SLVSJQ6A September   2025  – June 2026 TMF0064

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Functional Tests
    8. 5.8 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 64768-Bit FRAM
      2. 6.3.2 FRAM Status Memory
      3. 6.3.3 Address Registers and Transfer Status
      4. 6.3.4 Writing Data to the FRAM
      5. 6.3.5 TMF0064 Device ID
      6. 6.3.6 Bus Termination
    4. 6.4 Device Functional Modes
      1. 6.4.1 Test Procedures for Functional Tests
        1. 6.4.1.1 Multiple Target Configurations
    5. 6.5 Programming
      1. 6.5.1 Serial Communication
      2. 6.5.2 Initialization
      3. 6.5.3 ROM Commands
        1. 6.5.3.1 READ ROM Command [33h]
        2. 6.5.3.2 MATCH ROM Command [55h]
        3. 6.5.3.3 SKIP ROM Command [CCh]
        4. 6.5.3.4 SEARCH ROM Command [F0h]
        5. 6.5.3.5 RESUME Command [A5h]
        6. 6.5.3.6 OVERDRIVE SKIP ROM Command [3Ch]
        7. 6.5.3.7 OVERDRIVE MATCH ROM Command [69h]
      4. 6.5.4 Memory Function Commands
        1. 6.5.4.1 Write Scratchpad Command [0Fh]
        2. 6.5.4.2 Read Scratchpad Command [AAh]
        3. 6.5.4.3 Copy Scratchpad [55h]
        4. 6.5.4.4 Read Memory [F0h]
        5. 6.5.4.5 Extended Read Memory [A5h]
        6. 6.5.4.6 Memory Command Flow Charts
      5. 6.5.5 SDQ Signaling
        1. 6.5.5.1 RESET and PRESENCE PULSE
        2. 6.5.5.2 Write-Read-Time Slots
      6. 6.5.6 IDLE
      7. 6.5.7 CRC Generation
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information
    1. 10.1 Packaging Information
    2. 10.2 Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.5.4.2 Read Scratchpad Command [AAh]

To read the scratchpad, the host issues the Read Scratchpad command (AAh) and then reads the 2-byte address, the Ending Offset/Data Status byte (E/S) and finally the scratchpad data starting at the scratchpad offset address. The host verifies the address, E/S byte, and the scratchpad data match with the information transmitted during the Write Scratchpad command. Use the Read Scratchpad command to validate the 2-byte address and the scratchpad data. The host can read the inverted CRC16 once reaching the end of the scratchpad. If the host continues reading after reading the 2 CRC bytes, the host only receives 1s.