SLVSDO6D August   2017  – December 2024 TPS1H000-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Current Limit
      2. 6.3.2 DELAY Pin Configuration
        1. 6.3.2.1 Holding Mode
        2. 6.3.2.2 Latch-Off Mode
        3. 6.3.2.3 Auto-Retry Mode
      3. 6.3.3 Standalone Operation
      4. 6.3.4 Fault Truth Table
      5. 6.3.5 Full Diagnostics
        1. 6.3.5.1 Short-to-GND and Overload Detection
        2. 6.3.5.2 Open-Load Detection
          1. 6.3.5.2.1 Output On
          2. 6.3.5.2.2 Output Off
        3. 6.3.5.3 Short-to-Battery Detection
        4. 6.3.5.4 Thermal Fault Detection
          1. 6.3.5.4.1 Thermal Shutdown
          2. 6.3.5.4.2 Thermal Swing
          3. 6.3.5.4.3 Fault Report Holding
      6. 6.3.6 Full Protections
        1. 6.3.6.1 UVLO Protection
        2. 6.3.6.2 Inductive Load Switching Off Clamp
        3. 6.3.6.3 Loss-of-GND Protection
        4. 6.3.6.4 Loss-of-Power-Supply Protection
        5. 6.3.6.5 Reverse-Current Protection
        6. 6.3.6.6 MCU I/O Protection
    4. 6.4 Device Functional Modes
      1. 6.4.1 Working Modes
        1. 6.4.1.1 Normal Mode
        2. 6.4.1.2 Standby Mode
        3. 6.4.1.3 Standby Mode With Diagnostics
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.4.1 Layout Guidelines

To prevent thermal shutdown, TJ must be less than 175°C. If the output current is very high, the power dissipation may be large. However, the PCB layout is very important. Good PCB design can optimize heat transfer, which is absolutely essential for the long-term reliability of the device.

  • Maximize the copper coverage on the PCB to increase the thermal conductivity of the board. The major heat-flow path from the package to the ambient is through the copper on the PCB. Maximum copper is extremely important when there are not any heat sinks attached to the PCB on the other side of the board opposite the package.
  • Add as many thermal vias as possible directly under the package thermal pad to optimize the thermal conductivity of the board.
  • All thermal vias should either be plated shut or plugged and capped on both sides of the board to prevent solder voids. To ensure reliability and performance, the solder coverage should be at least 85%.