SLVSDO6D August   2017  – December 2024 TPS1H000-Q1

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Typical Characteristics
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Current Limit
      2. 6.3.2 DELAY Pin Configuration
        1. 6.3.2.1 Holding Mode
        2. 6.3.2.2 Latch-Off Mode
        3. 6.3.2.3 Auto-Retry Mode
      3. 6.3.3 Standalone Operation
      4. 6.3.4 Fault Truth Table
      5. 6.3.5 Full Diagnostics
        1. 6.3.5.1 Short-to-GND and Overload Detection
        2. 6.3.5.2 Open-Load Detection
          1. 6.3.5.2.1 Output On
          2. 6.3.5.2.2 Output Off
        3. 6.3.5.3 Short-to-Battery Detection
        4. 6.3.5.4 Thermal Fault Detection
          1. 6.3.5.4.1 Thermal Shutdown
          2. 6.3.5.4.2 Thermal Swing
          3. 6.3.5.4.3 Fault Report Holding
      6. 6.3.6 Full Protections
        1. 6.3.6.1 UVLO Protection
        2. 6.3.6.2 Inductive Load Switching Off Clamp
        3. 6.3.6.3 Loss-of-GND Protection
        4. 6.3.6.4 Loss-of-Power-Supply Protection
        5. 6.3.6.5 Reverse-Current Protection
        6. 6.3.6.6 MCU I/O Protection
    4. 6.4 Device Functional Modes
      1. 6.4.1 Working Modes
        1. 6.4.1.1 Normal Mode
        2. 6.4.1.2 Standby Mode
        3. 6.4.1.3 Standby Mode With Diagnostics
  8. Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  10. Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Electrostatic Discharge Caution

TPS1H000-Q1 This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.