SLASEO0B July   2018  – June 2021 DAC61416 , DAC71416 , DAC81416

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Timing Diagrams
    8. 7.8 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Digital-to-Analog Converter (DAC) Architecture
        1. 8.3.1.1 DAC Transfer Function
        2. 8.3.1.2 DAC Register Structure
          1. 8.3.1.2.1 DAC Register Synchronous and Asynchronous Updates
          2. 8.3.1.2.2 Broadcast DAC Register
          3. 8.3.1.2.3 Clear DAC Operation
      2. 8.3.2 Internal Reference
      3. 8.3.3 Device Reset Options
        1. 8.3.3.1 Power-on-Reset (POR)
        2. 8.3.3.2 Hardware Reset
        3. 8.3.3.3 Software Reset
      4. 8.3.4 Thermal Protection
        1. 8.3.4.1 Analog Temperature Sensor: TEMPOUT Pin
        2. 8.3.4.2 Thermal Shutdown
    4. 8.4 Device Functional Modes
      1. 8.4.1 Toggle Mode
      2. 8.4.2 Differential Mode
      3. 8.4.3 Power-Down Mode
    5. 8.5 Programming
      1. 8.5.1 Stand-Alone Operation
        1. 8.5.1.1 Streaming Mode Operation
      2. 8.5.2 Daisy-Chain Operation
      3. 8.5.3 Frame Error Checking
    6. 8.6 Register Maps
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Development Support
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Support Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • Performance
    • Specified monotonic at 16-bit resolution
    • INL: ±1 LSB maximum at 16-bit resolution
    • TUE: ±0.1% of FSR maximum
  • Integrated 2.5-V precision internal reference
    • Initial accuracy: ±2.5 mV maximum
    • Low drift: 5 ppm/°C typical
  • Flexible output configuration
    • Output range: ±2.5 V, ±5 V, ±10 V, ±20 V
      0 to 5 V, 0 to 10 V, 0 to 20 V or 0 to 40 V
    • Differential output mode
  • High drive capability: ±25 mA with 1.5 V from supply rails
  • Three dedicated A-B toggle pins for dither signal generation
  • Analog temperature output
    • Sensor gain of –4 mV/°C
  • 50-MHz SPI-compatible serial interface
    • 4-wire mode, 1.7-V to 5.5-V operation
    • Daisy-chain operation
    • CRC error check
  • Temperature range: –40°C to +125°C
  • Small package
    • 6 mm × 6 mm, 40-pin VQFN