SNIS237A December   2024  – April 2025 TMP118

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Two-Wire Interface Timing
    7. 6.7 Timing Diagram
    8. 6.8 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 Digital Temperature Output
      2. 7.3.2 Averaging
      3. 7.3.3 Temperature Comparator and Hysteresis
      4. 7.3.4 Strain Tolerance
      5. 7.3.5 NIST Traceability
    4. 7.4 Device Functional Modes
      1. 7.4.1 Continuous Conversion Mode
      2. 7.4.2 One-Shot Mode (OS)
    5. 7.5 Programming
      1. 7.5.1 I2C and SMBus Interface
        1. 7.5.1.1 Serial Interface
          1. 7.5.1.1.1 Bus Overview
          2. 7.5.1.1.2 Device Address
          3. 7.5.1.1.3 Writing and Reading Operation
            1. 7.5.1.1.3.1 Writes
            2. 7.5.1.1.3.2 Reads
          4. 7.5.1.1.4 General-Call Reset Function
          5. 7.5.1.1.5 Timeout Function
          6. 7.5.1.1.6 Coexistence on I3C Mixed Bus
  9. 8 Device Registers
    1. 8.1 Register Map
      1. 8.1.1 Temp_Result Register (address = 00h) [reset = 0000h]
      2. 8.1.2 Configuration Register (address = 01h) [reset = 60B0h]
      3. 8.1.3 TLow_Limit Register (address = 02h) [reset = 2580h]
      4. 8.1.4 THigh_Limit Register (address = 03h) [reset = 2800h]
      5. 8.1.5 Device ID Register (Address = 0Bh) [reset = 1180h]
      6. 8.1.6 Unique_ID0 Register (Address = 0Ch) [reset = xxxxh]
      7. 8.1.7 Unique_ID1 Register (Address = 0Dh) [reset = xxxxh]
      8. 8.1.8 Unique_ID2 Register (Address = 0Eh) [reset = xxxxh]
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Separate I2C Pullup and Supply Application
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
      2. 9.2.2 Equal I2C Pullup and Supply Voltage Application
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Examples
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • YMS|4
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.6 Two-Wire Interface Timing

Over free-air temperature range and VDD = 1.4V to 5.5V for TA = -40 °C to 125 °C (unless otherwise noted)
STANDARD FAST-MODE FAST-MODE PLUS UNIT
Min Max Min Max Min Max
f(SCL) SCL operating frequency 1 100 100 400 400 1000 kHz
t(BUF) Bus-free time between STOP and START conditions 4.7 1.3 0.5 µs
t(SUSTA) Repeated START condition setup time 4.7 0.6 0.26 µs
t(HDSTA) Hold time after repeated START condition.
After this period, the first clock is generated.		 4.0 0.6 0.26 µs
t(SUSTO) STOP condition setup time 4.0 0.6 0.26 µs
t(HDDAT) Data hold time(1) 0 0 0 ns
t(SUDAT) Data setup time 250 100 50 ns
t(LOW) SCL clock low period 4.7 1.3 0.5 µs
t(HIGH) SCL clock high period 4.0 0.6 0.26 µs
t(VDAT) Data valid time (data response time)(2) 3.45 0.9 0.45 µs
tR SDA, SCL rise time 1000 20 300 120 ns
tF SDA, SCL fall time 300 300 120 ns
ttimeout Timeout 30 30 30 ms
tLPF Glitch suppression filter 50 50 50 ns
(1) The maximum t(HDDAT) can be 0.9µs for Fast-Mode, and is less than the maximum t(VDAT) by a transition time.
(2) t(VDAT) = time for data signal from SCL "LOW" to SDA output ("HIGH" to "LOW", depending on which is worse).