.4 SEARCH ROM Command [F0h]
        5. 6.5.3.5 RESUME Command [A5h]
        6. 6.5.3.6 OVERDRIVE SKIP ROM Command [3Ch]
        7. 6.5.3.7 OVERDRIVE MATCH ROM Command [69h]
      4. 6.5.4 Memory Function Commands
        1. 6.5.4.1 Write Scratchpad Command [0Fh]
        2. 6.5.4.2 Read Scratchpad Command [AAh]
        3. 6.5.4.3 Copy Scratchpad [55h]
        4. 6.5.4.4 Read Memory [F0h]
        5. 6.5.4.5 Extended Read Memory [A5h]
        6. 6.5.4.6 Memory Command Flow Charts
      5. 6.5.5 SDQ Signaling
        1. 6.5.5.1 RESET and PRESENCE PULSE
        2. 6.5.5.2 Write-Read-Time Slots
      6. 6.5.6 IDLE
      7. 6.5.7 CRC Generation
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information
    1. 10.1 Packaging Information
    2. 10.2 Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)

5.4 Thermal Information

THERMAL METRIC(1) DRP (VSON) TO-92 (LP) UNIT
6 PINS 3 PINS
RθJA Junction-to-ambient thermal resistance 50.1 129.3 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 54.3 93.6 °C/W
RθJB Junction-to-board thermal resistance 21.8 99.3 °C/W
ψJT Junction-to-top characterization parameter 0.9 23.7 °C/W
ψJB Junction-to-board characterization parameter 21.7 99.3 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 5.9 - °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.