SCDS457A may   2023  – june 2023 TMUX4827

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Thermal Information
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Source or Drain Continuous Current
    6. 6.6 Source or Drain RMS Current
    7. 6.7 Electrical Characteristics 
    8. 6.8 Switching Characteristics 
    9. 6.9 Typical Characteristics
  8. 7 Parameter Measurement Information
    1. 7.1  On-Resistance
    2. 7.2  On-Leakage Current
    3. 7.3  Off-Leakage Current
    4. 7.4  Power-Off Leakage Current
    5. 7.5  Propagation Delay
    6. 7.6  tON (VDD) and tOFF (VDD) Time
    7. 7.7  Transition Time
    8. 7.8  Break-Before-Make
    9. 7.9  THD + Noise
    10. 7.10 Power Supply Rejection Ratio (PSRR)
    11. 7.11 Charge Injection
    12. 7.12 Bandwidth
    13. 7.13 Off Isolation
    14. 7.14 Crosstalk
  9. 8 Detailed Description
    1. 8.1 Functional Block Diagram
    2. 8.2 Device Functional Modes
    3. 8.3 Feature Description
      1. 8.3.1 Beyond the Supply
      2. 8.3.2 Bidirectional Operation
      3. 8.3.3 Over Temperature Protection
      4. 8.3.4 Power-Off Protection
      5. 8.3.5 1.8 V Logic Compatible Inputs
      6. 8.3.6 Fail-Safe Logic
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Audio Amplifier Switching
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Packaging Option Addendum
    2. 11.2 Tape and Reel Information
    3. 11.3 Mechanical Data

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • YBH|9
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)(2)
MIN MAX UNIT
VDD to GND  Supply voltage -0.5 6 V
VSEL to GND Logic control input pin voltage -0.5 6 V
VS or VD to GND Source or drain voltage (Sx, Dx) to ground -13 13 V
VS to VD or VS Source to drain or source (same channel)(4) -15 15 V
Source to drain or source (separate channel)(3) -24 24 V
ISEL Logic control input pin current -30 30 mA
IS or ID (CONT) Source or drain continuous current (Sx, Dx) IDC + 10 %(5) mA
TA Ambient temperature -55 150 °C
Tstg Storage temperature -65 150 °C
TJ Junction temperature 150 °C
Ptot Total power dissipation(8) 750 mW
(1) Operation outside the Absolute Maximum Rating may cause permanent device damage. Absolute Maximum Rating do not imply functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Condition. If used outside the Recommended Operating Condition but within the Absolute Maximum Rating, the device may not be fully functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.
(2) All voltages are with respect to ground, unless otherwise specified.
(3) Pins are diode-clamped to the power-supply rails. Over voltage signals must be voltage and current limited to maximum ratings.
(4) Maximum voltage between source and drain pins within the same channel. For example: S1A to D1 or S1A to S1B
(5) Refer to Source or Drain Continuous Current table for IDC specifications.
(6) For WCSP package: Ptot derates linearly above TA = 70°C by 9.4mW/°C.