SNIS237A December   2024  – April 2025 TMP118

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Two-Wire Interface Timing
    7. 6.7 Timing Diagram
    8. 6.8 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 Digital Temperature Output
      2. 7.3.2 Averaging
      3. 7.3.3 Temperature Comparator and Hysteresis
      4. 7.3.4 Strain Tolerance
      5. 7.3.5 NIST Traceability
    4. 7.4 Device Functional Modes
      1. 7.4.1 Continuous Conversion Mode
      2. 7.4.2 One-Shot Mode (OS)
    5. 7.5 Programming
      1. 7.5.1 I2C and SMBus Interface
        1. 7.5.1.1 Serial Interface
          1. 7.5.1.1.1 Bus Overview
          2. 7.5.1.1.2 Device Address
          3. 7.5.1.1.3 Writing and Reading Operation
            1. 7.5.1.1.3.1 Writes
            2. 7.5.1.1.3.2 Reads
          4. 7.5.1.1.4 General-Call Reset Function
          5. 7.5.1.1.5 Timeout Function
          6. 7.5.1.1.6 Coexistence on I3C Mixed Bus
  9. 8 Device Registers
    1. 8.1 Register Map
      1. 8.1.1 Temp_Result Register (address = 00h) [reset = 0000h]
      2. 8.1.2 Configuration Register (address = 01h) [reset = 60B0h]
      3. 8.1.3 TLow_Limit Register (address = 02h) [reset = 2580h]
      4. 8.1.4 THigh_Limit Register (address = 03h) [reset = 2800h]
      5. 8.1.5 Device ID Register (Address = 0Bh) [reset = 1180h]
      6. 8.1.6 Unique_ID0 Register (Address = 0Ch) [reset = xxxxh]
      7. 8.1.7 Unique_ID1 Register (Address = 0Dh) [reset = xxxxh]
      8. 8.1.8 Unique_ID2 Register (Address = 0Eh) [reset = xxxxh]
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Separate I2C Pullup and Supply Application
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
      2. 9.2.2 Equal I2C Pullup and Supply Voltage Application
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Examples
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • YMS|4
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.3.2 Averaging

The device supports 4 different averaging modes to help suppress noise as well as reduce the impact from external temperature fluctuations. The AVG [3:2] bits in the Configuration register can be programmed to control the averaging behavior of the device:

  • No Averaging [00b]: The device performs 1 single conversion per conversion period, and temperature result is stored immediately into the Temp_Result register at the end of every conversion.
TMP118 Conversion (1Hz Conversion Rate Example) With No Averaging Figure 7-2 Conversion (1Hz Conversion Rate Example) With No Averaging
  • Back-to-back Averaging [01b or 10b]: The device accumulates and stores a number of temperature conversion results and reports the average of all the stored results at the end of the process. If AVG [3:2] is set to 01b, 4 conversions are executed back-to-back in every conversion period and the average temperature result is stored into the Temp_Result register after the 4 conversions are completed. If AVG [3:2] is set to 10b, 8 conversions are executed back-to-back in every conversion period and the average temperature result is stored into the Temp_Result register after the 8 conversions are completed.

    The Back-to-back Averaging feature is useful to reduce the impact from the internal noise sources of the device, such as the device thermal noise and ADC quantization noise. Figure 6-8 and Figure 6-9 illustrates the improved noise performance of the device as a result of turning on the 8x regular averaging. Note Back-to-back Averaging increases the average current consumption of the device due to increased active conversion time in every conversion period.

TMP118 Conversion (1Hz Conversion Rate Example) With 4x Back-to-Back Averaging Figure 7-3 Conversion (1Hz Conversion Rate Example) With 4x Back-to-Back Averaging
  • Moving 4x Averaging [11b]: If AVG [3:2] is set to 11b, the device performs 1 single conversion per conversion period, and the new temperature result is averaged together with the results from the 3 previous conversion period and stored into the Temp_Result register. The moving averaging feature can be beneficial to filter out fluctuation of external temperature source by taking multiple samples and averaging out the result.
TMP118 Conversion (1Hz Conversion Period) With 4x Running Averaging Figure 7-4 Conversion (1Hz Conversion Period) With 4x Running Averaging
Note:

Averaging can be used in both the continuous conversion mode and the one-shot mode. Note for the two faster conversion rate settings (Conversion_Rate[1:0]= 10b (15.625ms / 64Hz) or 11b (7.812ms / 128Hz)), 4x Averaging and 8x Averaging cannot be applied due to timing violation. Programming the AVG[1:0] setting to 4x Averaging (01b) or 8x Averaging (10b) causes the device to automatically revert to the 1Hz conversion rate. Using the Moving 4x Averaging (AVG[1:0]= 11b) setting is recommended if averaging feature is desired for the two faster conversion rate settings.