SCDS457A may   2023  – june 2023 TMUX4827

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Thermal Information
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Source or Drain Continuous Current
    6. 6.6 Source or Drain RMS Current
    7. 6.7 Electrical Characteristics 
    8. 6.8 Switching Characteristics 
    9. 6.9 Typical Characteristics
  8. 7 Parameter Measurement Information
    1. 7.1  On-Resistance
    2. 7.2  On-Leakage Current
    3. 7.3  Off-Leakage Current
    4. 7.4  Power-Off Leakage Current
    5. 7.5  Propagation Delay
    6. 7.6  tON (VDD) and tOFF (VDD) Time
    7. 7.7  Transition Time
    8. 7.8  Break-Before-Make
    9. 7.9  THD + Noise
    10. 7.10 Power Supply Rejection Ratio (PSRR)
    11. 7.11 Charge Injection
    12. 7.12 Bandwidth
    13. 7.13 Off Isolation
    14. 7.14 Crosstalk
  9. 8 Detailed Description
    1. 8.1 Functional Block Diagram
    2. 8.2 Device Functional Modes
    3. 8.3 Feature Description
      1. 8.3.1 Beyond the Supply
      2. 8.3.2 Bidirectional Operation
      3. 8.3.3 Over Temperature Protection
      4. 8.3.4 Power-Off Protection
      5. 8.3.5 1.8 V Logic Compatible Inputs
      6. 8.3.6 Fail-Safe Logic
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Audio Amplifier Switching
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Packaging Option Addendum
    2. 11.2 Tape and Reel Information
    3. 11.3 Mechanical Data

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • YBH|9
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

GUID-20220208-SS0I-SG2S-ZF1C-WK47XGVNDSMX-low.svg Figure 5-1 YBH Package, 9-Ball DSBGA (Top View, Bump Side Down)
Legend
Power Input
Input or Output Ground
Table 5-1 Pin Functions
PIN TYPE(1) DESCRIPTION
NO. NAME
A1 S1A I/O Source pin 1A. Can be an input or output.
A2 SEL I Logic control input. Controls the switch connection as provided in Table 8-1.
A3 S2A I/O Source pin 2A. Can be an input or output.
B1 D1 I/O Drain pin 1. Can be an input or output.
B2 GND GND Ground (0 V) reference
B3 D2 I/O Drain pin 2. Can be an input or output.
C1 S1B I/O Source pin 1B. Can be an input or output.
C2 VDD P Positive power supply. This pin is the most positive power-supply potential. For reliable operation, connect a decoupling capacitor ranging from 0.1 µF to 10 µF between VDD and GND. Controls the switch connection as provided in Table 8-1
C3 S2B I/O Source pin 2B. Can be an input or output.
(1) I = input, I/O = input or output, GND = ground, P = power.