SNIS237A December   2024  – April 2025 TMP118

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Two-Wire Interface Timing
    7. 6.7 Timing Diagram
    8. 6.8 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 Digital Temperature Output
      2. 7.3.2 Averaging
      3. 7.3.3 Temperature Comparator and Hysteresis
      4. 7.3.4 Strain Tolerance
      5. 7.3.5 NIST Traceability
    4. 7.4 Device Functional Modes
      1. 7.4.1 Continuous Conversion Mode
      2. 7.4.2 One-Shot Mode (OS)
    5. 7.5 Programming
      1. 7.5.1 I2C and SMBus Interface
        1. 7.5.1.1 Serial Interface
          1. 7.5.1.1.1 Bus Overview
          2. 7.5.1.1.2 Device Address
          3. 7.5.1.1.3 Writing and Reading Operation
            1. 7.5.1.1.3.1 Writes
            2. 7.5.1.1.3.2 Reads
          4. 7.5.1.1.4 General-Call Reset Function
          5. 7.5.1.1.5 Timeout Function
          6. 7.5.1.1.6 Coexistence on I3C Mixed Bus
  9. 8 Device Registers
    1. 8.1 Register Map
      1. 8.1.1 Temp_Result Register (address = 00h) [reset = 0000h]
      2. 8.1.2 Configuration Register (address = 01h) [reset = 60B0h]
      3. 8.1.3 TLow_Limit Register (address = 02h) [reset = 2580h]
      4. 8.1.4 THigh_Limit Register (address = 03h) [reset = 2800h]
      5. 8.1.5 Device ID Register (Address = 0Bh) [reset = 1180h]
      6. 8.1.6 Unique_ID0 Register (Address = 0Ch) [reset = xxxxh]
      7. 8.1.7 Unique_ID1 Register (Address = 0Dh) [reset = xxxxh]
      8. 8.1.8 Unique_ID2 Register (Address = 0Eh) [reset = xxxxh]
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Separate I2C Pullup and Supply Application
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
      2. 9.2.2 Equal I2C Pullup and Supply Voltage Application
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Examples
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • YMS|4
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.8 Typical Characteristics

at TA = 25°C, V+ = 1.8V (unless otherwise noted)

TMP118 TMP118 Temperature Error vs Temperature
VDD = 1.8V, One Shot Conversion, 8x averages mode
Figure 6-2 TMP118 Temperature Error vs Temperature
TMP118 TMP118 Temperature Error vs Temperature
VDD = 3.3V, One Shot Conversion, 8x averages mode
Figure 6-4 TMP118 Temperature Error vs Temperature
TMP118 Temperature Error vs Supply Voltage
One Shot Conversion, 8x averages mode
Figure 6-6 Temperature Error vs Supply Voltage
TMP118 Temperature Data Noise Distribution
One Shot Conversion, No Averaging, TA = -40°C to 125°C
Figure 6-8 Temperature Data Noise Distribution
TMP118 Long-term Temperature Stability
High temperature (150°C) stress testing with temperature error data measurement at 500hr and 1000hr stress duration
Figure 6-10 Long-term Temperature Stability
TMP118 Average Quiescent Current vs Temperature
1Hz Conversion Rate, No Averaging
Figure 6-12 Average Quiescent Current vs Temperature
TMP118 Average Quiescent Current vs Temperature
VDD = 1.8V
Figure 6-14 Average Quiescent Current vs Temperature
TMP118 Active Conversion Current vs Temperature
 
Figure 6-16 Active Conversion Current vs Temperature
TMP118 Shutdown Current vs Temperature
 
Figure 6-18 Shutdown Current vs Temperature
TMP118 Temperature Measurement Response Time
VDD = 1.8V, Stirred Liquid
Figure 6-20 Temperature Measurement Response Time
TMP118 Worse Case Temperature Error From Self-heating (8x Back-to-back Averaging)
Rigid-PCB (1.575mm thickness), VBUS = VDD, continuing one-shot conversions (10.5Hz), IAVG= 49μA, Still Air
Figure 6-22 Worse Case Temperature Error From Self-heating (8x Back-to-back Averaging)
TMP118 Normalized Temperature Error vs Strain
Single layer rigid PCB (62mil thickness), TA = 25 °C
Figure 6-24 Normalized Temperature Error vs Strain
TMP118 TMP118M Temperature Error vs Temperature
VDD = 1.8V, One Shot Conversion, 8x averages mode
Figure 6-3 TMP118M Temperature Error vs Temperature
TMP118 TMP118M Temperature Error vs Temperature
VDD = 3.3V, One Shot Conversion, 8x averages mode
Figure 6-5 TMP118M Temperature Error vs Temperature
TMP118 Gain Error (Normalized at 35°C)
VDD = 1.8V
Figure 6-7 Gain Error (Normalized at 35°C)
TMP118 Temperature Data Noise Distribution
One Shot Conversion, 8x Back-to-back Averaging, TA = -40°C to 125°C
Figure 6-9 Temperature Data Noise Distribution
TMP118 Average Conversion Time vs Temperature
VDD = 1.4V to 5.5V
Figure 6-11 Average Conversion Time vs Temperature
TMP118 Average Quiescent Current vs Temperature
1Hz Conversion Rate, 8x Back-to-back Averaging
Figure 6-13 Average Quiescent Current vs Temperature
TMP118 Average Quiescent Current vs Conversion Rate
VDD = 1.8V 
Figure 6-15 Average Quiescent Current vs Conversion Rate
TMP118 Standby Current vs Temperature
 
Figure 6-17 Standby Current vs Temperature
TMP118 Shutdown Current vs Bus Frequency
VDD = 1.8V
Figure 6-19 Shutdown Current vs Bus Frequency
TMP118 Worst Case Temperature Error From Self-heating (8x Back-to-back Averaging)
Single layer flex-PCB (0.13mm thickness), VBUS = VDD, continuing one-shot conversions (10.5Hz), IAVG= 49μA, Still Air
Figure 6-21 Worst Case Temperature Error From Self-heating (8x Back-to-back Averaging)
TMP118 SDA Output Voltage vs Load Current
TA = 25 °C
Figure 6-23 SDA Output Voltage vs Load Current