SWRS170I August   2014  – October 2017 WL1807MOD , WL1837MOD

PRODUCTION DATA.  

  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2Revision History
  3. 3Device Comparison
    1. 3.1 Related Products
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Attributes
  5. 5Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  External Digital Slow Clock Requirements
    5. 5.5  Thermal Resistance Characteristics for MOC 100-Pin Package
    6. 5.6  WLAN Performance: 2.4-GHz Receiver Characteristics
    7. 5.7  WLAN Performance: 2.4-GHz Transmitter Power
    8. 5.8  WLAN Performance: 5-GHz Receiver Characteristics
    9. 5.9  WLAN Performance: 5-GHz Transmitter Power
    10. 5.10 WLAN Performance: Currents
    11. 5.11 Bluetooth Performance: BR, EDR Receiver Characteristics—In-Band Signals
    12. 5.12 Bluetooth Performance: Transmitter, BR
    13. 5.13 Bluetooth Performance: Transmitter, EDR
    14. 5.14 Bluetooth Performance: Modulation, BR
    15. 5.15 Bluetooth Performance: Modulation, EDR
    16. 5.16 Bluetooth low energy Performance: Receiver Characteristics - In-Band Signals
    17. 5.17 Bluetooth low energy Performance: Transmitter Characteristics
    18. 5.18 Bluetooth low energy Performance: Modulation Characteristics
    19. 5.19 Bluetooth BR and EDR Dynamic Currents
    20. 5.20 Bluetooth low energy Currents
    21. 5.21 Timing and Switching Characteristics
      1. 5.21.1 Power Management
        1. 5.21.1.1 Block Diagram - Internal DC-DCs
      2. 5.21.2 Power-Up and Shut-Down States
      3. 5.21.3 Chip Top-level Power-Up Sequence
      4. 5.21.4 WLAN Power-Up Sequence
      5. 5.21.5 Bluetooth-Bluetooth low energy Power-Up Sequence
      6. 5.21.6 WLAN SDIO Transport Layer
        1. 5.21.6.1 SDIO Timing Specifications
        2. 5.21.6.2 SDIO Switching Characteristics - High Rate
      7. 5.21.7 HCI UART Shared-Transport Layers for All Functional Blocks (Except WLAN)
        1. 5.21.7.1 UART 4-Wire Interface - H4
      8. 5.21.8 Bluetooth Codec-PCM (Audio) Timing Specifications
  6. 6Detailed Description
    1. 6.1 WLAN Features
    2. 6.2 Bluetooth Features
    3. 6.3 Bluetooth low energy Features
    4. 6.4 Device Certification
      1. 6.4.1 FCC Certification and Statement
      2. 6.4.2 Innovation, Science, and Economic Development Canada (ISED)
      3. 6.4.3 ETSI/CE
      4. 6.4.4 MIC Certification
    5. 6.5 Module Markings
    6. 6.6 Test Grades
    7. 6.7 End Product Labeling
    8. 6.8 Manual Information to the End User
  7. 7Applications, Implementation, and Layout
    1. 7.1 Application Information
      1. 7.1.1 Typical Application - WL1837MOD Reference Design
      2. 7.1.2 Design Recommendations
      3. 7.1.3 RF Trace and Antenna Layout Recommendations
      4. 7.1.4 Module Layout Recommendations
      5. 7.1.5 Thermal Board Recommendations
      6. 7.1.6 Baking and SMT Recommendations
        1. 7.1.6.1 Baking Recommendations
        2. 7.1.6.2 SMT Recommendations
  8. 8Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Third-Party Products Disclaimer
      2. 8.1.2 Development Support
        1. 8.1.2.1 Tools and Software
      3. 8.1.3 Device Support Nomenclature
    2. 8.2 Related Links
    3. 8.3 Community Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  9. 9Mechanical, Packaging, and Orderable Information
    1. 9.1 TI Module Mechanical Outline
    2. 9.2 Tape and Reel Information
      1. 9.2.1 Tape and Reel Specification
      2. 9.2.2 Packing Specification
        1. 9.2.2.1 Reel Box
        2. 9.2.2.2 Shipping Box
    3. 9.3 Packaging Information

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • MOC|100
Thermal pad, mechanical data (Package|Pins)

Mechanical, Packaging, and Orderable Information

TI Module Mechanical Outline

Figure 9-1 shows the mechanical outline for the device.

WL1807MOD WL1837MOD WG7835_37_T0_Module_mechanical_141105.gif Figure 9-1 TI Module Mechanical Outline

Table 9-1 lists the dimensions for the mechanical outline of the device.

NOTE

The TI module weighs 0.684 g typical.

Table 9-1 Dimensions for TI Module Mechanical Outline

MARKING MIN (mm) NOM (mm) MAX (mm) MARKING MIN (mm) NOM (mm) MAX (mm)
L (body size) 13.20 13.30 13.40 c2 0.65 0.75 0.85
W (body size) 13.30 13.40 13.50 c3 1.15 1.25 1.35
T (thickness) 1.80 1.90 2.00 d1 0.90 1.00 1.10
a1 0.30 0.40 0.50 d2 0.90 1.00 1.10
a2 0.60 0.70 0.80 e1 1.30 1.40 1.50
a3 0.65 0.75 0.85 e2 1.30 1.40 1.50
b1 0.20 0.30 0.40 e3 1.15 1.25 1.35
b2 0.65 0.75 0.85 e4 1.20 1.30 1.40
b3 1.20 1.30 1.40 e5 1.00 1.10 1.20
c1 0.20 0.30 0.40 e6 1.00 1.10 1.20

Tape and Reel Information

Emboss taping specification for MOC 100 pin.

Tape and Reel Specification

WL1807MOD WL1837MOD tape_spec_swrs170.gif Figure 9-2 Tape Specification

Table 9-2 Dimensions for Tape Specification

ITEM W E F P Po P2 Do T Ao Bo Ko
DIMENSION (mm) 24.00 (±0.30) 1.75 (±0.10) 11.50 (±0.10) 20.00 (±0.10) 4.00 (±0.10) 2.00 (±0.10) 2.00 (±0.10) 0.35 (±0.05) 13.80 (±0.10) 13.80 (±0.10) 2.50 (±0.10)
WL1807MOD WL1837MOD reel_spec_swrs170.gif Figure 9-3 Reel Specification

Table 9-3 Dimensions for Reel Specification

ITEM W1 W2
DIMENSION (mm) 24.4 (+1.5, –0.5) 30.4 (maximum)

Packing Specification

Reel Box

The reel is packed in a moisture barrier bag fastened by heat-sealing. Each moisture-barrier bag is packed into a reel box, as shown in Figure 9-4.

WL1807MOD WL1837MOD inner_box_dim_swrs170.gif Figure 9-4 Reel Box

The reel box is made of corrugated fiberboard.

Shipping Box

Figure 9-5 shows a typical shipping box. If the shipping box has excess space, filler (such as cushion) is added.

NOTE

The size of the shipping box may vary depending on the number of reel boxes packed.

WL1807MOD WL1837MOD outer_box_dim_swrs170.gif Figure 9-5 Shipping Box

The shipping box is made of corrugated fiberboard.

Packaging Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

PACKAGE OPTION ADDENDUM

Orderable Device Status(1) Package Type Package Drawing Pins Package Qty Eco Plan(2) Lead/Ball Finish MSL Peak Temp (°C) (3) Op Temp (°C)
WL1807MODGIMOCR ACTIVE QFM MOC 100 1200 Green NiPdAu 250 –40 to 85
WL1807MODGIMOCT ACTIVE QFM MOC 100 250 Green NiPdAu 250 –40 to 85
WL1837MODGIMOCR ACTIVE QFM MOC 100 1200 Green NiPdAu 250 –40 to 85
WL1837MODGIMOCT ACTIVE QFM MOC 100 250 Green NiPdAu 250 –40 to 85
  1. The marketing status values are defined as follows:
    ACTIVE: Product device recommended for new designs.
    LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
    NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
    PRE_PROD Unannounced device, not in production, not available for mass market, nor on the web, samples not available.
    PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
    OBSOLETE: TI has discontinued the production of the device.
  2. RoHS Compliance: This product has an RoHS exemption for one or more subcomponent(s). The product is otherwise considered Pb-Free (RoHS compatible) as defined above.
  3. MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
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  4. Important Information and Disclaimer: The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.