JAJSM94B June   2021  – June 2022 DAC12DL3200

PRODUCTION DATA  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics - DC Specifications
    6. 6.6  Electrical Characteristics - Power Consumption
    7. 6.7  Electrical Characteristics - AC Specifications
    8. 6.8  Timing Requirements
    9. 6.9  Switching Characteristics
    10. 6.10 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 DAC Output Modes
        1. 7.3.1.1 NRZ Mode
        2. 7.3.1.2 RTZ Mode
        3. 7.3.1.3 RF Mode
        4. 7.3.1.4 2xRF Mode
      2. 7.3.2 DAC Output Interface
        1. 7.3.2.1 DAC Output Structure
        2. 7.3.2.2 Full-scale Current Adjustment
        3. 7.3.2.3 Example Analog Output Interfaces
      3. 7.3.3 LVDS Interface
        1. 7.3.3.1 MODE0: Two LVDS banks per channel
        2. 7.3.3.2 MODE1: One LVDS bank per channel
        3. 7.3.3.3 MODE2: Four LVDS banks, single channel mode
        4. 7.3.3.4 LVDS Interface Input Strobe
        5. 7.3.3.5 FIFO Operation
          1. 7.3.3.5.1 Using FIFO Delay Readback Values
          2. 7.3.3.5.2 FIFO Delay Handling
          3. 7.3.3.5.3 FIFO Delay and NCO Operation
          4. 7.3.3.5.4 FIFO Over/Under Flow Alarming
      4. 7.3.4 Multi-Device Synchronization (SYSREF+/-)
        1. 7.3.4.1 DACCLK Domain Synchronization
        2. 7.3.4.2 SYSREF Position Detector and Sampling Position Selection (SYSREF Windowing)
      5. 7.3.5 Alarms
    4. 7.4 Device Functional Modes
      1. 7.4.1 Direct Digital Synthesis (DDS) Mode
        1. 7.4.1.1 NCO Gain Scaling
        2. 7.4.1.2 NCO Phase Continuous Operation
        3. 7.4.1.3 Trigger Clock
    5. 7.5 Programming
      1. 7.5.1 Using the Serial Interface
        1. 7.5.1.1 SCS
        2. 7.5.1.2 SCLK
        3. 7.5.1.3 SDI
        4. 7.5.1.4 SDO
        5. 7.5.1.5 Serial Interface Operation
        6. 7.5.1.6 Streaming Mode
      2. 7.5.2 SPI Register Map
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Startup Procedure with LVDS Input
      2. 8.1.2 Startup Procedure With NCO Operation
      3. 8.1.3 Interface Test Pattern and Timing Verification
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 Power Up and Down Sequence
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  9. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 サポート・リソース
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  10. 10Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

5 Pin Configuration and Functions

GUID-20211029-SS0I-FQSJ-X8XG-FQ99FTLDRT7N-low.png ACF, 256 Ball FCBGA, Top View
Table 5-1 Pin Functions
PINI/ODESCRIPTION
NAMENO.
AGNDD14, D15, D16, E15, F15, G15, G16, K15, K16, L15, M15, N13, N14, N15, N16, P15, P16, T16—Analog supply ground, must be directly connected to DGND and VSSCLK
ALARMP14OALARM pin is asserted when an internal unmasked alarm is detected. Alarm mask is set by ALM_MASK register.
ATESTR15OAnalog test pin. Can be left disconnected if not used.
CLK+A15IDevice clock input positive terminal. There is an internal 100-Ω differential termination between CLK+ and CLK–. This input is self-biased and should be AC coupled to the clock source.
CLK–A14IDevice clock input negative terminal. See CLK+ description.
DA0+L5ILVDS bus A bit 0 data input positive terminal. There is an internal 100-Ω differential termination between DA0+ and DA0–.
DA0–M5ILVDS bus A bit 0 data input negative terminal. There is an internal 100-Ω differential termination between DA0+ and DA0–.
DA1+L6ILVDS bus A bit 1 data input positive terminal. There is an internal 100-Ω differential termination between DA1+ and DA1–.
DA1– M6 I LVDS bus A bit 1 data input negative terminal. There is an internal 100-Ω differential termination between DA1+ and DA1–.
DA10+R7ILVDS bus A bit 10 data input positive terminal. There is an internal 100-Ω differential termination between DA10+ and DA10–.
DA10–T7ILVDS bus A bit 10 data input negative terminal. There is an internal 100-Ω differential termination between DA10+ and DA10–.
DA11+R8ILVDS bus A bit 11 data input positive terminal. There is an internal 100-Ω differential termination between DA11+ and DA11–.
DA11–T8ILVDS bus A bit 11 data input negative terminal. There is an internal 100-Ω differential termination between DA11+ and DA11–.
DA2+L7ILVDS bus A bit 2 data input positive terminal. There is an internal 100-Ω differential termination between DA2+ and DA2–.
DA2–M7ILVDS bus A bit 2 data input negative terminal. There is an internal 100-Ω differential termination between DA2+ and DA2–.
DA3+L8ILVDS bus A bit 3 data input positive terminal. There is an internal 100-Ω differential termination between DA3+ and DA3–.
DA3–M8ILVDS bus A bit 3 data input negative terminal. There is an internal 100-Ω differential termination between DA3+ and DA3–.
DA4+N5ILVDS bus A bit 4 data input positive terminal. There is an internal 100-Ω differential termination between DA4+ and DA4–.
DA4–P5ILVDS bus A bit 4 data input negative terminal. There is an internal 100-Ω differential termination between DA4+ and DA4–.
DA5+N6ILVDS bus A bit 5 data input positive terminal. There is an internal 100-Ω differential termination between DA5+ and DA5–.
DA5–P6ILVDS bus A bit 5 data input negative terminal. There is an internal 100-Ω differential termination between DA5+ and DA5–.
DA6+N7ILVDS bus A bit 6 data input positive terminal. There is an internal 100-Ω differential termination between DA6+ and DA6–.
DA6–P7ILVDS bus A bit 6 data input negative terminal. There is an internal 100-Ω differential termination between DA6+ and DA6–.
DA7+N8ILVDS bus A bit 7 data input positive terminal. There is an internal 100-Ω differential termination between DA7+ and DA7–.
DA7–P8ILVDS bus A bit 7 data input negative terminal. There is an internal 100-Ω differential termination between DA7+ and DA7–.
DA8+R5ILVDS bus A bit 8 data input positive terminal. There is an internal 100-Ω differential termination between DA8+ and DA8–.
DA8–T5ILVDS bus A bit 8 data input negative terminal. There is an internal 100-Ω differential termination between DA8+ and DA8–.
DA9+R6ILVDS bus A bit 9 data input positive terminal. There is an internal 100-Ω differential termination between DA9+ and DA9–.
DA9–T6ILVDS bus A bit 9 data input negative terminal. There is an internal 100-Ω differential termination between DA9+ and DA9–.
DACLK+K8ILVDS bus A data clock positive terminal. A DDR data clock is applied to DACLK+/– to capture the DA[11:0]+/– and DASTR+/– inputs. There is an internal 100-Ω differential termination between DACLK+ and DACLK–.
DACLK–K7ILVDS bus A data clock negative terminal. See DACLK+ description.
DASTR+K6ILVDS bus A strobe positive terminal. DASTR+/– is used to synchronize the input pointer of the interface FIFO by marking a specific sample on each LVDS bus. DAx+/– can optionally be used for this purpose instead to reduce the number of LVDS pairs, where x = (12 - LVDS_RESOLUTION). There is an internal 100-Ω differential termination between DASTR+ and DASTR–.
DASTR–K5ILVDS bus A strobe negative terminal. See DASTR+ description.
DB0+K1ILVDS bus B bit 0 data input positive terminal. There is an internal 100-Ω differential termination between DB0+ and DB0–.
DB0–L1ILVDS bus B bit 0 data input negative terminal. There is an internal 100-Ω differential termination between DB0+ and DB0–.
DB1+L2ILVDS bus B bit 1 data input positive terminal. There is an internal 100-Ω differential termination between DB1+ and DB1–.
DB1– M2 I LVDS bus B bit 1 data input negative terminal. There is an internal 100-Ω differential termination between DB1+ and DB1–.
DB10+R3ILVDS bus B bit 10 data input positive terminal. There is an internal 100-Ω differential termination between DB10+ and DB10–.
DB10–T3ILVDS bus B bit 10 data input negative terminal. There is an internal 100-Ω differential termination between DB10+ and DB10–.
DB11+R4ILVDS bus B bit 11 data input positive terminal. There is an internal 100-Ω differential termination between DB11+ and DB11–.
DB11–T4ILVDS bus B bit 11 data input negative terminal. There is an internal 100-Ω differential termination between DB11+ and DB11–.
DB2+L3ILVDS bus B bit 2 data input positive terminal. There is an internal 100-Ω differential termination between DB2+ and DB2–.
DB2–M3ILVDS bus B bit 2 data input negative terminal. There is an internal 100-Ω differential termination between DB2+ and DB2–.
DB3+L4ILVDS bus B bit 3 data input positive terminal. There is an internal 100-Ω differential termination between DB3+ and DB3–.
DB3–M4ILVDS bus B bit 3 data input negative terminal. There is an internal 100-Ω differential termination between DB3+ and DB3–.
DB4+M1ILVDS bus B bit 4 data input positive terminal. There is an internal 100-Ω differential termination between DB4+ and DB4–.
DB4–N1ILVDS bus B bit 4 data input negative terminal. There is an internal 100-Ω differential termination between DB4+ and DB4–.
DB5+N2ILVDS bus B bit 5 data input positive terminal. There is an internal 100-Ω differential termination between DB5+ and DB5–.
DB5–P2ILVDS bus B bit 5 data input negative terminal. There is an internal 100-Ω differential termination between DB5+ and DB5–.
DB6+N3ILVDS bus B bit 6 data input positive terminal. There is an internal 100-Ω differential termination between DB6+ and DB6–.
DB6–P3ILVDS bus B bit 6 data input negative terminal. There is an internal 100-Ω differential termination between DB6+ and DB6–.
DB7+N4ILVDS bus B bit 7 data input positive terminal. There is an internal 100-Ω differential termination between DB7+ and DB7–.
DB7–P4ILVDS bus B bit 7 data input negative terminal. There is an internal 100-Ω differential termination between DB7+ and DB7–.
DB8+P1ILVDS bus B bit 8 data input positive terminal. There is an internal 100-Ω differential termination between DB8+ and DB8–.
DB8–R1ILVDS bus B bit 8 data input negative terminal. There is an internal 100-Ω differential termination between DB8+ and DB8–.
DB9+R2ILVDS bus B bit 9 data input positive terminal. There is an internal 100-Ω differential termination between DB9+ and DB9–.
DB9–T2ILVDS bus B bit 9 data input negative terminal. There is an internal 100-Ω differential termination between DB9+ and DB9–.
DBCLK+K4ILVDS bus B data clock positive terminal. A DDR data clock is applied to DBCLK+/– to capture the DB[11:0]+/– and DBSTR+/– inputs. There is an internal 100-Ω differential termination between DBCLK+ and DBCLK–.
DBCLK–K3ILVDS bus B data clock negative terminal. See DBCLK+ description.
DBSTR+J2ILVDS bus B strobe positive terminal. DBSTR+/– is used to synchronize the input pointer of the interface FIFO by marking a specific sample on each LVDS bus. DBx+/– can optionally be used for this purpose instead to reduce the number of LVDS pairs, where x = (12 - LVDS_RESOLUTION).There is an internal 100-Ω differential termination between DBSTR+ and DBSTR–.
DBSTR–J1ILVDS bus B strobe negative terminal. See DBSTR+ description.
DC0+F5ILVDS bus C bit 0 data input positive terminal. There is an internal 100-Ω differential termination between DC0+ and DC0–.
DC0–E5ILVDS bus C bit 0 data input negative terminal. There is an internal 100-Ω differential termination between DC0+ and DC0–.
DC1+F6ILVDS bus C bit 1 data input positive terminal. There is an internal 100-Ω differential termination between DC1+ and DC1–.
DC1– E6 I LVDS bus C bit 1 data input negative terminal. There is an internal 100-Ω differential termination between DC1+ and DC1–.
DC10+B7ILVDS bus C bit 10 data input positive terminal. There is an internal 100-Ω differential termination between DC10+ and DC10–.
DC10–A7ILVDS bus C bit 10 data input negative terminal. There is an internal 100-Ω differential termination between DC10+ and DC10–.
DC11+B8ILVDS bus C bit 11 data input positive terminal. There is an internal 100-Ω differential termination between DC11+ and DC11–.
DC11–A8ILVDS bus C bit 11 data input negative terminal. There is an internal 100-Ω differential termination between DC11+ and DC11–.
DC2+F7ILVDS bus C bit 2 data input positive terminal. There is an internal 100-Ω differential termination between DC2+ and DC2–.
DC2–E7ILVDS bus C bit 2 data input negative terminal. There is an internal 100-Ω differential termination between DC2+ and DC2–.
DC3+F8ILVDS bus C bit 3 data input positive terminal. There is an internal 100-Ω differential termination between DC3+ and DC3–.
DC3–E8ILVDS bus C bit 3 data input negative terminal. There is an internal 100-Ω differential termination between DC3+ and DC3–.
DC4+D5ILVDS bus C bit 4 data input positive terminal. There is an internal 100-Ω differential termination between DC4+ and DC4–.
DC4–C5ILVDS bus C bit 4 data input negative terminal. There is an internal 100-Ω differential termination between DC4+ and DC4–.
DC5+D6ILVDS bus C bit 5 data input positive terminal. There is an internal 100-Ω differential termination between DC5+ and DC5–.
DC5–C6ILVDS bus C bit 5 data input negative terminal. There is an internal 100-Ω differential termination between DC5+ and DC5–.
DC6+D7ILVDS bus C bit 6 data input positive terminal. There is an internal 100-Ω differential termination between DC6+ and DC6–.
DC6–C7ILVDS bus C bit 6 data input negative terminal. There is an internal 100-Ω differential termination between DC6+ and DC6–.
DC7+D8ILVDS bus C bit 7 data input positive terminal. There is an internal 100-Ω differential termination between DC7+ and DC7–.
DC7–C8ILVDS bus C bit 7 data input negative terminal. There is an internal 100-Ω differential termination between DC7+ and DC7–.
DC8+B5ILVDS bus C bit 8 data input positive terminal. There is an internal 100-Ω differential termination between DC8+ and DC8–.
DC8–A5ILVDS bus C bit 8 data input negative terminal. There is an internal 100-Ω differential termination between DC8+ and DC8–.
DC9+B6ILVDS bus C bit 9 data input positive terminal. There is an internal 100-Ω differential termination between DC9+ and DC9–.
DC9–A6ILVDS bus C bit 9 data input negative terminal. There is an internal 100-Ω differential termination between DC9+ and DC9–.
DCCLK+G8ILVDS bus C data clock positive terminal. A DDR data clock is applied to DCCLK+/– to capture the DC[11:0]+/– and DCSTR+/– inputs. There is an internal 100-Ω differential termination between DCCLK+ and DCCLK–.
DCCLK–G7ILVDS bus C data clock negative terminal. See DCCLK+ description.
DCSTR+G6ILVDS bus C strobe positive terminal. DCSTR+/– is used to synchronize the input pointer of the interface FIFO by marking a specific sample on each LVDS bus. DCx+/– can optionally be used for this purpose instead to reduce the number of LVDS pairs, where x = (12 - LVDS_RESOLUTION). There is an internal 100-Ω differential termination between DCSTR+ and DCSTR–.
DCSTR–G5ILVDS bus C strobe negative terminal. See DCSTR+ description.
DD0+G1ILVDS bus D bit 0 data input positive terminal. There is an internal 100-Ω differential termination between DD0+ and DD0–.
DD0–F1ILVDS bus D bit 0 data input negative terminal. There is an internal 100-Ω differential termination between DD0+ and DD0–.
DD1+F2ILVDS bus D bit 1 data input positive terminal. There is an internal 100-Ω differential termination between DD1+ and DD1–.
DD1– E2 I LVDS bus D bit 1 data input negative terminal. There is an internal 100-Ω differential termination between DD1+ and DD1–.
DD10+B3ILVDS bus D bit 10 data input positive terminal. There is an internal 100-Ω differential termination between DD10+ and DD10–.
DD10–A3ILVDS bus D bit 10 data input negative terminal. There is an internal 100-Ω differential termination between DD10+ and DD10–.
DD11+B4ILVDS bus D bit 11 data input positive terminal. There is an internal 100-Ω differential termination between DD11+ and DD11–.
DD11–A4ILVDS bus D bit 11 data input negative terminal. There is an internal 100-Ω differential termination between DD11+ and DD11–.
DD2+F3ILVDS bus D bit 2 data input positive terminal. There is an internal 100-Ω differential termination between DD2+ and DD2–.
DD2–E3ILVDS bus D bit 2 data input negative terminal. There is an internal 100-Ω differential termination between DD2+ and DD2–.
DD3+F4ILVDS bus D bit 3 data input positive terminal. There is an internal 100-Ω differential termination between DD3+ and DD3–.
DD3–E4ILVDS bus D bit 3 data input negative terminal. There is an internal 100-Ω differential termination between DD3+ and DD3–.
DD4+E1ILVDS bus D bit 4 data input positive terminal. There is an internal 100-Ω differential termination between DD4+ and DD4–.
DD4–D1ILVDS bus D bit 4 data input negative terminal. There is an internal 100-Ω differential termination between DD4+ and DD4–.
DD5+D2ILVDS bus D bit 5 data input positive terminal. There is an internal 100-Ω differential termination between DD5+ and DD5–.
DD5–C2ILVDS bus D bit 5 data input negative terminal. There is an internal 100-Ω differential termination between DD5+ and DD5–.
DD6+D3ILVDS bus D bit 6 data input positive terminal. There is an internal 100-Ω differential termination between DD6+ and DD6–.
DD6–C3ILVDS bus D bit 6 data input negative terminal. There is an internal 100-Ω differential termination between DD6+ and DD6–.
DD7+D4ILVDS bus D bit 7 data input positive terminal. There is an internal 100-Ω differential termination between DD7+ and DD7–.
DD7–C4ILVDS bus D bit 7 data input negative terminal. There is an internal 100-Ω differential termination between DD7+ and DD7–.
DD8+C1ILVDS bus D bit 8 data input positive terminal. There is an internal 100-Ω differential termination between DD8+ and DD8–.
DD8–B1ILVDS bus D bit 8 data input negative terminal. There is an internal 100-Ω differential termination between DD8+ and DD8–.
DD9+B2ILVDS bus D bit 9 data input positive terminal. There is an internal 100-Ω differential termination between DD9+ and DD9–.
DD9–A2ILVDS bus D bit 9 data input negative terminal. There is an internal 100-Ω differential termination between DD9+ and DD9–.
DDCLK+G4ILVDS bus D data clock positive terminal. A DDR data clock is applied to DDCLK+/– to capture the DD[11:0]+/– and DDSTR+/– inputs. There is an internal 100-Ω differential termination between DDCLK+ and DDCLK–.
DDCLK–G3ILVDS bus D data clock negative terminal. See DDCLK+ description.
DDSTR+H2ILVDS bus D strobe positive terminal. DDSTR+/– is used to synchronize the input pointer of the interface FIFO by marking a specific sample on each LVDS bus. DDx+/– can optionally be used for this purpose instead to reduce the number of LVDS pairs, where x = (12 - LVDS_RESOLUTION). There is an internal 100-Ω differential termination between DDSTR+ and DDSTR–.
DDSTR–H1ILVDS bus D strobe negative terminal. See DDSTR+ description.
DGNDA1, A9, B9, D10, E9, F10, G2, G9, H10, H5, H6, H7, H8, J3, J4, J9, K10, K2, L9, M10, N9, T1—Digital supply ground, must be directly connected to AGND and VSSCLK
EXTIOT15OReference voltage output. Requires a 0.1 μF decoupling capacitor to AGND.
NCOBANKSELP11IUsed to select the NCO bank updated by NCOSEL[0:3] inputs (0=A, 1=B). It is also possible to update both banks at once, in which case NCOBANKSEL can be used as a 5th bit to effectively have 32 different NCO accumulators. Latched by TRIGCLK.

Internal pulldown.

NCOSEL0T9IBit 0 of NCOSEL. Internal pulldown.
NCOSEL1R9IBit 1 of NCOSEL. Internal pulldown.
NCOSEL2T10IBit 2 of NCOSEL. Internal pulldown.
NCOSEL3R10I

Bit 3 of NCOSEL. Internal pulldown.

RBIASR16OFull-scale output current bias is set by the resistor tied from this terminal to AGND. A 3.6-kΩ resistor is expected for 20.5 mA full scale output with default settings. The full-scale output current can be adjusted using the SPI interface by programming the COARSE_CUR_A/B and FINE_CUR_A/B register settings.
RESETT12IDevice reset input, active low. Must be toggled after power up and application of a stable clock. Internal pullup.
SCLKT13ISerial programming interface (SPI) clock input. Internal pulldown.
SCST14ISerial programming interface (SPI) device select input, active low. Internal pullup.
SDIR14ISerial programming interface (SPI) data input. Internal pulldown.
SDOR13OSerial programming interface (SPI) data output. High-Z when not outputting SPI data.
SLEEPR12IDevice sleep control. The device changes to the mode specified by the SLEEP_CFG register when high. Internal pulldown.
SYNCR11I

Allows data LSB to be used as the LVDS sync input. Internal pullup. Has SPI register override: LSB_SYNC.

SYSREF+A11ISystem timing reference (SYSREF) input positive terminal. This input is used to synchronize internal clock dividers and the LVDS interface FIFO output pointer. SYSREF+/– and data interface strobes must be used to achieve deterministic latency through the device. There is an internal 100-Ω differential termination between SYSREF+ and SYSREF–. This input is self-biased when AC coupled.
SYSREF–A12ISystem timing reference (SYSREF) input negative terminal. See SYSREF+ description.
SCAN_ENP13IThis pin is used for factory testing. Connect to ground for normal operation. Internal pulldown.
TRIGCLKP12OTrigger clock output. Rising edge latches NCOBANKSEL and NCOSEL[3:0].
TXENABLET11ITransmit enable active high input. This pin must be enabled using register TXEN_SEL. The DAC output is forced to midcode (0x0000 in 2's complement) when transmission is disabled. Internal pullup.
VDDAH15, J15I1.0-V supply voltage for internal reference. Must be separate from VDDDIG for best performance.
VDDA18AJ16I1.8-V supply voltage for DAC channel A. Can be combined with VDDA18B, but may degrade channel-to-channel crosstalk (XTALK).
VDDA18BH16I1.8-V supply voltage for DAC channel B. Can be combined with VDDA18A, but may degrade channel-to-channel crosstalk (XTALK).
VDDCLK10D13, F13, H13, J13, L13I1.0-V supply voltage for internal sampling clock distribution path. Noise or spurs on this supply may degrade phase noise performance. Recommended to separate from VDDDIG and VDDA for best performance.
VDDCLK18B14, B15I1.8-V supply voltage for clock (CLK+/–) input buffer. Noise or spurs on this supply may degrade phase noise performance.
VDDDIGD9, E10, F9, G10, H3, H4, H9, J10, J5, J6, J7, J8, K9, L10, M9, N10I1.0-V supply voltage for digital block and LVDS input receivers. Recommended to separate from VDDA and VDDCLK for best performance.
VDDEAJ11, K11, L11, M11, N11I1.0-V supply voltage for channel A DAC encoder. Can be combined with VDDEB.
VDDEBD11, E11, F11, G11, H11I1.0-V supply voltage for channel B DAC encoder. Can be combined with VDDEA.
VDDHAFC14, C15I1.0-V supply voltage. Can be combined with VDDCLK10. Noise or spurs on this supply may degrade phase noise performance.
VDDIOP9, P10I1.8-V supply for CMOS input and output terminals.
VDDL2AJ12, J14I1.0-V supply for DAC analog latch for channel A. Separate from VDDL2B for best channel-to-channel crosstalk (XTALK). Must be separated from VDDDIG for best performance.
VDDL2BH12, H14I1.0-V supply for DAC analog latch for channel B. Separate from VDDL2A for best channel-to-channel crosstalk (XTALK). Must be separated from VDDDIG for best performance.
VDDSYS18C11, C12I1.8-V supply voltage for SYSREF (SYSREF+/–) input buffer. Can be combined with VDDCLK18 when SYSREF is disabled during normal operation. This supply should be separate from VDDCLK18 when SYSREF is run continuously during operation to avoid noise and spur coupling and reduced phase noise performance.
VEEAM18L14, M14I–1.8-V supply voltage for DAC current source bias for channel A. Can be combined with VEEBM18, but may degrade channel-to-channel crosstalk (XTALK).
VEEBM18E14, F14I–1.8-V supply voltage for DAC current source bias for channel B. Can be combined with VEEAM18, but may degrade channel-to-channel crosstalk (XTALK).
VOUTA+M16ODAC channel A analog output positive terminal. Output voltage must comply with DAC compliance voltage to maintain specified performance.
VOUTA–L16ODAC channel A analog output negative terminal. Output voltage must comply with DAC compliance voltage to maintain specified performance.
VOUTB+E16ODAC channel B analog output positive terminal. Output voltage must comply with DAC compliance voltage to maintain specified performance.
VOUTB–F16ODAC channel B analog output negative terminal. Output voltage must comply with DAC compliance voltage to maintain specified performance.
VQPSC9, C10IThese pins are used for factory testing. Connect to DGND.
VSSCLKA10, A13, A16, B10, B11, B12, B13, B16, C13, C16, D12, E12, E13, G13, G14, K13, K14, M12, M13, N12—Clock supply ground, must be directly connected to AGND and DGND
VSSL2AK12, L12—DAC latch supply ground, must be directly connected to AGND, DGND, VSSCLK and VSSL2B through a common low-impedance ground plane.
VSSL2BF12, G12—DAC latch supply ground, must be directly connected to AGND, DGND, VSSCLK and VSSL2A through a common low-impedance ground plane.