SCDS457A may   2023  – june 2023 TMUX4827

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Thermal Information
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Source or Drain Continuous Current
    6. 6.6 Source or Drain RMS Current
    7. 6.7 Electrical Characteristics 
    8. 6.8 Switching Characteristics 
    9. 6.9 Typical Characteristics
  8. 7 Parameter Measurement Information
    1. 7.1  On-Resistance
    2. 7.2  On-Leakage Current
    3. 7.3  Off-Leakage Current
    4. 7.4  Power-Off Leakage Current
    5. 7.5  Propagation Delay
    6. 7.6  tON (VDD) and tOFF (VDD) Time
    7. 7.7  Transition Time
    8. 7.8  Break-Before-Make
    9. 7.9  THD + Noise
    10. 7.10 Power Supply Rejection Ratio (PSRR)
    11. 7.11 Charge Injection
    12. 7.12 Bandwidth
    13. 7.13 Off Isolation
    14. 7.14 Crosstalk
  9. 8 Detailed Description
    1. 8.1 Functional Block Diagram
    2. 8.2 Device Functional Modes
    3. 8.3 Feature Description
      1. 8.3.1 Beyond the Supply
      2. 8.3.2 Bidirectional Operation
      3. 8.3.3 Over Temperature Protection
      4. 8.3.4 Power-Off Protection
      5. 8.3.5 1.8 V Logic Compatible Inputs
      6. 8.3.6 Fail-Safe Logic
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Audio Amplifier Switching
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Packaging Option Addendum
    2. 11.2 Tape and Reel Information
    3. 11.3 Mechanical Data

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • YBH|9
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.3 Power Supply Recommendations

The TMUX4827 operates across a wide supply range from 1.8 to 5.5 V, while supporting input or output signals from -12 V to 12 V

Power-supply bypassing improves noise margin and prevents switching noise propagation from the supply rails to other components. Good power-supply decoupling is important to achieve optimum performance. For improved supply noise immunity, use a supply decoupling capacitor ranging from 0.1 μF to 10 μF at VDD to ground. Place the bypass capacitors as close to the power supply pin of the device as possible using low-impedance connections. TI recommends using multi-layer ceramic chip capacitors (MLCCs) that offer low equivalent series resistance (ESR) and inductance (ESL) characteristics for power-supply decoupling purposes. For very sensitive systems, or for systems in harsh noise environments, avoiding the use of vias for connecting the capacitors to the device pins may offer superior noise immunity. The use of multiple vias in parallel lowers the overall inductance and is beneficial for connections to ground and power planes. Always confirm that the ground (GND) connection is established before supplies are ramped.