SLUSDV7B October   2019  – March 2021

PRODUCTION DATA

1. Features
2. Applications
3. Description
4. Revision History
5. Pin Configuration and Function
6. Specifications
7. Parameter Measurement Information
8. Detailed Description
1. 8.1 Overview
2. 8.2 Functional Block Diagram
3. 8.3 Feature Description
1. 8.3.1 Power Supply
2. 8.3.2 Input Stage
3. 8.3.3 Output Stage
4. 8.3.4 Protection Features
4. 8.4 Device Functional Modes
9. Application and Implementation
1. 9.1 Application Information
2. 9.2 Typical Application
10. 10Power Supply Recommendations
11. 11Layout
12. 12Mechanical, Packaging, and Orderable Information

#### Package Options

Refer to the PDF data sheet for device specific package drawings

• DWY|6

## 6.8 Safety Limiting Values

PARAMETERTEST CONDITIONSMINTYPMAXUNIT
ISSafety input, output, or supply currentRqJA = 126°C/W, VI = 15 V, TJ = 150°C, TA = 25°C50mA
RqJA = 126°C/W, VI = 30 V, TJ = 150°C, TA = 25°C25
PSSafety input, output, or total powerRqJA = 126°C/W, TJ = 150°C, TA = 25°C750mW
TSMaximum safety temperature(1)150°C
The maximum safety temperature, TS, has the same value as the maximum junction temperature, TJ , specified for the device. The IS and PS parameters represent the safety current and safety power respectively. The maximum limits of IS and PS should not be exceeded. These limits vary with the ambient temperature, TA. The junction-to-air thermal resistance, RqJA, in the Thermal Information table is that of a device installed on a high-K test board for leaded surface-mount packages. Use these equations to calculate the value for each parameter: TJ = TA + RqJA ´ P, where P is the power dissipated in the device. TJ(max) = TS = TA + RqJA ´ PS, where TJ(max) is the maximum allowed junction temperature. PS = IS ´ VI , where VI is the maximum supply voltage.