SBOS394E November   2007  – July 2019 VCA824

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Differential Equalizer
      2.      Differential Equalization of an RC Load
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics: VS = ±5 V
    6. 7.6 Typical Characteristics: VS = ±5 V, AVMAX = 2 V/V
    7. 7.7 Typical Characteristics: VS = ±5 V, AVMAX = 10 V/V
    8. 7.8 Typical Characteristics: VS = ±5 V, AVMAX = 40 V/V
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
      1. 8.4.1 Maximum Gain Of Operation
      2. 8.4.2 Output Current And Voltage
      3. 8.4.3 Input Voltage Dynamic Range
      4. 8.4.4 Output Voltage Dynamic Range
      5. 8.4.5 Bandwidth
      6. 8.4.6 Offset Adjustment
      7. 8.4.7 Noise
      8. 8.4.8 Input and ESD Protection
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Difference Amplifier
      2. 9.1.2 Differential Equalizer
      3. 9.1.3 Differential Cable Equalizer
      4. 9.1.4 Voltage-Controlled Lowpass Filter [application sub]
      5. 9.1.5 Wideband Variable Gain Amplifier Operation
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Thermal Considerations
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Development Support
        1. 12.1.1.1 Demonstration Boards
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.4 Thermal Information

THERMAL METRIC(1) VCA824 UNIT
D (SOIC) DGS (VSSOP)
14 PINS 10 PINS
RθJA Junction-to-ambient thermal resistance 90.3 173.1 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 49.8 46.6 °C/W
RθJB Junction-to-board thermal resistance 44.9 94.3 °C/W
ψJT Junction-to-top characterization parameter 13.8 2.2 °C/W
ψJB Junction-to-board characterization parameter 44.6 92.7 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance n/a n/a °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.