SBOSAJ5 December   2024 TMP113

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Related Products
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 I2C Interface Timing
    7. 6.7 Timing Diagrams
    8. 6.8 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Digital Temperature Output
      2. 7.3.2 Decoding Temperature Data
      3. 7.3.3 Temperature Limits and Alert
      4. 7.3.4 NIST Traceability
    4. 7.4 Device Functional Modes
      1. 7.4.1 Continuous-Conversion Mode
      2. 7.4.2 One-Shot Mode
    5. 7.5 Programming
      1. 7.5.1 Serial Interface
      2. 7.5.2 Bus Overview
      3. 7.5.3 Device Address
      4. 7.5.4 Bus Transactions
        1. 7.5.4.1 Writes
        2. 7.5.4.2 Reads
        3. 7.5.4.3 General Call Reset Function
        4. 7.5.4.4 SMBus Alert Response
        5. 7.5.4.5 Time-Out Function
        6. 7.5.4.6 Coexist on I3C Mixed Bus
  9. 8 Register Map
    1. 8.1 Temp_Result Register (address = 00h) [reset = 0000h]
    2. 8.2 Configuration Register (address = 01h) [reset = 40A0h]
    3. 8.3 TLow_Limit Register (address = 02h) [reset = 4B00h]
    4. 8.4 THigh_Limit Register (address = 03h) [reset = 5000h]
    5. 8.5 Device ID Register (Address = 0Bh) [reset = 113xh]
    6. 8.6 Unique_ID0 Register (Address = 0Ch) [reset = xxxxh]
    7. 8.7 Unique_ID1 Register (Address = 0Dh) [reset = xxxxh]
    8. 8.8 Unique_ID2 Register (Address = 0Eh) [reset = xxxxh]
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Equal I2C Pullup and Supply Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Device Support
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 Receiving Notification of Documentation Updates
    4. 10.4 Support Resources
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Package Option Addendum
    2. 12.2 Tape and Reel Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • YBG|6
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8 Register Map

Table 8-1 TMP113 Register Map
ADDRESSTYPERESETACRONYMREGISTER NAMESECTION
00hR0000hTemp_ResultTemperature result registerGo
01hR/W40A0hConfigurationConfiguration registerGo
02hR/W4B00hTLow_LimitTemperature low limit registerGo
03hR/W5000hTHigh_LimitTemperature high limit registerGo
04h - 0AhRxxxxhReservedReserved-
0BhR1130hDevice_IDDevice IDSection 8.5
0ChRxxxxhUnique_ID0NIST Data 0 RegisterSection 8.6
0DhRxxxxhUnique_ID1NIST Data 1 RegisterSection 8.7
0EhRxxxxhUnique_ID2NIST Data 2 RegisterSection 8.8
0FhRxxxxhReservedReserved-
Table 8-2 TMP113 Register Section/Block Access Type Codes
Access TypeCodeDescription
Read Type
RRRead
RCRRead
Cto Clear
R-0R Read
-0Returns 0s
Write Type
WWWrite
W0CPW W
0C0 to clear
PRequires privileged access
Reset or Default Value
-nValue after reset or the default value