Refer to the PDF data sheet for device specific package drawings
Figure 9-1 shows the mechanical outline for the device.
Table 9-1 lists the dimensions for the mechanical outline of the device.
The TI module weighs 0.684 g typical.
|MARKING||MIN (mm)||NOM (mm)||MAX (mm)||MARKING||MIN (mm)||NOM (mm)||MAX (mm)|
|L (body size)||13.20||13.30||13.40||c2||0.65||0.75||0.85|
|W (body size)||13.30||13.40||13.50||c3||1.15||1.25||1.35|
Emboss taping specification for MOC 100 pin.
|DIMENSION (mm)||24.00 (±0.30)||1.75 (±0.10)||11.50 (±0.10)||20.00 (±0.10)||4.00 (±0.10)||2.00 (±0.10)||2.00 (±0.10)||0.35 (±0.05)||13.80 (±0.10)||13.80 (±0.10)||2.50 (±0.10)|
|DIMENSION (mm)||24.4 (+1.5, –0.5)||30.4 (maximum)|
The reel is packed in a moisture barrier bag fastened by heat-sealing. Each moisture-barrier bag is packed into a reel box, as shown in Figure 9-4.
The reel box is made of corrugated fiberboard.
Figure 9-5 shows a typical shipping box. If the shipping box has excess space, filler (such as cushion) is added.
The size of the shipping box may vary depending on the number of reel boxes packed.
The shipping box is made of corrugated fiberboard.
The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
|Orderable Device||Status(1)||Package Type||Package Drawing||Pins||Package Qty||Eco Plan(2)||Lead/Ball Finish||MSL Peak Temp (°C) (3)||Op Temp (°C)|
|WL1807MODGIMOCR||ACTIVE||QFM||MOC||100||1200||Green||NiPdAu||250||–40 to 85|
|WL1807MODGIMOCT||ACTIVE||QFM||MOC||100||250||Green||NiPdAu||250||–40 to 85|
|WL1837MODGIMOCR||ACTIVE||QFM||MOC||100||1200||Green||NiPdAu||250||–40 to 85|
|WL1837MODGIMOCT||ACTIVE||QFM||MOC||100||250||Green||NiPdAu||250||–40 to 85|
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